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Mobility enhancement of strained GaSb p-channel metal-oxide-semiconductor field-effect transistors with biaxial compressive strain 被引量:2
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作者 陈燕文 谭桢 +6 位作者 赵连锋 王敬 刘易周 司晨 袁方 段文晖 许军 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第3期448-452,共5页
Various biaxial compressive strained GaSb p-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) are experimentally and theoretically investigated, The biaxial compressive strained GaSb MOSFETs show ... Various biaxial compressive strained GaSb p-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) are experimentally and theoretically investigated, The biaxial compressive strained GaSb MOSFETs show a high peak mobility of 638 cm2/V.s, which is 3.86 times of the extracted mobility of the fabricated GaSb MOSFETs without strain. Meanwhile, first principles calculations show that the hole effective mass of GaSb depends on the biaxial compressive strain. The biaxiai compressive strain brings a remarkable enhancement of the hole mobility caused by a significant reduction in the hole effective mass due to the modulation of the valence bands. 展开更多
关键词 GASB metal-oxide-semiconductor field-effect transistor STRAIN first principles calculations
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Modeling electric field of power metal-oxide-semiconductor field-effect transistor with dielectric trench based on Schwarz–Christoffel transformation 被引量:1
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作者 Zhi-Gang Wang Tao Liao Ya-Nan Wang 《Chinese Physics B》 SCIE EI CAS CSCD 2019年第5期366-373,共8页
A power metal-oxide-semiconductor field-effect transistor(MOSFET) with dielectric trench is investigated to enhance the reversed blocking capability. The dielectric trench with a low permittivity to reduce the electri... A power metal-oxide-semiconductor field-effect transistor(MOSFET) with dielectric trench is investigated to enhance the reversed blocking capability. The dielectric trench with a low permittivity to reduce the electric field at reversed blocking state has been studied. To analyze the electric field, the drift region is segmented into four regions, where the conformal mapping method based on Schwarz–Christoffel transformation has been applied. According to the analysis, the improvement in the electric field for using the low permittivity trench is mainly due to the two electric field peaks generated in the drift region around this dielectric trench. The analytical results of the electric field and the potential models are in good agreement with the simulation results. 展开更多
关键词 CONFORMAL mapping Schwarz–Christoffel TRANSFORMATION electric field TRENCH metal-oxidesemiconductor field-effect transistor (mosfet) breakdown voltage
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Effect of depositing PCBM on perovskite-based metal–oxide–semiconductor field effect transistors 被引量:1
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作者 Su-Zhen Luan Yu-Cheng Wang +1 位作者 Yin-Tao Liu Ren-Xu Jia 《Chinese Physics B》 SCIE EI CAS CSCD 2018年第4期391-395,共5页
In this manuscript,the perovskite-based metal–oxide–semiconductor field effect transistors(MOSFETs) with phenylC61-butyric acid methylester(PCBM) layers are studied.The MOSFETs are fabricated on perovskites,and ... In this manuscript,the perovskite-based metal–oxide–semiconductor field effect transistors(MOSFETs) with phenylC61-butyric acid methylester(PCBM) layers are studied.The MOSFETs are fabricated on perovskites,and characterized by photoluminescence spectra(PL),x-ray diffraction(XRD),and x-ray photoelectron spectroscopy(XPS).With PCBM layers,the current–voltage hysteresis phenomenon is effetely inhibited,and both the transfer and output current values increase.The band energy diagrams are proposed,which indicate that the electrons are transferred into the PCBM layer,resulting in the increase of photocurrent.The electron mobility and hole mobility are extracted from the transfer curves,which are about one order of magnitude as large as those of PCBM deposited,which is the reason why the electrons are transferred into the PCBM layer and the holes are still in the perovskites,and the effects of ionized impurity scattering on carrier transport become smaller. 展开更多
