针对印刷电路板(printed circuit board,PCB)缺陷检测过程中,因包含丰富的小目标缺陷,易出现漏检、误检现象,提出一种基于改进增强金字塔实时检测变换器(enhance pyramid real time detection transformer,EP-RTDETR)小目标PCB表面缺陷...针对印刷电路板(printed circuit board,PCB)缺陷检测过程中,因包含丰富的小目标缺陷,易出现漏检、误检现象,提出一种基于改进增强金字塔实时检测变换器(enhance pyramid real time detection transformer,EP-RTDETR)小目标PCB表面缺陷检测算法。首先,使用CSPDarknet替代原始骨干网络,以增强模型的特征提取能力;其次,设空间移动卷积门控线性单元(spatial moving point convolutional gated linear unit,SMPCGLU)模块改造C2f中的Bottleneck,增强了特征的门控调制能力和空间自适应性;再次,引入可学习位置编码,改进尺度交互机制,增强对不同位置信息的响应能力;然后,基于跨尺度特征融合模块(cross-scale feature-fusion module,CCFM)模块设计小目标增强金字塔结构(small object enhance pyramid,SOEP),增强的特征层和精细的特征融合使模型能够更准确地定位和识别小目标;最后,设计MPDIoU(minimum point distance-based intersection over union)+NWD(normalized wasserstein distance)loss,在加快模型收敛速度的同时更加关注小目标缺陷,回归结果更加准确。试验结果表明,相较于基准模型,准确率P提高了4.6%,召回率R提高了5.1%,平均精度均值mAP50提高了4.6%,参数量减少了16.38 M,浮点数减少了48.3,FPS提高了8.51 s,能够更好地进行小目标PCB表面缺陷检测。展开更多
A novel low-temperature alkaline smelting process is proposed to convert and separate amphoteric metals in crushed metal enrichment originated from waste printed circuit boards. The central composite design was used t...A novel low-temperature alkaline smelting process is proposed to convert and separate amphoteric metals in crushed metal enrichment originated from waste printed circuit boards. The central composite design was used to optimize the operating parameters,in which mass ratio of Na OH-to-CME, smelting temperature and smelting time were chosen as the variables, and the conversions of amphoteric metals tin, lead, aluminum and zinc were response parameters. Second-order polynomial models of high significance and3 D response surface plots were constructed to show the relationship between the responses and the variables. Optimum area of80%-85% Pb conversion and over 95% Sn conversion was obtained by the overlaid contours at mass ratio of Na OH-to-CME of4.5-5.0, smelting temperature of 653-723 K, smelting time of 90-120 min. The models were validated experimentally in the optimum area, and the results demonstrate that these models are reliable and accurate in predicting the smelting process.展开更多
Thermal decomposition of waste epoxy PCBs was performed in different atmospheres （nitrogen, argon, air and vacuum） at a heating rate of 10 ℃/rain by DSC-TGA, and the pyrolysis characteristic was analyzed. The gases...Thermal decomposition of waste epoxy PCBs was performed in different atmospheres （nitrogen, argon, air and vacuum） at a heating rate of 10 ℃/rain by DSC-TGA, and the pyrolysis characteristic was analyzed. The gases volatilized from the experiment were qualitatively analyzed by TG-FTIR. Kinetics study shows that pyrolysis reaction takes place between 300 and 400℃, and the activation energies are 256, 212 and 186.2 kJ/mol in nitrogen, argon and vacuum, respectively. There are two mass-loss processes in the decomposition under air atmosphere. In the first mass-loss process, the decomposition is the main reaction, and in the second process, the oxidation is the main reaction. The activation energy of the second mass-loss process is 99.6 kJ/mol by isothermal heat-treatments. TG-FTIR analysis shows carbon dioxide, carbon monoxide, hydrogen bromide, phenol and substituent phenol are given off during the pyrolysis of waste epoxy PCBs.展开更多
In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmeg...In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation （RSD） show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.展开更多
文摘针对印刷电路板(printed circuit board,PCB)缺陷检测过程中,因包含丰富的小目标缺陷,易出现漏检、误检现象,提出一种基于改进增强金字塔实时检测变换器(enhance pyramid real time detection transformer,EP-RTDETR)小目标PCB表面缺陷检测算法。首先,使用CSPDarknet替代原始骨干网络,以增强模型的特征提取能力;其次,设空间移动卷积门控线性单元(spatial moving point convolutional gated linear unit,SMPCGLU)模块改造C2f中的Bottleneck,增强了特征的门控调制能力和空间自适应性;再次,引入可学习位置编码,改进尺度交互机制,增强对不同位置信息的响应能力;然后,基于跨尺度特征融合模块(cross-scale feature-fusion module,CCFM)模块设计小目标增强金字塔结构(small object enhance pyramid,SOEP),增强的特征层和精细的特征融合使模型能够更准确地定位和识别小目标;最后,设计MPDIoU(minimum point distance-based intersection over union)+NWD(normalized wasserstein distance)loss,在加快模型收敛速度的同时更加关注小目标缺陷,回归结果更加准确。试验结果表明,相较于基准模型,准确率P提高了4.6%,召回率R提高了5.1%,平均精度均值mAP50提高了4.6%,参数量减少了16.38 M,浮点数减少了48.3,FPS提高了8.51 s,能够更好地进行小目标PCB表面缺陷检测。
基金Projects(51074190,51234009)supported by the National Natural Science Foundation of ChinaProject(2014DFA90520)supported by International Cooperation Program of Ministry of Science of ChinaProject(20110162110049)supported by the Doctoral Scientific Fund Project of the Ministry of Education of China
文摘A novel low-temperature alkaline smelting process is proposed to convert and separate amphoteric metals in crushed metal enrichment originated from waste printed circuit boards. The central composite design was used to optimize the operating parameters,in which mass ratio of Na OH-to-CME, smelting temperature and smelting time were chosen as the variables, and the conversions of amphoteric metals tin, lead, aluminum and zinc were response parameters. Second-order polynomial models of high significance and3 D response surface plots were constructed to show the relationship between the responses and the variables. Optimum area of80%-85% Pb conversion and over 95% Sn conversion was obtained by the overlaid contours at mass ratio of Na OH-to-CME of4.5-5.0, smelting temperature of 653-723 K, smelting time of 90-120 min. The models were validated experimentally in the optimum area, and the results demonstrate that these models are reliable and accurate in predicting the smelting process.
基金Project(2006AA06Z375) supported by the National High-tech Research and Development Program of China
文摘Thermal decomposition of waste epoxy PCBs was performed in different atmospheres （nitrogen, argon, air and vacuum） at a heating rate of 10 ℃/rain by DSC-TGA, and the pyrolysis characteristic was analyzed. The gases volatilized from the experiment were qualitatively analyzed by TG-FTIR. Kinetics study shows that pyrolysis reaction takes place between 300 and 400℃, and the activation energies are 256, 212 and 186.2 kJ/mol in nitrogen, argon and vacuum, respectively. There are two mass-loss processes in the decomposition under air atmosphere. In the first mass-loss process, the decomposition is the main reaction, and in the second process, the oxidation is the main reaction. The activation energy of the second mass-loss process is 99.6 kJ/mol by isothermal heat-treatments. TG-FTIR analysis shows carbon dioxide, carbon monoxide, hydrogen bromide, phenol and substituent phenol are given off during the pyrolysis of waste epoxy PCBs.
基金Project(041010) supported by Start-Up Foundation of Northwest University,ChinaProject(UIT/39) supported by University-Industry Collaboration Program from the Innovation and Technology Fund of Hong Kong,China
文摘In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation （RSD） show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.
