针对背沟道刻蚀(Back Channel Etch,BCE)技术的非晶铟镓锌氧化物(a-IGZO)薄膜晶体管(Thin Film Transistor,TFTs),建立了一种高浓度掺杂态密度模型(High Concentration Doping Density Of States model,HCD-DOS model),并通过数值模拟...针对背沟道刻蚀(Back Channel Etch,BCE)技术的非晶铟镓锌氧化物(a-IGZO)薄膜晶体管(Thin Film Transistor,TFTs),建立了一种高浓度掺杂态密度模型(High Concentration Doping Density Of States model,HCD-DOS model),并通过数值模拟研究态密度关键参数对器件性能的影响,以此揭示a-IGZO TFTs中制备工艺对导电沟道修复的物理机理.首先,采用结合强度较高的钼/铜双层结构作为栅/源/漏电极,引入BCE方法制备了底栅顶接触(BottomGate Top-Contact,BG-TC)TFTs.其次,建立了适用于BCE技术的a-IGZO TFTs的HCD-DOS模型.随后,基于TCAD(Technology Computer Aided Design)仿真器对态密度关键参数进行数值研究,结果表明,不同态密度参数对a-IGZO TFTs器件转移特性曲线、电学特性以及沟道内部电子浓度分布的影响有所差异.最后,基于HCD-DOS模型探索SiO_(x)钝化层沉积和N_(2)O等离子体处理对器件内部机理的影响.研究发现,N2O等离子体处理对态密度分布和沟道载流子浓度有显著影响,进而导致阈值电压正向漂移.展开更多
The microstructure evolution of 7A85 aluminum alloy at the conditions of strain rate(0.001−1 s^(−1))and deformation temperature(250−450°C)was studied by optical microscopy(OM)and electron back scattering diffract...The microstructure evolution of 7A85 aluminum alloy at the conditions of strain rate(0.001−1 s^(−1))and deformation temperature(250−450°C)was studied by optical microscopy(OM)and electron back scattering diffraction(EBSD).Based on the K-M dislocation density model,a two-stage K-M dislocation density model of 7A85 aluminum alloy was established.The results reveal that dynamic recovery(DRV)and dynamic recrystallization(DRX)are the main mechanisms of microstructure evolution during thermal deformation of 7A85 aluminum alloy.350−400°C is the transformation zone from dynamic recovery to dynamic recrystallization.At low temperature(≤350°C),DRV is the main mechanism,while DRX mostly occurs at high temperature(≥400°C).At this point,the sensitivity of microstructure evolution to temperature is relatively high.As the temperature increased,the average misorientation angle(θˉ_(c))increased significantly,ranging from 0.93°to 7.13°.Meanwhile,the f_(LAGBs) decreased with the highest decrease of 24%.展开更多
The effect of the parameters on the open-circuit voltage, V_(OC) of a-Si:H/c-Si heterojunction solar cells was explored by an analytical model. The analytical results show that V_(OC) increases linearly with the logar...The effect of the parameters on the open-circuit voltage, V_(OC) of a-Si:H/c-Si heterojunction solar cells was explored by an analytical model. The analytical results show that V_(OC) increases linearly with the logarithm of illumination intensity under usual illumination. There are two critical values of the interface state density(D_(it)) for the open-circuit voltage(V_(OC)), D_(it)^(crit,1) and D_(it)crit,2(a few 1010 cm^(-2)·e V^(-1)). V_(OC) decreases remarkably when D_(it) is higher than D_(it)^(crit,1). To achieve high V_(OC), the interface states should reduce down to a few 1010 cm^(-2)·e V^(-1). Due to the difference between the effective density of states in the conduction and valence band edges of c-Si, the open-circuit voltage of a-Si:H/c-Si heterojunction cells fabricated on n-type c-Si wafers is about 22 mV higher than that fabricated on p-type c-Si wafers at the same case. V_(OC) decreases with decreasing the a-Si:H doping concentration at low doping level since the electric field over the c-Si depletion region is reduced at low doping level. Therefore, the a-Si:H layer should be doped higher than a critical value of 5×10^(18) cm^(-3) to achieve high V_(OC).展开更多
