采用光敏BCB介质工艺制作了In P基TRL校准件和无源器件,研究了这种毫米波片上集成技术。光敏BCB工艺包括三层金属和一层BCB介质。为了验证工艺可行性,采用电磁仿真器设计了TRL校准件和两种无源电路。使用TRL去嵌技术,得到两种无源电路在...采用光敏BCB介质工艺制作了In P基TRL校准件和无源器件,研究了这种毫米波片上集成技术。光敏BCB工艺包括三层金属和一层BCB介质。为了验证工艺可行性,采用电磁仿真器设计了TRL校准件和两种无源电路。使用TRL去嵌技术,得到两种无源电路在75~110 GHz内的本征特性。通过比较去嵌后本征特性和仿真结果,发现与仿真结果相比S11/S22的幅度波动小于5 d B,S12/S21的幅度波动小于0.3 d B。仿真结果与去嵌后的本征结果重合度比较好,这进一步说明光学BCB工艺比较适合毫米波校准件的研制。展开更多
Hot granule medium pressure forming （HGMF） process is a new process in which granule medium replaces the medium in existing flexible-die hot forming process, such as liquids, gases or viscous medium. Hot forming of ...Hot granule medium pressure forming （HGMF） process is a new process in which granule medium replaces the medium in existing flexible-die hot forming process, such as liquids, gases or viscous medium. Hot forming of light alloy sheet parts can be realized based on the properties of granule medium, such as withstanding high temperature and pressure, filling well, sealing and loading easily. In this work, the forming of AA7075 cylindrical parts by HGMF process is taken as an example to establish the constitutive relation and forming limit diagram （FLD） of AA7075 sheet which is related to temperature by hot uniaxial tensile test of sheet metal. Based on the assumption that granule medium is applied to extended Drucker-Prager linear material model, the finite element model of HGMF process is established and the effect of technological parameters, such as forming temperature, blank-holder gap and drawing ratio, on the sheet metal formability, is studied. The limit drawing ratio curve of AA7075 cylindrical parts at forming temperature of 175-300 ℃ is obtained by HGMF process test, and the limit drawing ratio reaches the maximum value of 1.71 at 250 ℃. The results of numerical simulation are consistent with the results of process test, and the forming force, distribution of wall thichness and form of instability are predicted correctly, which provides reference for the application of HGMF process.展开更多
文摘采用光敏BCB介质工艺制作了In P基TRL校准件和无源器件,研究了这种毫米波片上集成技术。光敏BCB工艺包括三层金属和一层BCB介质。为了验证工艺可行性,采用电磁仿真器设计了TRL校准件和两种无源电路。使用TRL去嵌技术,得到两种无源电路在75~110 GHz内的本征特性。通过比较去嵌后本征特性和仿真结果,发现与仿真结果相比S11/S22的幅度波动小于5 d B,S12/S21的幅度波动小于0.3 d B。仿真结果与去嵌后的本征结果重合度比较好,这进一步说明光学BCB工艺比较适合毫米波校准件的研制。
基金Projects(5130538651305385)supported by the National Natural Science Foundation of ChinaProject(E2013203093)supported by the Natural Science Foundation of Hebei Province,China
文摘Hot granule medium pressure forming （HGMF） process is a new process in which granule medium replaces the medium in existing flexible-die hot forming process, such as liquids, gases or viscous medium. Hot forming of light alloy sheet parts can be realized based on the properties of granule medium, such as withstanding high temperature and pressure, filling well, sealing and loading easily. In this work, the forming of AA7075 cylindrical parts by HGMF process is taken as an example to establish the constitutive relation and forming limit diagram （FLD） of AA7075 sheet which is related to temperature by hot uniaxial tensile test of sheet metal. Based on the assumption that granule medium is applied to extended Drucker-Prager linear material model, the finite element model of HGMF process is established and the effect of technological parameters, such as forming temperature, blank-holder gap and drawing ratio, on the sheet metal formability, is studied. The limit drawing ratio curve of AA7075 cylindrical parts at forming temperature of 175-300 ℃ is obtained by HGMF process test, and the limit drawing ratio reaches the maximum value of 1.71 at 250 ℃. The results of numerical simulation are consistent with the results of process test, and the forming force, distribution of wall thichness and form of instability are predicted correctly, which provides reference for the application of HGMF process.