关键词 metal-oxide-semiconductor field effect transistors photoelectric characteristics PEROVSKITE
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Evaluation of a gate-first process for AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors with low ohmic annealing temperature 被引量:1
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作者 李柳暗 张家琦 +1 位作者 刘扬 敖金平 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第3期445-447,共3页
In this paper, TiN/A1Ox gated A1GaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOS- HFETs) were fabricated for gate-first process evaluation. By employing a low temperature ohmic process... In this paper, TiN/A1Ox gated A1GaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOS- HFETs) were fabricated for gate-first process evaluation. By employing a low temperature ohmic process, ohmic contact can be obtained by annealing at 600 ℃ with the contact resistance approximately 1.6 Ω.mm. The ohmic annealing process also acts as a post-deposition annealing on the oxide film, resulting in good device performance. Those results demonstrated that the TiN/A1Ox gated MOS-HFETs with low temperature ohmic process can be applied for self-aligned gate AIGaN/GaN MOS-HFETs. 展开更多
关键词 metal-oxide-semiconductor heterostructure field-effect transistors low temperature ohmic pro-cess inductively coupled plasma
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Fabrication and characterization of the normally-off N-channel lateral 4H–SiC metal–oxide–semiconductor field-effect transistors
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作者 宋庆文 汤晓燕 +8 位作者 何艳静 唐冠男 王悦湖 张艺蒙 郭辉 贾仁需 吕红亮 张义门 张玉明 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第3期362-365,共4页
In this paper, the normally-off N-channel lateral 4H-SiC metal-oxide-semiconductor field-effect transistors (MOSF- FETs) have been fabricated and characterized. A sandwich- (nitridation-oxidation-nitridation) type... In this paper, the normally-off N-channel lateral 4H-SiC metal-oxide-semiconductor field-effect transistors (MOSF- FETs) have been fabricated and characterized. A sandwich- (nitridation-oxidation-nitridation) type process was used to grow the gate dielectric film to obtain high channel mobility. The interface properties of 4H-SiC/SiO2 were examined by the measurement of HF l-V, G-V, and C-V over a range of frequencies. The ideal C-V curve with little hysteresis and the frequency dispersion were observed. As a result, the interface state density near the conduction band edge of 4H-SiC was reduced to 2 x 1011 eV-l.cm-2, the breakdown field of the grown oxides was about 9.8 MV/cm, the median peak field- effect mobility is about 32.5 cm2.V-1 .s-1, and the maximum peak field-effect mobility of 38 cm2-V-1 .s-1 was achieved in fabricated lateral 4H-SiC MOSFFETs. 展开更多
关键词 metal-oxide-semiconductor field-effect transistors 4H-SIC field-effect mobility oxidation pro-cess
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Stacked lateral double-diffused metal–oxide–semiconductor field effect transistor with enhanced depletion effect by surface substrate
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作者 Qi Li Zhao-Yang Zhang +3 位作者 Hai-Ou Li Tang-You Sun Yong-He Chen Yuan Zuo 《Chinese Physics B》 SCIE EI CAS CSCD 2019年第3期328-332,共5页
