An experimental investigation is carried out to machine SiC ceramic material through the method of high speed plane lapping with solid(fixed) abrasives after the critical condition of brittle-ductile transition is the...An experimental investigation is carried out to machine SiC ceramic material through the method of high speed plane lapping with solid(fixed) abrasives after the critical condition of brittle-ductile transition is theoretically analyzed. The results show that the material removal mechanism and the surface roughness are chiefly related to the granularity of abrasives for brittle materials such as SiC ceramic. It is easily realized to machine SiC ceramic in the ductile mode using W3.5 grit and a high efficiency, low cost and smooth surface with a surface roughness of R_a 2.4?nm can be achieved.展开更多
Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing process...Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing processes. A critical issue in wafer production is the waviness induced by wire sawing. If this waviness is not removed, it will affect wafer flatness and semiconductor performance. In practice, both lapping and grinding have been used to flatten wire-sawn wafers. Although grinding is not as effective as lapping in removing waviness, it has many other advantages over lapping (such as higher throughput, fully automatic, and more benign to environment) and has great potential to reduce manufacturing cost of silicon wafers. This paper presents a finite element analysis (FEA) study on grinding and lapping of wire-sawn silicon wafers. An FEA model is first developed to simulate the waviness deformation of wire-sawn wafers in grinding and lapping processes. It is then used to explain how the waviness is removed or reduced by lapping and grinding and why the effectiveness of grinding in removing waviness is different from that of lapping. Furthermore, the model is used to study the effects of various parameters including active-grinding-zone orientation, grinding force, waviness wavelength, and waviness height on the reduction and elimination of waviness. Finally, the results of pilot experiments to verify the model are discussed.展开更多
太阳能光伏发电已成为仅次于水电和风能的第三大可再生能源,光伏发电受云量时空变化的影响较大,因此准确模拟云天太阳辐射的时空变化对电网安全运行至关重要。围绕如何减小中尺度气象模式的云初始场误差,进而改进云天的太阳辐射模拟这...太阳能光伏发电已成为仅次于水电和风能的第三大可再生能源,光伏发电受云量时空变化的影响较大,因此准确模拟云天太阳辐射的时空变化对电网安全运行至关重要。围绕如何减小中尺度气象模式的云初始场误差,进而改进云天的太阳辐射模拟这一关键科学问题,本文通过研究基于卫星资料同化的LAPS(Local Analysis Prediction System)多时间层三维云分析同化方法,改进三维云结构,并将LAPS模式输出结果作为WRF(Weather Research and Forecasting)模式的初始场,模拟了2008年1月及夏季(6~8月)北京地区的总云量和总辐射的时空分布,重点分析了多云和有降水天气过程总辐射的模拟改进效果及其原因。结果表明,同化前后的总云量模拟值与观测值的时间变化趋势基本一致,但大部分时次总云量的模拟值低于观测值;大部分多云及降水时段同化后总云量模拟值较接近于实测值。1月晴天、多云天以及夏季晴天同化前后总辐射模拟值与实测值的时间变化趋势较一致,但同化前后两者的相关性差异不明显;晴天条件下同化前后总辐射模拟值均低于实测值,1月多云条件下多数时段同化后总辐射模拟误差减小不明显,与总云量的改进效果不显著有关。夏季多云、有降水及6月典型降水三种天气条件下同化前后总辐射模拟值与观测值的相关性稍差,同化后两者的相关性较同化前有所改进,尤其是6月典型降水过程改进效果较明显;同化前总辐射模拟误差较大,而同化后误差显著减小,尤其是6月典型降水过程同化后均方根误差和平均相对误差较同化前分别减小了102.6 W m^(-2)和355.9%,最大相对误差减小更显著;同化后总辐射模拟误差小于同化前的比例高达75%,即大部分时刻同化后模拟误差小于同化前。多云和有降水天气过程总辐射模拟效果的显著改进与总云量的改进密切相关,即同化后总云量模拟值增加,云的反射和散射作用增强,导致模拟总辐射减小,即更接近于实测总辐射值。研究结果对于多云和降水天气条件下太阳辐射的模拟效果改进、太阳能资源客观评估以及光伏电站的发电量预测具有一定的科学和实际应用价值。展开更多
利用LAPS(Local Analysis and Prediction System)系统同化GPS(Global Positioning System)/PWV(Precipitable Water Vapor)资料,分析GPS/PWV资料对LAPS输出场的影响,并结合WRF模式,将LAPS输出场作为其初始场进行降水预报,进一步考察GPS...利用LAPS(Local Analysis and Prediction System)系统同化GPS(Global Positioning System)/PWV(Precipitable Water Vapor)资料,分析GPS/PWV资料对LAPS输出场的影响,并结合WRF模式,将LAPS输出场作为其初始场进行降水预报,进一步考察GPS/PWV资料对降水预报的作用。选取2009年6月28日湖北地区的一次强降水过程,设计三种方案进行试验。结果表明:同化GPS/PWV资料后对LAPS湿度场有显著的改善,而对高度场及风场的作用则不明显;GPS/PWV资料对区域平均可降水量的影响比雷达资料大一个量级;与此同时,利用多种评分方法对6 h累计降水做了检验,分析结果表明同化GPS/PWV资料能够有效地改进WRF模式的初始场,增加丰富的中小尺度信息,并对随后的确定性预报产生正影响。展开更多
文摘An experimental investigation is carried out to machine SiC ceramic material through the method of high speed plane lapping with solid(fixed) abrasives after the critical condition of brittle-ductile transition is theoretically analyzed. The results show that the material removal mechanism and the surface roughness are chiefly related to the granularity of abrasives for brittle materials such as SiC ceramic. It is easily realized to machine SiC ceramic in the ductile mode using W3.5 grit and a high efficiency, low cost and smooth surface with a surface roughness of R_a 2.4?nm can be achieved.
