期刊文献+
共找到3篇文章
< 1 >
每页显示 20 50 100
Numerical Simulation and Experimental Verification of Temperature Distribution of Piezoelectric Stack with Heating and Thermal Insulation Device
1
作者 CHEN Yixiao YANG Xinghua +1 位作者 YU Li SHEN Xing 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI CSCD 2021年第S01期17-23,共7页
This paper discusses the temperature field distribution of piezoelectric stack with heating and thermal insulation device in cryogenic temperature environment. Firstly,the model of the piezoelectric damper is simplifi... This paper discusses the temperature field distribution of piezoelectric stack with heating and thermal insulation device in cryogenic temperature environment. Firstly,the model of the piezoelectric damper is simplified and established by using partial-differential heat conduction equation. Secondly,the two-dimensional Du Fort-Frankel finite difference scheme is used to discretize the thermal conduction equation,and the numerical solution of the transient temperature field of piezoelectric stack driven by heating film at different positions is obtained by programming iteration. Then,the cryogenic temperature cabinet is used to simulate the low temperature environment to verify the numerical analysis results of the temperature field. Finally,the finite difference results are compared with the finite results and the experimental data in steady state and transient state,respectively. Comparison shows that the results of the finite difference method are basically consistent with the finite element and the experimental results,but the calculation time is shorter. The temperature field distribution results obtained by the finite difference method can verify the thermal insulation performance of the heating system and provide data basis for the temperature control of piezoelectric stack. 展开更多
关键词 thermal differential equation temperature field finite difference piezoelectric stack heating and thermal insulation device
在线阅读 下载PDF
Flexible and electrically robust graphene-based nanocomposite paper with hierarchical microstructures for multifunctional wearable devices
2
作者 Zhen-Hua Tang Wei-Bin Zhu +4 位作者 Jun-Zhang Chen Yuan-Qing Li Pei Huang Kin Liao Shao-Yun Fu 《Nano Materials Science》 EI CAS CSCD 2023年第3期319-328,共10页
Multifunctional and flexible wearable devices play a crucial role in a wide range of applications,such as heath monitoring,intelligent skins,and human-machine interactions.Developing flexible and conductive materials ... Multifunctional and flexible wearable devices play a crucial role in a wide range of applications,such as heath monitoring,intelligent skins,and human-machine interactions.Developing flexible and conductive materials for multifunctional wearable devices with low-cost and high efficiency methods are highly desirable.Here,a conductive graphene/microsphere/bamboo fiber(GMB)nanocomposite paper with hierarchical surface microstructures is successfully fabricated through a simple vacuum-assisted filtration followed by thermo-foaming process.The as-prepared microstructured GMB nanocomposite paper exhibits not only a high volume electrical conductivity of~45 S/m but also an excellent electrical stability(i.e.,relative changes in resistance are less than 3%under stretching,folding,and compressing loadings)due to its unique structure features.With this microstructured nanocomposite paper as active sensing layer,microstructured pressure sensors with a high sensitivity(-4 kPa^(-1)),a wide sensing range(0–5 kPa),and a rapid response time(about 140 ms)are realized.In addition,benefitting from the outstanding electrical stability and mechanical flexibility,the microstructured nanocomposite paper is further demonstrated as a low-voltage Joule heating device.The surface temperature of the microstructured nanocomposite paper rapidly reaches over 80℃ when applying a relatively low voltage of 7 V,indicating its potential in human thermotherapy and thermal management. 展开更多
关键词 GRAPHENE Bamboo fibers MICROSPHERES Pressure sensors Joule heating devices
在线阅读 下载PDF
A BLOCK-CENTERED UPWIND APPROXIMATION OF THE SEMICONDUCTOR DEVICE PROBLEM ON A DYNAMICALLY CHANGING MESH
3
作者 Yirang YUAN Changfeng LI Huailing SONG 《Acta Mathematica Scientia》 SCIE CSCD 2020年第5期1405-1428,共24页
The numerical simulation of a three-dimensional semiconductor device is a fundamental problem in information science. The mathematical model is defined by an initialboundary nonlinear system of four partial differenti... The numerical simulation of a three-dimensional semiconductor device is a fundamental problem in information science. The mathematical model is defined by an initialboundary nonlinear system of four partial differential equations: an elliptic equation for electric potential, two convection-diffusion equations for electron concentration and hole concentration, and a heat conduction equation for temperature. The first equation is solved by the conservative block-centered method. The concentrations and temperature are computed by the block-centered upwind difference method on a changing mesh, where the block-centered method and upwind approximation are used to discretize the diffusion and convection, respectively. The computations on a changing mesh show very well the local special properties nearby the P-N junction. The upwind scheme is applied to approximate the convection, and numerical dispersion and nonphysical oscillation are avoided. The block-centered difference computes concentrations, temperature, and their adjoint vector functions simultaneously.The local conservation of mass, an important rule in the numerical simulation of a semiconductor device, is preserved during the computations. An optimal order convergence is obtained. Numerical examples are provided to show efficiency and application. 展开更多
关键词 three-dimensional semiconductor device of heat conduction block-centered upwind difference on a changing mesh local conservation of mass convergence analysis numerical computation
在线阅读 下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部