A stacked lateral double-diffused metal–oxide–semiconductor field-effect transistor(LDMOS) with enhanced depletion effect by surface substrate is proposed(ST-LDMOS), which is compatible with the traditional CMOS pro... A stacked lateral double-diffused metal–oxide–semiconductor field-effect transistor(LDMOS) with enhanced depletion effect by surface substrate is proposed(ST-LDMOS), which is compatible with the traditional CMOS processes. The new stacked structure is characterized by double substrates and surface dielectric trenches(SDT). The drift region is separated by the P-buried layer to form two vertically parallel devices. The doping concentration of the drift region is increased benefiting from the enhanced auxiliary depletion effect of the double substrates, leading to a lower specific on-resistance(Ron,sp). Multiple electric field peaks appear at the corners of the SDT, which improves the lateral electric field distribution and the breakdown voltage(BV). Compared to a conventional LDMOS(C-LDMOS), the BV in the ST-LDMOS increases from 259 V to 459 V, an improvement of 77.22%. The Ron,sp decreases from 39.62 m?·cm^2 to 23.24 m?·cm^2 and the Baliga's figure of merit(FOM) of is 9.07 MW/cm^2. 展开更多
关键词 double substrates SURFACE dielectric trench stacked LATERAL double-diffused metaloxide semiconductor field-effect transistor(ST-LDMOS) breakdown voltage
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Influences of fringing capacitance on threshold voltage and subthreshold swing of a GeOI metal-oxide-semiconductor field-effect transistor
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作者 范敏敏 徐静平 +2 位作者 刘璐 白玉蓉 黄勇 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第3期327-331,共5页
Models of threshold voltage and subthreshold swing, including the fringing-capacitance effects between the gate electrode and the surface of the source/drain region, are proposed. The validity of the proposed models i... Models of threshold voltage and subthreshold swing, including the fringing-capacitance effects between the gate electrode and the surface of the source/drain region, are proposed. The validity of the proposed models is confirmed by the good agreement between the simulated results and the experimental data. Based on the models, some factors impacting the threshold voltage and subthreshold swing of a GeOI metal-oxide-semiconductor field-effect transistor(MOSFET) are discussed in detail and it is found that there is an optimum thickness of gate oxide for definite dielectric constant of gate oxide to obtain the minimum subthreshold swing. As a result, it is shown that the fringing-capacitance effect of a shortchannel GeOI MOSFET cannot be ignored in calculating the threshold voltage and subthreshold swing. 展开更多
关键词 GeOI metal-oxide-semiconductor field-effect transistor fringing capacitance subthreshold swing threshold voltage
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GaSb p-channel metal-oxide-semiconductor field-effect transistor and its temperature dependent characteristics
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作者 赵连锋 谭桢 +1 位作者 王敬 许军 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第1期524-527,共4页
GaSb p-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) with an atomic layer deposited Al2O3 gate dielectric and a self-aligned Si-implanted source/drain are experimentally demonstrated. Temperat... GaSb p-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) with an atomic layer deposited Al2O3 gate dielectric and a self-aligned Si-implanted source/drain are experimentally demonstrated. Temperature dependent electrical characteristics are investigated. Different electrical behaviors are observed in two temperature regions, and the un- derlying mechanisms are discussed. It is found that the reverse-bias pn junction leakage of the drain/substrate is the main component of the off-state drain leakage current, which is generation-current dominated in the low temperature regions and is diffusion-current dominated in the high temperature regions. Methods to further reduce the off-state drain leakage current are given. 展开更多
