Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to...Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to miniaturization of electronic components,it is challenging to directly measure or numerically predict the mechanical response of small-sized critical interconnections in board-level packaging structures to ensure the mechanical reliability of electronic devices in projectiles under harsh working conditions.To address this issue,an indirect measurement method using the Bayesian regularization-based load identification was proposed in this study based on finite element(FE)pre-dictions to estimate the load applied on critical interconnections of board-level packaging structures during the process of projectile penetration.For predicting the high-strain-rate penetration process,an FE model was established with elasto-plastic constitutive models of the representative packaging ma-terials(that is,solder material and epoxy molding compound)in which material constitutive parameters were calibrated against the experimental results by using the split-Hopkinson pressure bar.As the impact-induced dynamic bending of the printed circuit board resulted in an alternating tensile-compressive loading on the solder joints during penetration,the corner solder joints in the edge re-gions experience the highest S11 and strain,making them more prone to failure.Based on FE predictions at different structural scales,an improved Bayesian method based on augmented Tikhonov regulariza-tion was theoretically proposed to address the issues of ill-posed matrix inversion and noise sensitivity in the load identification at the critical solder joints.By incorporating a wavelet thresholding technique,the method resolves the problem of poor load identification accuracy at high noise levels.The proposed method achieves satisfactorily small relative errors and high correlation coefficients in identifying the mechanical response of local interconnections in board-level packaging structures,while significantly balancing the smoothness of response curves with the accuracy of peak identification.At medium and low noise levels,the relative error is less than 6%,while it is less than 10%at high noise levels.The proposed method provides an effective indirect approach for the boundary conditions of localized solder joints during the projectile penetration process,and its philosophy can be readily extended to other scenarios of multiscale analysis for highly nonlinear materials and structures under extreme loading conditions.展开更多
Stacked chip scale package(SCSP) attracts more and more attentions in advanced packages application with light weight,thin and small size,high reliability,low power and high storage capability.However,more and more ph...Stacked chip scale package(SCSP) attracts more and more attentions in advanced packages application with light weight,thin and small size,high reliability,low power and high storage capability.However,more and more physical and electrical issues being caused by package-induced stress in SCSP were reported recently.The effect of structural factors,including die thickness,die attach film thickness,die attach film type,and spacer size on package induced stress,was investigated.Analyses were given based on simulation results and provide important suggestion for package design.展开更多
The Siwalik Belt is a frontal fold\|thrust belt of the Himalayas and composed of thick sequence of foreland basin sediments derived from the Himalayas during the last 15 to 17 million years.From this Miocene belt in t...The Siwalik Belt is a frontal fold\|thrust belt of the Himalayas and composed of thick sequence of foreland basin sediments derived from the Himalayas during the last 15 to 17 million years.From this Miocene belt in the central Nepal,we discovered exotic thrust packages of the Middle Proterozoic rocks,which has been regarded as the Siwalik Group or post\|collisional sediments correlatable with the Subathu or Murree Formation in India.The thrust belt,called the Bagmati Belt,is narrowly distributed in the Siwalik Belt,22km to the north of the Main Frontal Thrust (MFT or HFF) that is an active fault and considered to be the deformation front of the Himalayan orogen.The Main Boundary Thrust (MBT) which separates the Siwalik Belt from the Lesser Himalayan Belt runs 7km to the north of the thrust packages.Within the belt,tectonic slices of 400m to 1km in thickness are repeated three to five times due to thrusts,sandwiching a thin slice of the Siwalik beds.The thrust package consists of the pre\|Siwalik sedimetary rocks and sills of dolerite,and named as the Bagmati Group.The thickness is only about 800m due to tectonic repition by thrust,although the group has been considered to be a continuous sequence attaining 2200m in thickness.We divided the Bagmati Group into three formations,each of which shows an upward\|coarsening and thickening sequence of 200 to 350m in thickness.All sequence is composed of red\|brown orthoquartzite,pink quartzite,micaceous shale and thin sandstone interbed and rhythmite,mottled hematite and hematitic pisolite.We interpret that the Bagmati Group was deposited in shallow lacustrine and desert environments.展开更多
