The study of transient heat conduction in multilayered slabs is widely used in various engineering fields. In this paper, the transient heat conduction in multilayered slabs with general boundary conditions and arbitr...The study of transient heat conduction in multilayered slabs is widely used in various engineering fields. In this paper, the transient heat conduction in multilayered slabs with general boundary conditions and arbitrary heat generations is analysed. The boundary conditions are general and include various combinations of Dirichlet, Neumann or Robin boundary conditions at either surface. Moreover, arbitrary heat generations in the slabs are taken into account. The solutions are derived by basic methods, including the superposition method, separation variable method and orthogonal expansion method. The simplified double-layered analytical solution is validated by a numerical method and applied to predicting the temporal and spatial distribution of the temperature inside a landfill. It indicates the ability of the proposed analytical solutions for solving the wide range of applied transient heat conduction problems.展开更多
基金Projects(41530637,41877222,41702290)supported by the National Natural Science Foundation of China
文摘The study of transient heat conduction in multilayered slabs is widely used in various engineering fields. In this paper, the transient heat conduction in multilayered slabs with general boundary conditions and arbitrary heat generations is analysed. The boundary conditions are general and include various combinations of Dirichlet, Neumann or Robin boundary conditions at either surface. Moreover, arbitrary heat generations in the slabs are taken into account. The solutions are derived by basic methods, including the superposition method, separation variable method and orthogonal expansion method. The simplified double-layered analytical solution is validated by a numerical method and applied to predicting the temporal and spatial distribution of the temperature inside a landfill. It indicates the ability of the proposed analytical solutions for solving the wide range of applied transient heat conduction problems.
