Elastic heat transfer tube bundles are widely used in the field of flow-induced vibration heat transfer enhancement. Two types of mainly used tube bundles, the planar elastic tube bundle and the conical spiral tube bu...Elastic heat transfer tube bundles are widely used in the field of flow-induced vibration heat transfer enhancement. Two types of mainly used tube bundles, the planar elastic tube bundle and the conical spiral tube bundle were comprehensively compared in the condition of the same shell side diameter. The natural mode characteristics, the effect of fluid-structure interaction, the stress distribution, the comprehensive heat transfer performance and the secondary fluid flow of the two elastic tube bundles were all concluded and compared. The results show that the natural frequency and the critical velocity of vibration buckling of the planar elastic tube bundle are larger than those of the conical spiral tube bundle, while the stress distribution and the comprehensive heat transfer performance of the conical spiral tube bundle are relatively better.展开更多
Facing the problems lack of considering the non-uniform distribution of the static bias magnetic field and computing the panicle displacements in the simulation model of electromagnetic acoustic transducer （EMAT）, a...Facing the problems lack of considering the non-uniform distribution of the static bias magnetic field and computing the panicle displacements in the simulation model of electromagnetic acoustic transducer （EMAT）, a multi-field coupled model was established and the finite element method （FEM） was presented to calculate the entire transduction process. The multi-field coupled model included the static magnetic field, pulsed eddy current field and mechanical field. The FEM equations of the three fields were derived by Garlerkin FEM method. Thus, the entire transduction process of the EMAT was calculated through sequentially coupling the three fields. The transduction process of a Lamb wave EMAT was calculated according to the present model and method. The results show that, by the present method, it is valid to calculate the particle displacement under the given excitation signal and non-uniformly distributed static magnetic field. Calculation error will be brought about if the non-uniform distribution of the static bias magnetic field is neglected.展开更多
A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface...A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface. It is found that the increased conductivities in both doped and undoped regions help reduce the temperature difference across the wafer surface. However, the doped layer conductivity has little effect on the overall temperature distribution and difference. The temperature level and difference on the top surface drop suddenly when absorption coefficient changes from 104 to 103 m-1. When the absorption coefficient is less or equal to 103 m-1, the temperature level and difference do not change much. The emissivity has the dominant effect on the top surface temperature level and difference. Higher surface emissivity can easily increase the temperature level of the wafer surface. After using the improved property data, the overall temperature level reduces by about 200 K from the basis case. The results will help improve the current understanding of the energy transport in the rapid thermal processing and the wafer temperature monitor and control level.展开更多
基金Projects(xjj2013104,08143063)supported by the Fundamental Research Funds for the Central Universities,ChinaProject(2011CB706606)supported by the National Basic Research Program of China
文摘Elastic heat transfer tube bundles are widely used in the field of flow-induced vibration heat transfer enhancement. Two types of mainly used tube bundles, the planar elastic tube bundle and the conical spiral tube bundle were comprehensively compared in the condition of the same shell side diameter. The natural mode characteristics, the effect of fluid-structure interaction, the stress distribution, the comprehensive heat transfer performance and the secondary fluid flow of the two elastic tube bundles were all concluded and compared. The results show that the natural frequency and the critical velocity of vibration buckling of the planar elastic tube bundle are larger than those of the conical spiral tube bundle, while the stress distribution and the comprehensive heat transfer performance of the conical spiral tube bundle are relatively better.
基金Project(10974115) supported by the National Natural Science Foundation of China
文摘Facing the problems lack of considering the non-uniform distribution of the static bias magnetic field and computing the panicle displacements in the simulation model of electromagnetic acoustic transducer （EMAT）, a multi-field coupled model was established and the finite element method （FEM） was presented to calculate the entire transduction process. The multi-field coupled model included the static magnetic field, pulsed eddy current field and mechanical field. The FEM equations of the three fields were derived by Garlerkin FEM method. Thus, the entire transduction process of the EMAT was calculated through sequentially coupling the three fields. The transduction process of a Lamb wave EMAT was calculated according to the present model and method. The results show that, by the present method, it is valid to calculate the particle displacement under the given excitation signal and non-uniformly distributed static magnetic field. Calculation error will be brought about if the non-uniform distribution of the static bias magnetic field is neglected.
基金Project(N110204015)supported by the Fundamental Research Funds for the Central Universities,ChinaProject(2012M510075)supported by the China Postdoctoral Science Foundation
文摘A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface. It is found that the increased conductivities in both doped and undoped regions help reduce the temperature difference across the wafer surface. However, the doped layer conductivity has little effect on the overall temperature distribution and difference. The temperature level and difference on the top surface drop suddenly when absorption coefficient changes from 104 to 103 m-1. When the absorption coefficient is less or equal to 103 m-1, the temperature level and difference do not change much. The emissivity has the dominant effect on the top surface temperature level and difference. Higher surface emissivity can easily increase the temperature level of the wafer surface. After using the improved property data, the overall temperature level reduces by about 200 K from the basis case. The results will help improve the current understanding of the energy transport in the rapid thermal processing and the wafer temperature monitor and control level.