Based on the principles of system engineering,economics theory and local conditionof production,studies carried out by taking“quadratic-regression-orthogonal-rotational” and ran-domized complete block designs to det...Based on the principles of system engineering,economics theory and local conditionof production,studies carried out by taking“quadratic-regression-orthogonal-rotational” and ran-domized complete block designs to determine the Optimal Agronomical Practices Package（OAPP）for Wheat Modelized Cultivation Management（WMCM）by system decision-makinganalysis.The OAPP was expected to meet various goals of different levels of yield and economicbenefit of middle and high fertility land in Beijing area.Taking cultivar JINGDONG-1（"JD-1"）asan example,the OAPP for grain yield≥6750 kg/ha and net benefit≥360 US （?）/ha was consist-ed as follows:density=195 plants/m<sup>2</sup>;spring irrigation times=4（stem elongation,booting,flowering,and 20 days after anthesis）;fertilization=150-188 kg N/ha,113-128 kg P<sub>2</sub>O<sub>5</sub>/ha.展开更多
The magnetic resonance spectroscopy(MRS)results are greatly influenced by reconstruction of the spectrum and quantitative analysis.Because of this requirement a number of programs dedicated to MRS data analysis were d...The magnetic resonance spectroscopy(MRS)results are greatly influenced by reconstruction of the spectrum and quantitative analysis.Because of this requirement a number of programs dedicated to MRS data analysis were developed.The selection and use of appropriate software is crucial not only in clinical procedures,but also while carrying out scientific research.The choice of the software to suit the user's needs should be based on the analysis of the functionality of the program.It is particularly important from the user's viewpoint to identify what data can be loaded and processed in the program.The specific programs allow the user different degree of control over analysis parameters.Moreover,the programs for MRS data analysis differ in terms of the applied signal processing algorithms.The aim of this work,therefore,is to review available packages designed for MRS data analysis,taking into account their capabilities and limitations.展开更多
In this paper, a microcomputer program package for pharmacokinetics and biopharmaceutics (PKBP) was presented. This package is applicable to various calculations for pharmacokinetics and biopharmaceutics. Some mathema...In this paper, a microcomputer program package for pharmacokinetics and biopharmaceutics (PKBP) was presented. This package is applicable to various calculations for pharmacokinetics and biopharmaceutics. Some mathematical models and computing methods were developed. It has been used over 200 users.展开更多
This paper introduces a software specially in calculating the contribution rate of machanization in agriculture by usng economy math method,computer technology and Visual Basic 6.0 version.The software package has fri...This paper introduces a software specially in calculating the contribution rate of machanization in agriculture by usng economy math method,computer technology and Visual Basic 6.0 version.The software package has friendly interface,simple operating way and accurate,feasible calculating method.It greatly changes the condition in the past which had considerable lots of data and miscellaneous and trivial methods,which were even hard to seek answer.So it has very high practicl value.展开更多
The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that ...The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joints to improve the reliabili ty of solder joints. When flip chip package specimen is tested with thermal cycl ing, the cyclic stress/strain response that exists at the underfill interfaces and solder joints may result in interfacial crack initiation and propagation. Therefore, the chip cracking and the interfacial delamination between underfill and chip corner have been investigated in many studies. Also, most researches h ave focused on the effect of fatigue and creep properties of solder joint induce d by the plastic strain alternation and accumulation. The nuderfill must have lo w viscosity in the liquid state and good adhesion to the interface after solidif ying. Also, the mechanical behavior of such epoxy material has much dependen ce on temperature in its glass transition temperature range that is usually cove red by the temperature range of thermal cycling test. Therefore, the materia l behavior of underfill exists a significant non-linearity and the assumption o f linear elastic can lack for accuracy in numerical analysis. Through numerical analysis, this study had some comparisons about the effect of linear and non -linear properties of underfill on strain behaviors around the interface of fli p chip assembly. Especially, the deformation tendency inside solder bumps could be predicted. Also, it is worthily mentioned that we have pointed out which comp onent of plastic strain, thus, either normal or shear, has dominant influence to the fatigue and creep of solder bump, which have not brought up before. About the numerical analysis to the thermal plastic strain occurs in flip chip i nterconnection during thermal cycling test, a commercial finite element software , namely, ANSYS, was employed to simulate the thermal cycling test obeyed by MIL-STD-883C. The temperatures of thermal cycling ranged from -55 ℃ to 125 ℃ with ramp rate of 36 ℃/min and a dwell time of 25 min at peak temperature. T he schematic drawing of diagonal cross-section of flip chip package composed of FR-4 substrate, silicon chip, underfill and solder bump was shown as Fig.1. Th e numerical model was two-dimensional (2-D) with plane strain assumption and o nly one half of the cross-section was modeled due to geometry symmetry. The dim ensions and boundary conditions of numerical model were shown in Fig.2. The symm etric boundary conditions were applied along the left edge of the model, and the left bottom corner was additional constrained in vertical direction to prevent body motion. The finite element meshes of overall and local numerical model was shown as Fig.3. In this study, two cases of material model were used to describe the