High reinforcement-content aluminum matrix composite,with a high thermal conductivity,the adjustable coefficient of thermal expansion(CTE),low density and costs,have been extensively applied in electronic package.The ...High reinforcement-content aluminum matrix composite,with a high thermal conductivity,the adjustable coefficient of thermal expansion(CTE),low density and costs,have been extensively applied in electronic package.The Sip/Al composites were fabricated by squeeze casting technology.The microstructure observation showed that the composites were dense and macroscopically homogeneous,with no micro-holes and obvious defects.The linear CTEs of Sip/Al composites lay between(7.6～8.1)×10^-6 ℃^-1,and the thermal conductivity was larger than 100 W/(m·℃).The composites also had lower density(2.4 g/cm^3),higher special strength and special modulus.The electroless nickel method was used to deposit a continuous and uniform layer on the composites surface,which can meet the reliability testing demands of the diodes with Sip/Al composite baseplate.展开更多
文摘High reinforcement-content aluminum matrix composite,with a high thermal conductivity,the adjustable coefficient of thermal expansion(CTE),low density and costs,have been extensively applied in electronic package.The Sip/Al composites were fabricated by squeeze casting technology.The microstructure observation showed that the composites were dense and macroscopically homogeneous,with no micro-holes and obvious defects.The linear CTEs of Sip/Al composites lay between(7.6～8.1)×10^-6 ℃^-1,and the thermal conductivity was larger than 100 W/(m·℃).The composites also had lower density(2.4 g/cm^3),higher special strength and special modulus.The electroless nickel method was used to deposit a continuous and uniform layer on the composites surface,which can meet the reliability testing demands of the diodes with Sip/Al composite baseplate.
