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Mathematical model for coupled reactive flow and solute transport during heap bioleaching of copper sulfide 被引量:6
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作者 尹升华 吴爱祥 +1 位作者 李希雯 王贻明 《Journal of Central South University》 SCIE EI CAS 2011年第5期1434-1440,共7页
Based on the momentum and mass conservation equations, a comprehensive model of heap bioleaching process is developed to investigate the interaction between chemical reactions, solution flow, gas flow, and solute tran... Based on the momentum and mass conservation equations, a comprehensive model of heap bioleaching process is developed to investigate the interaction between chemical reactions, solution flow, gas flow, and solute transport within the leaching system. The governing equations are solved numerically using the COMSOL Multiphysics software for the coupled reactive flow and solute transport at micro-scale, meso-scale and macro-scale levels. At or near the surface of ore particle, the acid concentration is relatively higher than that in the central area, while the concentration gradient decreases after 72 d of leaching. The flow simulation between ore particles by combining X-ray CT technology shows that the highest velocity in narrow pore reaches 0.375 m/s. The air velocity within the dump shows that the velocity near the top and side surface is relatively high, which leads to the high oxygen concentration in that area. The coupled heat transfer and liquid flow process shows that the solution can act as an effective remover from the heap, dropping the highest temperature from 60 to 38 ℃. The reagent transfer coupled with solution flow is also analyzed. The results obtained allow us to obtain a better understanding of the fundamental physical phenomenon of the bioleaching process. 展开更多
关键词 copper sulphide heap bioleaching leaching reaction solution flow solute transport
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Application of neural network to prediction of plate finish cooling temperature
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作者 王丙兴 张殿华 +3 位作者 王君 于明 周娜 曹光明 《Journal of Central South University of Technology》 EI 2008年第1期136-140,共5页
To improve the deficiency of the control system of finish cooling temperature (FCT), a new model developed from a combination of a multilayer perception neural network as the self-learning system and traditional mathe... To improve the deficiency of the control system of finish cooling temperature (FCT), a new model developed from a combination of a multilayer perception neural network as the self-learning system and traditional mathematical model were brought forward to predict the plate FCT. The relationship between the self-learning factor of heat transfer coefficient and its influencing parameters such as plate thickness, start cooling temperature, was investigated. Simulative calculation indicates that the deficiency of FCT control system is overcome completely, the accuracy of FCT is obviously improved and the difference between the calculated and target FCT is controlled between -15 ℃ and 15 ℃. 展开更多
关键词 PLATE heat transfer coefficient mathematical model back propagation (BP) neural network
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Effects of thermal transport properties on temperature distribution within silicon wafer
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作者 王爱华 牛义红 +1 位作者 陈铁军 P.F.HSU 《Journal of Central South University》 SCIE EI CAS 2014年第4期1402-1410,共9页
A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface... A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface. It is found that the increased conductivities in both doped and undoped regions help reduce the temperature difference across the wafer surface. However, the doped layer conductivity has little effect on the overall temperature distribution and difference. The temperature level and difference on the top surface drop suddenly when absorption coefficient changes from 104 to 103 m-1. When the absorption coefficient is less or equal to 103 m-1, the temperature level and difference do not change much. The emissivity has the dominant effect on the top surface temperature level and difference. Higher surface emissivity can easily increase the temperature level of the wafer surface. After using the improved property data, the overall temperature level reduces by about 200 K from the basis case. The results will help improve the current understanding of the energy transport in the rapid thermal processing and the wafer temperature monitor and control level. 展开更多
关键词 silicon wafer thermal transport properties temperature distribution radiation heat transfer
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