High-purity silver(Ag)is extensively utilized in electronics,aerospace,and other advanced industries due to its excellent thermal conductivity,electrical conductivity,and machinability.However,the prohibitive material...High-purity silver(Ag)is extensively utilized in electronics,aerospace,and other advanced industries due to its excellent thermal conductivity,electrical conductivity,and machinability.However,the prohibitive material cost poses substantial challenges for optimizing thermal processing parameters through repetitive experimental trials.In this work,hot compression experiments on high-purity silver were conducted using a Gleeble-3800 thermal simulator.The high temperature deformation behaviors,dynamic recovery(DRV)and dynamic recrystallization(DRX)of high-purity silver were studied by constructing an Arrhenius constitutive equation and developing thermal processing maps.The results show that plastic instability of high-purity silver occurs at high strain rates and the optimized hot processing parameters are the strain rate below 0.001 s^(−1) and the temperature of 340−400℃.Microstructural observations exhibit that DRV prefers to occur at lower deformation temperatures(e.g.,250℃).This is attributed to the low stacking fault energy of high-purity silver,which facilitates the decomposition of dislocations into partial dislocations and promotes high-density dislocation accumulation.Furthermore,DRX in high-purity silver becomes increasingly pronounced with increasing deformation temperature and reaches saturation at 350℃.展开更多
The microstructure evolution of 7A85 aluminum alloy at the conditions of strain rate(0.001−1 s^(−1))and deformation temperature(250−450°C)was studied by optical microscopy(OM)and electron back scattering diffract...The microstructure evolution of 7A85 aluminum alloy at the conditions of strain rate(0.001−1 s^(−1))and deformation temperature(250−450°C)was studied by optical microscopy(OM)and electron back scattering diffraction(EBSD).Based on the K-M dislocation density model,a two-stage K-M dislocation density model of 7A85 aluminum alloy was established.The results reveal that dynamic recovery(DRV)and dynamic recrystallization(DRX)are the main mechanisms of microstructure evolution during thermal deformation of 7A85 aluminum alloy.350−400°C is the transformation zone from dynamic recovery to dynamic recrystallization.At low temperature(≤350°C),DRV is the main mechanism,while DRX mostly occurs at high temperature(≥400°C).At this point,the sensitivity of microstructure evolution to temperature is relatively high.As the temperature increased,the average misorientation angle(θˉ_(c))increased significantly,ranging from 0.93°to 7.13°.Meanwhile,the f_(LAGBs) decreased with the highest decrease of 24%.展开更多
基金Project(52274369)supported by the National Natural Science Foundation of China。
文摘High-purity silver(Ag)is extensively utilized in electronics,aerospace,and other advanced industries due to its excellent thermal conductivity,electrical conductivity,and machinability.However,the prohibitive material cost poses substantial challenges for optimizing thermal processing parameters through repetitive experimental trials.In this work,hot compression experiments on high-purity silver were conducted using a Gleeble-3800 thermal simulator.The high temperature deformation behaviors,dynamic recovery(DRV)and dynamic recrystallization(DRX)of high-purity silver were studied by constructing an Arrhenius constitutive equation and developing thermal processing maps.The results show that plastic instability of high-purity silver occurs at high strain rates and the optimized hot processing parameters are the strain rate below 0.001 s^(−1) and the temperature of 340−400℃.Microstructural observations exhibit that DRV prefers to occur at lower deformation temperatures(e.g.,250℃).This is attributed to the low stacking fault energy of high-purity silver,which facilitates the decomposition of dislocations into partial dislocations and promotes high-density dislocation accumulation.Furthermore,DRX in high-purity silver becomes increasingly pronounced with increasing deformation temperature and reaches saturation at 350℃.
基金Project(51675465)supported by the National Natural Science Foundation of ChinaProject(E2019203075)supported by the Natural Science Foundation of Hebei Province,China+1 种基金Project(BJ2019001)supported by the Top Young Talents Project of the Education Department of Hebei Province,ChinaProject(Kfkt2017-07)supported by the State Key Laboratory Program of High Performance Complex Manufacturing,China。
文摘The microstructure evolution of 7A85 aluminum alloy at the conditions of strain rate(0.001−1 s^(−1))and deformation temperature(250−450°C)was studied by optical microscopy(OM)and electron back scattering diffraction(EBSD).Based on the K-M dislocation density model,a two-stage K-M dislocation density model of 7A85 aluminum alloy was established.The results reveal that dynamic recovery(DRV)and dynamic recrystallization(DRX)are the main mechanisms of microstructure evolution during thermal deformation of 7A85 aluminum alloy.350−400°C is the transformation zone from dynamic recovery to dynamic recrystallization.At low temperature(≤350°C),DRV is the main mechanism,while DRX mostly occurs at high temperature(≥400°C).At this point,the sensitivity of microstructure evolution to temperature is relatively high.As the temperature increased,the average misorientation angle(θˉ_(c))increased significantly,ranging from 0.93°to 7.13°.Meanwhile,the f_(LAGBs) decreased with the highest decrease of 24%.