关键词 GASB metal-oxide-semiconductor field-effect transistor temperature dependent characteristics drain leakage current
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The study on mechanism and model of negative bias temperature instability degradation in P-channel metal-oxide-semiconductor field-effect transistors
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作者 曹艳荣 马晓华 +1 位作者 郝跃 田文超 《Chinese Physics B》 SCIE EI CAS CSCD 2010年第9期564-569,共6页
Negative Bias Temperature Instability (NBTI) has become one of the most serious reliability problems of metaloxide-semiconductor field-effect transistors (MOSFETs). The degradation mechanism and model of NBTI are ... Negative Bias Temperature Instability (NBTI) has become one of the most serious reliability problems of metaloxide-semiconductor field-effect transistors (MOSFETs). The degradation mechanism and model of NBTI are studied in this paper. From the experimental results, the exponential value 0.25-0.5 which represents the relation of NBTI degradation and stress time is obtained. Based on the experimental results and existing model, the reaction-diffusion model with H^+ related species generated is deduced, and the exponent 0.5 is obtained. The results suggest that there should be H^+ generated in the NBTI degradation. With the real time method, the degradation with an exponent 0.5 appears clearly in drain current shift during the first seconds of stress and then verifies that H^+ generated during NBTI stress. 展开更多
关键词 NBTI 90nm p-channel metal-oxide-semiconductor field-effect transistors (PMOS-FETs) model
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InGaAs纳电子学的进展 被引量:1
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作者 赵正平 《微纳电子技术》 北大核心 2016年第4期209-219,226,共12页
InGaAs HEMT器件和纳米加工技术的结合推动了InGaAs纳电子学的发展,在太赫兹和后CMOS逻辑电路两大领域产生重要影响。综述了InGaAs纳电子学近10年在两大领域的发展路径和最新进展。在太赫兹领域,InGaAs纳电子学以InGaAs HEMT发展为主,... InGaAs HEMT器件和纳米加工技术的结合推动了InGaAs纳电子学的发展,在太赫兹和后CMOS逻辑电路两大领域产生重要影响。综述了InGaAs纳电子学近10年在两大领域的发展路径和最新进展。在太赫兹领域,InGaAs纳电子学以InGaAs HEMT发展为主,沿着提高沟道In组分、缩小T型栅长、减少势垒层厚度和寄生电阻的技术路线发展。InGaAs太赫兹单片集成电路(TMIC)的工作频率达到1 THz,成为目前工作频率最高的晶体管。在后CMOS逻辑电路领域,InGaAs纳电子学以InGaAs MOSFET发展为主,沿着提高复合量子阱沟道中的In组分、缩小平面器件结构中的栅长、缩小立体器件结构中的鳍宽、减少埋栅结构中复合高k介质栅厚度、减少寄生电阻和在大尺寸Si晶圆上与Ge MOSFET共集成的技术路线发展。鳍宽为30 nm的InGaAs FinFET的亚阈值斜率(SS)为82 mV/dec,漏感生势垒降低(DIBL)为10 mV/V,最大跨导(g_(m,max))为1.8 mS/μm,导通电流(I_(ON))为0.41 mA/μm,关断电流(I_(OFF))为0.1μA/μm,其性能优于同尺寸的Si FinFET,具有成为后CMOS的7 nm节点后替代NMOSFET器件的潜力。 展开更多
关键词 纳电子学 ingaas INAS InP高电子迁移率晶体管(HEMT) GaAs变构高电子迁移率晶体管(MHEMT) ingaas金属氧化物半导体场效应晶体管(mosfet) 太赫兹 后互补金属氧化物半导体(CMOS)
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Effect of the Si-doped In_(0.49)Ga_(0.51)P barrier layer on the device performance of In_(0.4)Ga_(0.6)As MOSFETs grown on semi-insulating GaAs substrates 被引量:1
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作者 常虎东 孙兵 +4 位作者 薛百清 刘桂明 赵威 王盛凯 刘洪刚 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第7期463-466,共4页
In0.4Ga0.6As channel metal-oxide-semiconductor field-effect transistors (MOSFETs) with and without an Si-doped In0.49Ga0.51P barrier layer grown on semi-insulating GaAs substrates have been investigated for the firs... In0.4Ga0.6As channel metal-oxide-semiconductor field-effect transistors (MOSFETs) with and without an Si-doped In0.49Ga0.51P barrier layer grown on semi-insulating GaAs substrates have been investigated for the first time. Compared with the In0.4Ga0.6As MOSFETs without an In0.49Ga0.51P barrier layer, In0.4Ga0.6As MOSFETs with an In0.49Ga0.51P barrier layer show higher drive current, higher transconductance, lower gate leakage current, lower subthreshold swing, and higher effective channel mobility. These In0.4Ga0.6As MOSFETs (gate length 2 μm) with an In0.49Ga0.51P barrier layer exhibit a high drive current of 117 mA/mm, a high transconductance of 71.9 mS/mm, and a maximum effective channel mobility of 1266 cm2/(V·s). 展开更多