文摘针对背沟道刻蚀(Back Channel Etch,BCE)技术的非晶铟镓锌氧化物(a-IGZO)薄膜晶体管(Thin Film Transistor,TFTs),建立了一种高浓度掺杂态密度模型(High Concentration Doping Density Of States model,HCD-DOS model),并通过数值模拟研究态密度关键参数对器件性能的影响,以此揭示a-IGZO TFTs中制备工艺对导电沟道修复的物理机理.首先,采用结合强度较高的钼/铜双层结构作为栅/源/漏电极,引入BCE方法制备了底栅顶接触(BottomGate Top-Contact,BG-TC)TFTs.其次,建立了适用于BCE技术的a-IGZO TFTs的HCD-DOS模型.随后,基于TCAD(Technology Computer Aided Design)仿真器对态密度关键参数进行数值研究,结果表明,不同态密度参数对a-IGZO TFTs器件转移特性曲线、电学特性以及沟道内部电子浓度分布的影响有所差异.最后,基于HCD-DOS模型探索SiO_(x)钝化层沉积和N_(2)O等离子体处理对器件内部机理的影响.研究发现,N2O等离子体处理对态密度分布和沟道载流子浓度有显著影响,进而导致阈值电压正向漂移.
基金Project(51675465)supported by the National Natural Science Foundation of ChinaProject(E2019203075)supported by the Natural Science Foundation of Hebei Province,China+1 种基金Project(BJ2019001)supported by the Top Young Talents Project of the Education Department of Hebei Province,ChinaProject(Kfkt2017-07)supported by the State Key Laboratory Program of High Performance Complex Manufacturing,China。
文摘The microstructure evolution of 7A85 aluminum alloy at the conditions of strain rate(0.001−1 s^(−1))and deformation temperature(250−450°C)was studied by optical microscopy(OM)and electron back scattering diffraction(EBSD).Based on the K-M dislocation density model,a two-stage K-M dislocation density model of 7A85 aluminum alloy was established.The results reveal that dynamic recovery(DRV)and dynamic recrystallization(DRX)are the main mechanisms of microstructure evolution during thermal deformation of 7A85 aluminum alloy.350−400°C is the transformation zone from dynamic recovery to dynamic recrystallization.At low temperature(≤350°C),DRV is the main mechanism,while DRX mostly occurs at high temperature(≥400°C).At this point,the sensitivity of microstructure evolution to temperature is relatively high.As the temperature increased,the average misorientation angle(θˉ_(c))increased significantly,ranging from 0.93°to 7.13°.Meanwhile,the f_(LAGBs) decreased with the highest decrease of 24%.
基金Project(11374094)supported by the National Natural Science Foundation of ChinaProject(2013HZX23)supported by Natural Science Foundation of Hunan University of Technology,ChinaProject(2015JJ3060)supported by Natural Science Foundation of Hunan Province of China
文摘The effect of the parameters on the open-circuit voltage, V_(OC) of a-Si:H/c-Si heterojunction solar cells was explored by an analytical model. The analytical results show that V_(OC) increases linearly with the logarithm of illumination intensity under usual illumination. There are two critical values of the interface state density(D_(it)) for the open-circuit voltage(V_(OC)), D_(it)^(crit,1) and D_(it)crit,2(a few 1010 cm^(-2)·e V^(-1)). V_(OC) decreases remarkably when D_(it) is higher than D_(it)^(crit,1). To achieve high V_(OC), the interface states should reduce down to a few 1010 cm^(-2)·e V^(-1). Due to the difference between the effective density of states in the conduction and valence band edges of c-Si, the open-circuit voltage of a-Si:H/c-Si heterojunction cells fabricated on n-type c-Si wafers is about 22 mV higher than that fabricated on p-type c-Si wafers at the same case. V_(OC) decreases with decreasing the a-Si:H doping concentration at low doping level since the electric field over the c-Si depletion region is reduced at low doping level. Therefore, the a-Si:H layer should be doped higher than a critical value of 5×10^(18) cm^(-3) to achieve high V_(OC).