material behavior of the underfill: the case1 was linear elastic model that assumed Young’s Modulus (E) and thermal expansion coefficient (CTE) were consta nt during thermal cycling; the case2 was MKIN model (in ANSYS) that had nonlinea r temperature-dependent stress-strain relationship and temperature-dependent CTE. The material model applied to the solder bump was ANAND model (in ANSYS) th at described time-dependent plasticity phenomenon of viscoplastic material. Bot h the FR-4 substrate and silicon chip were assumed as temperature-independent elastic material; moreover, FR-4 substrate is orthotropic while silicon chip is isotropic. From the comparison between numerical results of linear and nonlinear material a ssumption of underfill, (i.e. case1 and case2), the quantities of plastic strain around the interconnection from case1 are higher than that in case2. Thus, the linear展开更多
The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-...The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.展开更多
In order to get an insight into the thermal characteristic and to evaluate the thermal reliability of the "System in Packaging"(SIP), a new solution of electronics packaging, a heat transfer model of SIP was...In order to get an insight into the thermal characteristic and to evaluate the thermal reliability of the "System in Packaging"(SIP), a new solution of electronics packaging, a heat transfer model of SIP was developed to predict the heat dissipation capacity and to investigate the effect of different factors on the tempe rature distribution in the electronics. The affecting parameters under consideration include the thermophysical properties of the substrates, the coefficient of convection heat transfer, the thickness of the chip, and the density of power dissipation. ALGOR, a kind of finite element analysis software,was used to do the model simulation. Based on the simulation and analysis of the heat conduction and convection resistance, criteria for the thermal design were established and possible measurement for enhancing power dissipation was provided. The results show that the heat transfer model provides a new and effective way to the thermal design and thermal analysis of SIP and to the mechanical analysis for the further investigation of SIP.展开更多
The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of...The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.展开更多
China PrintingandPackagingStudy is an academicjournal ofspecializing in printing and packaging industries,found by China Academy of Printing Technology in 2009.It mainly reports monograph of the related theory and tec...China PrintingandPackagingStudy is an academicjournal ofspecializing in printing and packaging industries,found by China Academy of Printing Technology in 2009.It mainly reports monograph of the related theory and technology, research paper of theory and application and scientific results in printing and packaging fields.Including the technology of photoelectric imaging&digital imaging,theory and application research of character information and展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos.52475166,52175148)the Regional Collaboration Project of Shanxi Province(Grant No.202204041101044).
文摘Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to miniaturization of electronic components,it is challenging to directly measure or numerically predict the mechanical response of small-sized critical interconnections in board-level packaging structures to ensure the mechanical reliability of electronic devices in projectiles under harsh working conditions.To address this issue,an indirect measurement method using the Bayesian regularization-based load identification was proposed in this study based on finite element(FE)pre-dictions to estimate the load applied on critical interconnections of board-level packaging structures during the process of projectile penetration.For predicting the high-strain-rate penetration process,an FE model was established with elasto-plastic constitutive models of the representative packaging ma-terials(that is,solder material and epoxy molding compound)in which material constitutive parameters were calibrated against the experimental results by using the split-Hopkinson pressure bar.As the impact-induced dynamic bending of the printed circuit board resulted in an alternating tensile-compressive loading on the solder joints during penetration,the corner solder joints in the edge re-gions experience the highest S11 and strain,making them more prone to failure.Based on FE predictions at different structural scales,an improved Bayesian method based on augmented Tikhonov regulariza-tion was theoretically proposed to address the issues of ill-posed matrix inversion and noise sensitivity in the load identification at the critical solder joints.By incorporating a wavelet thresholding technique,the method resolves the problem of poor load identification accuracy at high noise levels.The proposed method achieves satisfactorily small relative errors and high correlation coefficients in identifying the mechanical response of local interconnections in board-level packaging structures,while significantly balancing the smoothness of response curves with the accuracy of peak identification.At medium and low noise levels,the relative error is less than 6%,while it is less than 10%at high noise levels.The proposed method provides an effective indirect approach for the boundary conditions of localized solder joints during the projectile penetration process,and its philosophy can be readily extended to other scenarios of multiscale analysis for highly nonlinear materials and structures under extreme loading conditions.
