Graphite oxide(GO) was prepared by the pressurized oxidation method and incorporated into polyimide(PI) matrix to fabricate high-k composite films by in-situ polymerization and subsequent thermal treatment. The result...Graphite oxide(GO) was prepared by the pressurized oxidation method and incorporated into polyimide(PI) matrix to fabricate high-k composite films by in-situ polymerization and subsequent thermal treatment. The results show that the as-prepared GO had good dispersion and compatibility in PI matrix due to the introduction of abundant oxygen-containing functional groups during the oxidation. The residual graphitic domains and the thermal treatment induced reduction of GO further enhanced the dielectric permittivity of the resulting GO–PI composites. The dielectric permittivity of the GO–PI composites exhibited a typical percolation behavior with a percolation threshold of 0.0347 of volume ratio and a critical exponent of 0.837. Near the percolation threshold, the dielectric permittivity of the GO–PI composite increased to 108 at 10~2 Hz and was 26 times that of the pure PI.展开更多
The integration of electronic components and the popularity of flexible devices have come up with higher expectations for the heat dissipation capability and comprehensive mechanical performance of thermal management ...The integration of electronic components and the popularity of flexible devices have come up with higher expectations for the heat dissipation capability and comprehensive mechanical performance of thermal management materials.In this work,after the modification of polyimide(PI)fibers through oxidation and amination,the obtained PDA@OPI fibers(polydopamine(PDA)-modified pre-oxidized PI fibers)with abundant amino groups were mixed into graphene oxide(GO)to form uniform GO-PDA@OPI composites.Followed by evaporation,carbonization,graphitization and mechanical compaction,the G-gPDA@OPI films with a stable three-dimensional(3D)long-range interconnected covalent structure were built.In particular,due to the rich covalent bonds between GO layers and PDI@OPI fibers,the enhanced synergistic graphitization promotes an ordered graphitized structure with less interlayer distance between adjacent graphene sheets in composite film.As a result,the optimized G-gPDA@OPI film displays an improved tensile strength of 78.5 MPa,tensile strain of 19.4%and thermal conductivity of 1028 W/(m·K).Simultaneously,it also shows superior flexibility and high resilience.This work provides an easily-controlled and relatively low-cost route for fabricating multifunctional graphene heat dissipation films.展开更多
基金Project(2013JSJJ002)supported by the Faculty Research Fund of Central South University,China
文摘Graphite oxide(GO) was prepared by the pressurized oxidation method and incorporated into polyimide(PI) matrix to fabricate high-k composite films by in-situ polymerization and subsequent thermal treatment. The results show that the as-prepared GO had good dispersion and compatibility in PI matrix due to the introduction of abundant oxygen-containing functional groups during the oxidation. The residual graphitic domains and the thermal treatment induced reduction of GO further enhanced the dielectric permittivity of the resulting GO–PI composites. The dielectric permittivity of the GO–PI composites exhibited a typical percolation behavior with a percolation threshold of 0.0347 of volume ratio and a critical exponent of 0.837. Near the percolation threshold, the dielectric permittivity of the GO–PI composite increased to 108 at 10~2 Hz and was 26 times that of the pure PI.
基金Projects(51971089, 51872087) supported by the National Natural Science Foundation of ChinaProject(2020JJ5021)supported by the Natural Science Foundation of Hunan Province,ChinaProject(kq1804010) supported by the Major Science and Technology Program of Changsha,China。
文摘The integration of electronic components and the popularity of flexible devices have come up with higher expectations for the heat dissipation capability and comprehensive mechanical performance of thermal management materials.In this work,after the modification of polyimide(PI)fibers through oxidation and amination,the obtained PDA@OPI fibers(polydopamine(PDA)-modified pre-oxidized PI fibers)with abundant amino groups were mixed into graphene oxide(GO)to form uniform GO-PDA@OPI composites.Followed by evaporation,carbonization,graphitization and mechanical compaction,the G-gPDA@OPI films with a stable three-dimensional(3D)long-range interconnected covalent structure were built.In particular,due to the rich covalent bonds between GO layers and PDI@OPI fibers,the enhanced synergistic graphitization promotes an ordered graphitized structure with less interlayer distance between adjacent graphene sheets in composite film.As a result,the optimized G-gPDA@OPI film displays an improved tensile strength of 78.5 MPa,tensile strain of 19.4%and thermal conductivity of 1028 W/(m·K).Simultaneously,it also shows superior flexibility and high resilience.This work provides an easily-controlled and relatively low-cost route for fabricating multifunctional graphene heat dissipation films.
