Nanocomposite dielectrics show great promising application in developing next generation wearable all-solidstate cooling devices owing to the possessed advantages of high cooling efficiency, light-weight and small vol...Nanocomposite dielectrics show great promising application in developing next generation wearable all-solidstate cooling devices owing to the possessed advantages of high cooling efficiency, light-weight and small volume without the induced greenhouse effect or serious harm to ozone layer in the exploited refrigerants. However, low electrocaloric strength in nanocomposite dielectric is severely restricting its wide-spread application because of high applied operating voltage to improve electrocaloric effect. After addressing the chosen optimized ferroelectric ceramic and ferroelectric polymer matrix in conjunction with the analysis of crucial parameters, recent progress of electrocaloric effect(ECE) in polymer nanocomposites has been considerably reviewed. Subsequently, prior to proposing the conceptual design and devices/systems in electrocaloric nanocomposites, the existing developed devices/systems are reviewed. Finally, conclusions and prospects are conducted, including the aspects of materials chosen, structural design and key issues to be considered in improving electrocaloric effect of polymer nanocomposite dielectrics for flexible solidstate cooling devices.展开更多
Some novel grooved-sintered composite wick heat pipes(GSHP) were developed for the electronic device cooling.The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming an...Some novel grooved-sintered composite wick heat pipes(GSHP) were developed for the electronic device cooling.The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming and solid state sintering.The wick could be divided into two parts for liquid capillary pumping flow:groove sintered zone and uniform sintered zone.Both of the thermal resistance network model and the maximum heat transfer capability model of GSHP were built.Compared with the theoretical values,the heat transfer limit and thermal resistance of GSHP were measured from three aspects:copper powder size,wick thickness and number of micro grooves.The results show that the wick thickness has the greatest effect on the thermal resistance of GSHP while the copper powder size has the most important influence on the heat transfer limit.Given certain copper powder size and wick thickness,the thermal resistance of GSHP can be the lowest when micro-groove number is about 55.展开更多
基金Project(202045007) supported by the Start-up Funds for Outstanding Talents in Central South University,China。
文摘Nanocomposite dielectrics show great promising application in developing next generation wearable all-solidstate cooling devices owing to the possessed advantages of high cooling efficiency, light-weight and small volume without the induced greenhouse effect or serious harm to ozone layer in the exploited refrigerants. However, low electrocaloric strength in nanocomposite dielectric is severely restricting its wide-spread application because of high applied operating voltage to improve electrocaloric effect. After addressing the chosen optimized ferroelectric ceramic and ferroelectric polymer matrix in conjunction with the analysis of crucial parameters, recent progress of electrocaloric effect(ECE) in polymer nanocomposites has been considerably reviewed. Subsequently, prior to proposing the conceptual design and devices/systems in electrocaloric nanocomposites, the existing developed devices/systems are reviewed. Finally, conclusions and prospects are conducted, including the aspects of materials chosen, structural design and key issues to be considered in improving electrocaloric effect of polymer nanocomposite dielectrics for flexible solidstate cooling devices.
基金Project(51205423)supported by the National Natural Science Foundation of ChinaProject(2012M510205)supported by China Postdoctoral Science Foundation+1 种基金Project(S2012040007715)supported by Natural Science Foundation of Guangdong Province,ChinaProject(20120171120036)supported by New Teachers’Fund for Doctor Stations,Ministry of Education,China
文摘Some novel grooved-sintered composite wick heat pipes(GSHP) were developed for the electronic device cooling.The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming and solid state sintering.The wick could be divided into two parts for liquid capillary pumping flow:groove sintered zone and uniform sintered zone.Both of the thermal resistance network model and the maximum heat transfer capability model of GSHP were built.Compared with the theoretical values,the heat transfer limit and thermal resistance of GSHP were measured from three aspects:copper powder size,wick thickness and number of micro grooves.The results show that the wick thickness has the greatest effect on the thermal resistance of GSHP while the copper powder size has the most important influence on the heat transfer limit.Given certain copper powder size and wick thickness,the thermal resistance of GSHP can be the lowest when micro-groove number is about 55.