文摘Stacked chip scale package(SCSP) attracts more and more attentions in advanced packages application with light weight,thin and small size,high reliability,low power and high storage capability.However,more and more physical and electrical issues being caused by package-induced stress in SCSP were reported recently.The effect of structural factors,including die thickness,die attach film thickness,die attach film type,and spacer size on package induced stress,was investigated.Analyses were given based on simulation results and provide important suggestion for package design.
文摘The Siwalik Belt is a frontal fold\|thrust belt of the Himalayas and composed of thick sequence of foreland basin sediments derived from the Himalayas during the last 15 to 17 million years.From this Miocene belt in the central Nepal,we discovered exotic thrust packages of the Middle Proterozoic rocks,which has been regarded as the Siwalik Group or post\|collisional sediments correlatable with the Subathu or Murree Formation in India.The thrust belt,called the Bagmati Belt,is narrowly distributed in the Siwalik Belt,22km to the north of the Main Frontal Thrust (MFT or HFF) that is an active fault and considered to be the deformation front of the Himalayan orogen.The Main Boundary Thrust (MBT) which separates the Siwalik Belt from the Lesser Himalayan Belt runs 7km to the north of the thrust packages.Within the belt,tectonic slices of 400m to 1km in thickness are repeated three to five times due to thrusts,sandwiching a thin slice of the Siwalik beds.The thrust package consists of the pre\|Siwalik sedimetary rocks and sills of dolerite,and named as the Bagmati Group.The thickness is only about 800m due to tectonic repition by thrust,although the group has been considered to be a continuous sequence attaining 2200m in thickness.We divided the Bagmati Group into three formations,each of which shows an upward\|coarsening and thickening sequence of 200 to 350m in thickness.All sequence is composed of red\|brown orthoquartzite,pink quartzite,micaceous shale and thin sandstone interbed and rhythmite,mottled hematite and hematitic pisolite.We interpret that the Bagmati Group was deposited in shallow lacustrine and desert environments.
文摘Based on the principles of system engineering,economics theory and local conditionof production,studies carried out by taking“quadratic-regression-orthogonal-rotational” and ran-domized complete block designs to determine the Optimal Agronomical Practices Package（OAPP）for Wheat Modelized Cultivation Management（WMCM）by system decision-makinganalysis.The OAPP was expected to meet various goals of different levels of yield and economicbenefit of middle and high fertility land in Beijing area.Taking cultivar JINGDONG-1（"JD-1"）asan example,the OAPP for grain yield≥6750 kg/ha and net benefit≥360 US （?）/ha was consist-ed as follows:density=195 plants/m<sup>2</sup>;spring irrigation times=4（stem elongation,booting,flowering,and 20 days after anthesis）;fertilization=150-188 kg N/ha,113-128 kg P<sub>2</sub>O<sub>5</sub>/ha.
文摘The magnetic resonance spectroscopy(MRS)results are greatly influenced by reconstruction of the spectrum and quantitative analysis.Because of this requirement a number of programs dedicated to MRS data analysis were developed.The selection and use of appropriate software is crucial not only in clinical procedures,but also while carrying out scientific research.The choice of the software to suit the user's needs should be based on the analysis of the functionality of the program.It is particularly important from the user's viewpoint to identify what data can be loaded and processed in the program.The specific programs allow the user different degree of control over analysis parameters.Moreover,the programs for MRS data analysis differ in terms of the applied signal processing algorithms.The aim of this work,therefore,is to review available packages designed for MRS data analysis,taking into account their capabilities and limitations.
文摘In this paper, a microcomputer program package for pharmacokinetics and biopharmaceutics (PKBP) was presented. This package is applicable to various calculations for pharmacokinetics and biopharmaceutics. Some mathematical models and computing methods were developed. It has been used over 200 users.
