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Cookie Baking Process Optimization and Quality Analysis Based on Food 3D Printing
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作者 Liu Chenghai Li Jingyi +2 位作者 Wu Chunsheng Zhao Xinglong Zheng Xianzhe 《Journal of Northeast Agricultural University(English Edition)》 CAS 2024年第1期61-73,共13页
In order to obtain better quality cookies, food 3D printing technology was employed to prepare cookies. The texture, color, deformation, moisture content, and temperature of the cookie as evaluation indicators, the in... In order to obtain better quality cookies, food 3D printing technology was employed to prepare cookies. The texture, color, deformation, moisture content, and temperature of the cookie as evaluation indicators, the influences of baking process parameters, such as baking time, surface heating temperature and bottom heating temperature, on the quality of the cookie were studied to optimize the baking process parameters. The results showed that the baking process parameters had obvious effects on the texture, color, deformation, moisture content, and temperature of the cookie. All of the roasting surface heating temperature, bottom heating temperature and baking time had positive influences on the hardness, crunchiness, crispiness, and the total color difference(ΔE) of the cookie. When the heating temperatures of the surfac and bottom increased, the diameter and thickness deformation rate of the cookie increased. However,with the extension of baking time, the diameter and thickness deformation rate of the cookie first increased and then decreased. With the surface heating temperature of 180 ℃, the bottom heating temperature of 150 ℃, and baking time of 15 min, the cookie was crisp and moderate with moderate deformation and uniform color. There was no burnt phenomenon with the desired quality. Research results provided a theoretical basis for cookie manufactory based on food 3D printing technology. 展开更多
关键词 food 3D printing baking process COOKIE quality analysis optimization of process parameter
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Research on multi-scale simulation and dynamic verification of high dynamic MEMS components in additive manufacturing
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作者 Sining Lv Hengzhen Feng +2 位作者 Wenzhong Lou Chuan Xiao Shiyi Li 《Defence Technology(防务技术)》 2025年第5期275-291,共17页
Metal Additive Manufacturing(MAM) technology has become an important means of rapid prototyping precision manufacturing of special high dynamic heterogeneous complex parts. In response to the micromechanical defects s... Metal Additive Manufacturing(MAM) technology has become an important means of rapid prototyping precision manufacturing of special high dynamic heterogeneous complex parts. In response to the micromechanical defects such as porosity issues, significant deformation, surface cracks, and challenging control of surface morphology encountered during the selective laser melting(SLM) additive manufacturing(AM) process of specialized Micro Electromechanical System(MEMS) components, multiparameter optimization and micro powder melt pool/macro-scale mechanical properties control simulation of specialized components are conducted. The optimal parameters obtained through highprecision preparation and machining of components and static/high dynamic verification are: laser power of 110 W, laser speed of 600 mm/s, laser diameter of 75 μm, and scanning spacing of 50 μm. The density of the subordinate components under this reference can reach 99.15%, the surface hardness can reach 51.9 HRA, the yield strength can reach 550 MPa, the maximum machining error of the components is 4.73%, and the average surface roughness is 0.45 μm. Through dynamic hammering and high dynamic firing verification, SLM components meet the requirements for overload resistance. The results have proven that MEM technology can provide a new means for the processing of MEMS components applied in high dynamic environments. The parameters obtained in the conclusion can provide a design basis for the additive preparation of MEMS components. 展开更多
关键词 Additive manufacturing High dynamic MEMS components Multiscale control process optimization High dynamic verification
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DOA estimation via sparse recovering from the smoothed covariance vector 被引量:1
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作者 Jingjing Cai Dan Bao Peng Li 《Journal of Systems Engineering and Electronics》 SCIE EI CSCD 2016年第3期555-561,共7页
A direction of arrival(DOA) estimation algorithm is proposed using the concept of sparse representation. In particular, a new sparse signal representation model called the smoothed covariance vector(SCV) is establ... A direction of arrival(DOA) estimation algorithm is proposed using the concept of sparse representation. In particular, a new sparse signal representation model called the smoothed covariance vector(SCV) is established, which is constructed using the lower left diagonals of the covariance matrix. DOA estimation is then achieved from the SCV by sparse recovering, where two distinguished error limit estimation methods of the constrained optimization are proposed to make the algorithms more robust. The algorithm shows robust performance on DOA estimation in a uniform array, especially for coherent signals. Furthermore, it significantly reduces the computational load compared with those algorithms based on multiple measurement vectors(MMVs). Simulation results validate the effectiveness and efficiency of the proposed algorithm. 展开更多
关键词 array signal processing convex optimization direction of arrival(DOA) estimation sparse representation
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