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半导体锗硅薄膜材料及相关工艺技术 被引量:3
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作者 王光伟 《半导体技术》 CAS CSCD 北大核心 2006年第12期881-886,891,共7页
综述了锗硅薄膜材料的特性与应用、制备技术、固相结晶、与过渡金属的固相反应等一系列内容,探讨了提高锗硅薄膜结晶度的工艺手段和各自的优缺点,分析了锗硅薄膜与钴等过渡金属固相反应的特点及在集成电路上的应用。
关键词 锗硅 薄膜材料 固相结晶 反应 集成电路
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Microstructure and mechanical properties of Al-6.02Zn-1.94Mg alloy at higher solution treatment temperature
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作者 NIE Chang-chang HUANG Yuan-chun +1 位作者 SHAO Hong-bang WEN Jin-chuan 《Journal of Central South University》 SCIE EI CAS CSCD 2022年第3期937-949,共13页
The effects of solution treatment temperature and holding time on the microstructure and mechanical properties of extruded Al-6.02 wt.%Zn-1.94 wt.%Mg alloy were investigated by differential scanning calorimetry(DSC),o... The effects of solution treatment temperature and holding time on the microstructure and mechanical properties of extruded Al-6.02 wt.%Zn-1.94 wt.%Mg alloy were investigated by differential scanning calorimetry(DSC),optical microscopy(OM), scanning electron microscopy(SEM), X-ray diffraction(XRD), and tensile test. The results showed that the optimum solution treatment process for the alloy was 470 ℃, 2 h. The tensile strength, yield strength,and elongation of the samples after the aging treatment at 120℃ for 24 h were 486 MPa, 431 MPa, and 14.8%,respectively. The alloy produced more copious recrystallization with the augment of solution temperature and the extension of holding time. While the second phase of η(MgZn_(2)), and T(AlZnMgCu) in the matrix was not fully re-dissolved under the treatment condition of lower temperature or shorter holding time. Interestingly, the Zr aggregation was observed in the samples treated at 510 ℃ for 2 h, which led to the growth of the second phase particles and the increase of their area fraction. 展开更多
关键词 MICROSTRUCTURE solution treatment second phase RECRYSTALLIZATION AGGREGATION
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