文摘This paper introduces a software specially in calculating the contribution rate of machanization in agriculture by usng economy math method,computer technology and Visual Basic 6.0 version.The software package has friendly interface,simple operating way and accurate,feasible calculating method.It greatly changes the condition in the past which had considerable lots of data and miscellaneous and trivial methods,which were even hard to seek answer.So it has very high practicl value.
文摘The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joints to improve the reliabili ty of solder joints. When flip chip package specimen is tested with thermal cycl ing, the cyclic stress/strain response that exists at the underfill interfaces and solder joints may result in interfacial crack initiation and propagation. Therefore, the chip cracking and the interfacial delamination between underfill and chip corner have been investigated in many studies. Also, most researches h ave focused on the effect of fatigue and creep properties of solder joint induce d by the plastic strain alternation and accumulation. The nuderfill must have lo w viscosity in the liquid state and good adhesion to the interface after solidif ying. Also, the mechanical behavior of such epoxy material has much dependen ce on temperature in its glass transition temperature range that is usually cove red by the temperature range of thermal cycling test. Therefore, the materia l behavior of underfill exists a significant non-linearity and the assumption o f linear elastic can lack for accuracy in numerical analysis. Through numerical analysis, this study had some comparisons about the effect of linear and non -linear properties of underfill on strain behaviors around the interface of fli p chip assembly. Especially, the deformation tendency inside solder bumps could be predicted. Also, it is worthily mentioned that we have pointed out which comp onent of plastic strain, thus, either normal or shear, has dominant influence to the fatigue and creep of solder bump, which have not brought up before. About the numerical analysis to the thermal plastic strain occurs in flip chip i nterconnection during thermal cycling test, a commercial finite element software , namely, ANSYS, was employed to simulate the thermal cycling test obeyed by MIL-STD-883C. The temperatures of thermal cycling ranged from -55 ℃ to 125 ℃ with ramp rate of 36 ℃/min and a dwell time of 25 min at peak temperature. T he schematic drawing of diagonal cross-section of flip chip package composed of FR-4 substrate, silicon chip, underfill and solder bump was shown as Fig.1. Th e numerical model was two-dimensional (2-D) with plane strain assumption and o nly one half of the cross-section was modeled due to geometry symmetry. The dim ensions and boundary conditions of numerical model were shown in Fig.2. The symm etric boundary conditions were applied along the left edge of the model, and the left bottom corner was additional constrained in vertical direction to prevent body motion. The finite element meshes of overall and local numerical model was shown as Fig.3. In this study, two cases of material model were used to describe the material behavior of the underfill: the case1 was linear elastic model that assumed Young’s Modulus (E) and thermal expansion coefficient (CTE) were consta nt during thermal cycling; the case2 was MKIN model (in ANSYS) that had nonlinea r temperature-dependent stress-strain relationship and temperature-dependent CTE. The material model applied to the solder bump was ANAND model (in ANSYS) th at described time-dependent plasticity phenomenon of viscoplastic material. Bot h the FR-4 substrate and silicon chip were assumed as temperature-independent elastic material; moreover, FR-4 substrate is orthotropic while silicon chip is isotropic. From the comparison between numerical results of linear and nonlinear material a ssumption of underfill, (i.e. case1 and case2), the quantities of plastic strain around the interconnection from case1 are higher than that in case2. Thus, the linear
文摘The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.
文摘In order to get an insight into the thermal characteristic and to evaluate the thermal reliability of the "System in Packaging"(SIP), a new solution of electronics packaging, a heat transfer model of SIP was developed to predict the heat dissipation capacity and to investigate the effect of different factors on the tempe rature distribution in the electronics. The affecting parameters under consideration include the thermophysical properties of the substrates, the coefficient of convection heat transfer, the thickness of the chip, and the density of power dissipation. ALGOR, a kind of finite element analysis software,was used to do the model simulation. Based on the simulation and analysis of the heat conduction and convection resistance, criteria for the thermal design were established and possible measurement for enhancing power dissipation was provided. The results show that the heat transfer model provides a new and effective way to the thermal design and thermal analysis of SIP and to the mechanical analysis for the further investigation of SIP.
文摘The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.
文摘China PrintingandPackagingStudy is an academicjournal ofspecializing in printing and packaging industries,found by China Academy of Printing Technology in 2009.It mainly reports monograph of the related theory and technology, research paper of theory and application and scientific results in printing and packaging fields.Including the technology of photoelectric imaging&digital imaging,theory and application research of character information and
