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镍钨硼合金电沉积机理及镀层微晶尺寸 被引量:9
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作者 杨防祖 曹刚敏 +2 位作者 胡筱 许书楷 周绍民 《电化学》 CAS CSCD 2000年第2期169-174,共6页
应用循环伏安、恒电位阶跃和X射线衍射 (XRD)等方法研究了Ni_W_B合金电沉积特点和镀层微晶尺寸 .结果表明 ,在以柠檬酸铵为络合剂的溶液中 ,Ni_W_B合金沉积层较Ni_W合金有较低的电化学活性 .电位阶跃i~t曲线分析表明 ,在玻碳电极上Ni_... 应用循环伏安、恒电位阶跃和X射线衍射 (XRD)等方法研究了Ni_W_B合金电沉积特点和镀层微晶尺寸 .结果表明 ,在以柠檬酸铵为络合剂的溶液中 ,Ni_W_B合金沉积层较Ni_W合金有较低的电化学活性 .电位阶跃i~t曲线分析表明 ,在玻碳电极上Ni_W_B合金电结晶过程遵循扩散控制瞬时成核三维成长模式 ,且随过电位的增加 ,电极表面晶核数增多 .XRD测试结果表明 ,随沉积电流密度提高 ,合金镀层微晶尺寸逐渐增大 ,说明电流密度提高将更加有利于Ni_W_B合金电结晶过程中的晶核生长 . 展开更多
关键词 电沉积 成核机理 晶料尺寸 镍钨硼合金 电镀
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Microstructure of aluminum/copper clad composite fabricated by casting-cold extrusion forming 被引量:7
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作者 骆俊廷 赵双敬 张春祥 《Journal of Central South University》 SCIE EI CAS 2011年第4期1013-1017,共5页
An aluminum/copper clad composite was fabricated by the casting-cold extrusion forming technology and the microstructures of the products were observed and analyzed.It is found that aluminum grains at the interface ar... An aluminum/copper clad composite was fabricated by the casting-cold extrusion forming technology and the microstructures of the products were observed and analyzed.It is found that aluminum grains at the interface are refined in the radial profiles of cone-shaped deformation zone,but the grains in the center maintain the original state and the grain size is non-uniform.A clear boundary presents between the refined area and center area.In contrast,the copper grains in the radial profiles have been significantly refined.In the center area of the copper,the grains are bigger than those at the boundary.On the surface of the deformable body,the grain size is the smallest,but with irregular grain morphology.After the product is entirely extruded,all the copper and aluminum grains are refined with small and uniform morphology.In the center area,the average diameter of aluminum grains is smaller than 5 μm,and the copper grain on the surface is about 10 μm.At the interface,the grain size is very small,with a good combination of copper and aluminum.The thickness of interface is in the range of 10-15 μm.Energy spectrum analysis shows that CuAl3 phase presents at the interface. 展开更多
关键词 aluminum/copper clad composite CASTING cold extrusion MICROSTRUCTURE
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