文摘Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure on silicon wafer manufacturers to develop cost-effective manufacturing processes. A critical issue in wafer production is the waviness induced by wire sawing. If this waviness is not removed, it will affect wafer flatness and semiconductor performance. In practice, both lapping and grinding have been used to flatten wire-sawn wafers. Although grinding is not as effective as lapping in removing waviness, it has many other advantages over lapping (such as higher throughput, fully automatic, and more benign to environment) and has great potential to reduce manufacturing cost of silicon wafers. This paper presents a finite element analysis (FEA) study on grinding and lapping of wire-sawn silicon wafers. An FEA model is first developed to simulate the waviness deformation of wire-sawn wafers in grinding and lapping processes. It is then used to explain how the waviness is removed or reduced by lapping and grinding and why the effectiveness of grinding in removing waviness is different from that of lapping. Furthermore, the model is used to study the effects of various parameters including active-grinding-zone orientation, grinding force, waviness wavelength, and waviness height on the reduction and elimination of waviness. Finally, the results of pilot experiments to verify the model are discussed.
文摘太阳能光伏发电已成为仅次于水电和风能的第三大可再生能源,光伏发电受云量时空变化的影响较大,因此准确模拟云天太阳辐射的时空变化对电网安全运行至关重要。围绕如何减小中尺度气象模式的云初始场误差,进而改进云天的太阳辐射模拟这一关键科学问题,本文通过研究基于卫星资料同化的LAPS(Local Analysis Prediction System)多时间层三维云分析同化方法,改进三维云结构,并将LAPS模式输出结果作为WRF(Weather Research and Forecasting)模式的初始场,模拟了2008年1月及夏季(6~8月)北京地区的总云量和总辐射的时空分布,重点分析了多云和有降水天气过程总辐射的模拟改进效果及其原因。结果表明,同化前后的总云量模拟值与观测值的时间变化趋势基本一致,但大部分时次总云量的模拟值低于观测值;大部分多云及降水时段同化后总云量模拟值较接近于实测值。1月晴天、多云天以及夏季晴天同化前后总辐射模拟值与实测值的时间变化趋势较一致,但同化前后两者的相关性差异不明显;晴天条件下同化前后总辐射模拟值均低于实测值,1月多云条件下多数时段同化后总辐射模拟误差减小不明显,与总云量的改进效果不显著有关。夏季多云、有降水及6月典型降水三种天气条件下同化前后总辐射模拟值与观测值的相关性稍差,同化后两者的相关性较同化前有所改进,尤其是6月典型降水过程改进效果较明显;同化前总辐射模拟误差较大,而同化后误差显著减小,尤其是6月典型降水过程同化后均方根误差和平均相对误差较同化前分别减小了102.6 W m^(-2)和355.9%,最大相对误差减小更显著;同化后总辐射模拟误差小于同化前的比例高达75%,即大部分时刻同化后模拟误差小于同化前。多云和有降水天气过程总辐射模拟效果的显著改进与总云量的改进密切相关,即同化后总云量模拟值增加,云的反射和散射作用增强,导致模拟总辐射减小,即更接近于实测总辐射值。研究结果对于多云和降水天气条件下太阳辐射的模拟效果改进、太阳能资源客观评估以及光伏电站的发电量预测具有一定的科学和实际应用价值。
文摘利用LAPS(Local Analysis and Prediction System)系统同化GPS(Global Positioning System)/PWV(Precipitable Water Vapor)资料,分析GPS/PWV资料对LAPS输出场的影响,并结合WRF模式,将LAPS输出场作为其初始场进行降水预报,进一步考察GPS/PWV资料对降水预报的作用。选取2009年6月28日湖北地区的一次强降水过程,设计三种方案进行试验。结果表明:同化GPS/PWV资料后对LAPS湿度场有显著的改善,而对高度场及风场的作用则不明显;GPS/PWV资料对区域平均可降水量的影响比雷达资料大一个量级;与此同时,利用多种评分方法对6 h累计降水做了检验,分析结果表明同化GPS/PWV资料能够有效地改进WRF模式的初始场,增加丰富的中小尺度信息,并对随后的确定性预报产生正影响。
