(上接《电子工艺技术》2011年第4期第A15页)Embedded Active Component(Device)An active device that is inserted or formed between the layers of the primary inter connect substrate.It should have terminals which can connect...(上接《电子工艺技术》2011年第4期第A15页)Embedded Active Component(Device)An active device that is inserted or formed between the layers of the primary inter connect substrate.It should have terminals which can connect with the layers of the substrate.展开更多
A(上接《电子工艺技术》2010年第4期第A15页)Aspect Ratio(Film)The ratio of the length of a film component to its width.长宽比(膜元器件)膜元器件的长度与宽度之比。Aspect Ratio(Hole)53.0056The ratio of the length or depth o...A(上接《电子工艺技术》2010年第4期第A15页)Aspect Ratio(Film)The ratio of the length of a film component to its width.长宽比(膜元器件)膜元器件的长度与宽度之比。Aspect Ratio(Hole)53.0056The ratio of the length or depth of a hole to its preplated diameter.(See Figure A-7.)展开更多
文摘(上接《电子工艺技术》2011年第4期第A15页)Embedded Active Component(Device)An active device that is inserted or formed between the layers of the primary inter connect substrate.It should have terminals which can connect with the layers of the substrate.
文摘A(上接《电子工艺技术》2010年第4期第A15页)Aspect Ratio(Film)The ratio of the length of a film component to its width.长宽比(膜元器件)膜元器件的长度与宽度之比。Aspect Ratio(Hole)53.0056The ratio of the length or depth of a hole to its preplated diameter.(See Figure A-7.)