The optimization of electrolytes and the material removal mechanisms for Cu electrochemical mechanical planarization(ECMP)at different pH values including 5-methyl-1H-benzotriazole(TTA),hydroxyethylidenediphosphoric a...The optimization of electrolytes and the material removal mechanisms for Cu electrochemical mechanical planarization(ECMP)at different pH values including 5-methyl-1H-benzotriazole(TTA),hydroxyethylidenediphosphoric acid(HEDP),and tribasic ammonium citrate(TAC)were investigated by electrochemical techniques,X-ray photoelectron spectrometer(XPS)analysis,nano-scratch tests,AFM measurements,and polishing of Cu-coated blanket wafers.The experimental results show that the planarization efficiency and the surface quality after ECMP obtained in alkali-based solutions are superior to that in acidic-based solutions,especially at pH=8.The optimal electrolyte compositions(mass fraction)are 6% HEDP,0.3% TTA and 3% TAC at pH=8.The main factor affecting the thickness of the oxide layer formed during ECMP process is the applied potential.The soft layer formation is a major mechanism for electrochemical enhanced mechanical abrasion.The surface topography evolution before and after electrochemical polishing(ECP)illustrates the mechanism of mechanical abrasion accelerating electrochemical dissolution,that is,the residual stress caused by the mechanical wear enhances the electrochemical dissolution rate.This understanding is beneficial for optimization of ECMP processes.展开更多
The collision and wear caused by inevitable clearance in kinematic pair have an effect on the dynamic characteristics of the mechanism.Therefore,we established the dynamic model of a 3RSR(R is the revolute joint and S...The collision and wear caused by inevitable clearance in kinematic pair have an effect on the dynamic characteristics of the mechanism.Therefore,we established the dynamic model of a 3RSR(R is the revolute joint and S is the spherical joint)parallel mechanism with spherical joint clearance based on the modified Flores contact force model and the modified Coulomb friction model using Newton-Euler method.The standard quaternion was introduced in the constraint equation,and the four-order Runge-Kutta method was adopted to solve the 3RSR dynamic model.The simulation results were compared and analyzed with the numerical results.The geometrical parameters of the worn ball socket were solved based on the Archard wear model,and the geometrical reconstruction of the worn surface was carried out.The geometric reconstruction parameters were substituted into the dynamic model,which was to analyze the dynamic response of the 3RSR parallel mechanism with wear and spherical joint clearance.The simulation results show that the irregular wear occurs in the spherical joint with clearance under the presence of the impact and friction force.The long-term wear will increase the fluctuation of the contact force,thereby decreasing the movement stability of the mechanism.展开更多
基金Project(50975058)supported by the National Science Foundation of China
文摘The optimization of electrolytes and the material removal mechanisms for Cu electrochemical mechanical planarization(ECMP)at different pH values including 5-methyl-1H-benzotriazole(TTA),hydroxyethylidenediphosphoric acid(HEDP),and tribasic ammonium citrate(TAC)were investigated by electrochemical techniques,X-ray photoelectron spectrometer(XPS)analysis,nano-scratch tests,AFM measurements,and polishing of Cu-coated blanket wafers.The experimental results show that the planarization efficiency and the surface quality after ECMP obtained in alkali-based solutions are superior to that in acidic-based solutions,especially at pH=8.The optimal electrolyte compositions(mass fraction)are 6% HEDP,0.3% TTA and 3% TAC at pH=8.The main factor affecting the thickness of the oxide layer formed during ECMP process is the applied potential.The soft layer formation is a major mechanism for electrochemical enhanced mechanical abrasion.The surface topography evolution before and after electrochemical polishing(ECP)illustrates the mechanism of mechanical abrasion accelerating electrochemical dissolution,that is,the residual stress caused by the mechanical wear enhances the electrochemical dissolution rate.This understanding is beneficial for optimization of ECMP processes.
基金Project(2018YFB1307900)supported by the National Key R&D Program of ChinaProject(51775473)supported by the National Natural Science Foundation of China+3 种基金Projects(E2018203140,E2019203109)supported by the Natural Science Foundation of Hebei Province,ChinaProject(ZD2019020)supported by the Key Research Project in Higher Education Institutions of Hebei Province,ChinaProject(2017KSYS009)supported by the Key Laboratory of Robotics and Intelligent Equipment of Guangdong Regular Institutions of Higher Education,ChinaProject(KCYCXPT2017006)supported by the Innovation Center of Robotics and Intelligent Equipment of Dongguan University of Technology,China。
文摘The collision and wear caused by inevitable clearance in kinematic pair have an effect on the dynamic characteristics of the mechanism.Therefore,we established the dynamic model of a 3RSR(R is the revolute joint and S is the spherical joint)parallel mechanism with spherical joint clearance based on the modified Flores contact force model and the modified Coulomb friction model using Newton-Euler method.The standard quaternion was introduced in the constraint equation,and the four-order Runge-Kutta method was adopted to solve the 3RSR dynamic model.The simulation results were compared and analyzed with the numerical results.The geometrical parameters of the worn ball socket were solved based on the Archard wear model,and the geometrical reconstruction of the worn surface was carried out.The geometric reconstruction parameters were substituted into the dynamic model,which was to analyze the dynamic response of the 3RSR parallel mechanism with wear and spherical joint clearance.The simulation results show that the irregular wear occurs in the spherical joint with clearance under the presence of the impact and friction force.The long-term wear will increase the fluctuation of the contact force,thereby decreasing the movement stability of the mechanism.
