Low-frequency signals have been proven valuable in the fields of target detection and geological exploration.Nevertheless,the practical implementation of these signals is hindered by large antenna diameters,limiting t...Low-frequency signals have been proven valuable in the fields of target detection and geological exploration.Nevertheless,the practical implementation of these signals is hindered by large antenna diameters,limiting their potential applications.Therefore,it is imperative to study the creation of lowfrequency signals using antennas with suitable dimensions.In contrast to conventional mechanical antenna techniques,our study generates low-frequency signals in the spatial domain utilizing the principle of the Doppler effect.We also defines the antenna array architecture,the timing sequency,and the radiating element signal waveform,and provides experimental prototypes including 8/64 antennas based on earlier research.In the conducted experiments,121 MHz,40 MHz,and 10 kHz composite signals are generated by 156 MHz radiating element signals.The composite signal spectrum matches the simulations,proving our low-frequency signal generating method works.This holds significant implications for research on generating low-frequency signals with small-sized antennas.展开更多
The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-...The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.展开更多
基金Science and Technology Project of Aerospace Information Research Institute,Chinese Academy of Sciences(Y910340Z2F)Science and Technology Project of BBEF(E3E2010201)。
文摘Low-frequency signals have been proven valuable in the fields of target detection and geological exploration.Nevertheless,the practical implementation of these signals is hindered by large antenna diameters,limiting their potential applications.Therefore,it is imperative to study the creation of lowfrequency signals using antennas with suitable dimensions.In contrast to conventional mechanical antenna techniques,our study generates low-frequency signals in the spatial domain utilizing the principle of the Doppler effect.We also defines the antenna array architecture,the timing sequency,and the radiating element signal waveform,and provides experimental prototypes including 8/64 antennas based on earlier research.In the conducted experiments,121 MHz,40 MHz,and 10 kHz composite signals are generated by 156 MHz radiating element signals.The composite signal spectrum matches the simulations,proving our low-frequency signal generating method works.This holds significant implications for research on generating low-frequency signals with small-sized antennas.
文摘The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.
