The ever-increasing integration of electronic devices has inevit-ably caused electromagnetic interference and heat accumulation problems,and dual-function materials with both a high thermal conductivity and high elect...The ever-increasing integration of electronic devices has inevit-ably caused electromagnetic interference and heat accumulation problems,and dual-function materials with both a high thermal conductivity and high electromagnetic wave absorption(EWA)are regarded as an effective strategy for solving these problems.Carbon materials are widely used as thermal and EWA fillers due to their excellent conductivity and outstanding thermal conduction properties,and have become a research hotspot in the field of high thermal conductivity,microwave absorbing materials in recent years.The status of current research progress on carbon-based high thermal-conduction microwave absorption materials,including carbon fibers,carbon nanotubes,graphene and amorphous carbon,is re-viewed,and the influence of the structure of the materials on their absorption and thermal conductivity properties,such as core-shell structure,three-dimensional network structure,and heteroatom doping,is also elaborated.Feasible solutions for the cur-rent problems with these materials are proposed,with the aim of providing valuable guidance for the future design of carbon-based high thermal conduction microwave absorbing materials.展开更多
基金Project(202045002)supported by the Initial Research Funding for Special Associate Professor of Central South University,ChinaProject(2021RC3003)supported by the Science and Technology Innovation Talents Program of Hunan Province,China+1 种基金Project(2022-JCJQ-ZD-01-1)supported by the Basic Strengthening Research Sub-project of ChinaProject(CX 20220163)supported by the Postgraduate Innovation Project of Hunan Province,China。
基金financial supports from the National Natural Science Foundation of China(22238012 and 22178384)Science Foundation of China University of Petroleum,Beijing(2462024QNXZ003)。
文摘The ever-increasing integration of electronic devices has inevit-ably caused electromagnetic interference and heat accumulation problems,and dual-function materials with both a high thermal conductivity and high electromagnetic wave absorption(EWA)are regarded as an effective strategy for solving these problems.Carbon materials are widely used as thermal and EWA fillers due to their excellent conductivity and outstanding thermal conduction properties,and have become a research hotspot in the field of high thermal conductivity,microwave absorbing materials in recent years.The status of current research progress on carbon-based high thermal-conduction microwave absorption materials,including carbon fibers,carbon nanotubes,graphene and amorphous carbon,is re-viewed,and the influence of the structure of the materials on their absorption and thermal conductivity properties,such as core-shell structure,three-dimensional network structure,and heteroatom doping,is also elaborated.Feasible solutions for the cur-rent problems with these materials are proposed,with the aim of providing valuable guidance for the future design of carbon-based high thermal conduction microwave absorbing materials.