关键词 metaloxidesemiconductor field-effect transistor ingaas INGAP Al2O3
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SiC MOSFET的质子单粒子效应
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作者 史慧琳 郭刚 +4 位作者 张峥 李府唐 刘翠翠 张艳文 殷倩 《半导体技术》 CAS 北大核心 2024年第7期654-659,共6页
SiC金属氧化物半导体场效应晶体管(MOSFET)在深空探测领域具有广阔的应用前景,但空间质子引发的单粒子效应(SEE)对航天器稳定运行造成了严重威胁。对平面栅结构与非对称沟槽栅结构的SiC MOSFET进行了能量为70、100与200 MeV的质子辐照... SiC金属氧化物半导体场效应晶体管(MOSFET)在深空探测领域具有广阔的应用前景,但空间质子引发的单粒子效应(SEE)对航天器稳定运行造成了严重威胁。对平面栅结构与非对称沟槽栅结构的SiC MOSFET进行了能量为70、100与200 MeV的质子辐照实验。实验结果表明,两种SiC MOSFET的单粒子烧毁(SEB)阈值电压均大于额定漏源电压的75%;SEB阈值电压随质子能量升高而降低。对两种器件进行辐照后栅应力测试发现,两种结构的器件由于沟道不同而对栅应力的响应存在差异;不同的质子能量会在栅极引入不同程度的辐射损伤,低能质子更容易在栅氧化层发生碰撞而引入氧化物潜在损伤。该研究可为揭示SiC MOSFET质子SEE机理和评估抗辐射能力提供参考。 展开更多
关键词 碳化硅(SiC) 金属氧化物半导体场效应晶体管(mosfet) 单粒子效应(SEE) 单粒子烧毁(SEB) 电离效应 辐射损伤
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功率MOSFET在永磁同步电机控制中的影响和分析
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作者 田朝阳 朱德明 +1 位作者 王兴理 佟月伟 《现代雷达》 CSCD 北大核心 2024年第3期82-86,共5页
在现代雷达控制系统中,伺服系统的转速稳定性和定点精度,直接影响到最终成像品质。文中针对伺服系统常用的永磁同步电机控制器中的功率器件金属-氧化物半导体场效应晶体管(MOSFET)展开研究,主要分析了MOSFET的米勒效应,介绍了MOSFET的... 在现代雷达控制系统中,伺服系统的转速稳定性和定点精度,直接影响到最终成像品质。文中针对伺服系统常用的永磁同步电机控制器中的功率器件金属-氧化物半导体场效应晶体管(MOSFET)展开研究,主要分析了MOSFET的米勒效应,介绍了MOSFET的电路模型和开通过程,分析了米勒平台电压的振荡原因和米勒效应对驱动电路的危害,并设计两种优化电路来抑制米勒效应。理论分析和实验结果表明,经过改进的驱动电路有效抑制了米勒效应产生的栅源脉冲电压尖峰。所设计电路已应用于20 kHz/1 kW永磁同步电机驱动器,有效提升了雷达伺服系统的环境适应性和稳定性。 展开更多
关键词 金属-氧化物半导体场效应晶体管 米勒效应 电机控制 驱动电路
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A two-dimensional threshold voltage analytical model for metal-gate/high-k/SiO_2 /Si stacked MOSFETs
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作者 马飞 刘红侠 +1 位作者 樊继斌 王树龙 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第10期439-445,共7页
In this paper the influences of the metal-gate and high-k/SiO 2 /Si stacked structure on the metal-oxide-semiconductor field-effect transistor(MOSFET) are investigated.The flat-band voltage is revised by considering... In this paper the influences of the metal-gate and high-k/SiO 2 /Si stacked structure on the metal-oxide-semiconductor field-effect transistor(MOSFET) are investigated.The flat-band voltage is revised by considering the influences of stacked structure and metal-semiconductor work function fluctuation.The two-dimensional Poisson's equation of potential distribution is presented.A threshold voltage analytical model for metal-gate/high-k/SiO 2 /Si stacked MOSFETs is developed by solving these Poisson's equations using the boundary conditions.The model is verified by a two-dimensional device simulator,which provides the basic design guidance for metal-gate/high-k/SiO 2 /Si stacked MOSFETs. 展开更多
关键词 metal-gate HIGH-K work function flat-band voltage threshold voltage metal-oxide-semiconductor field-effect transistor
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Quantum confinement effects and source-to-drain tunneling in ultra-scaled double-gate silicon n-MOSFETs
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作者 Jiang Xiang-Wei Li Shu-Shen 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第2期490-497,共8页
By using the linear combination of bulk band (LCBB) method incorporated with the top of the barrier splitting (TBS) model, we present a comprehensive study on the quantum confinement effects and the source-to-drai... By using the linear combination of bulk band (LCBB) method incorporated with the top of the barrier splitting (TBS) model, we present a comprehensive study on the quantum confinement effects and the source-to-drain tunneling in the ultra-scaled double-gate (DG) metal-oxide semiconductor field-effect transistors (MOSFETs). A critical body thickness value of 5 nm is found, below which severe valley splittings among different X valleys for the occupied charge density and the current contributions occur in ultra-thin silicon body structures. It is also found that the tunneling current could be nearly 100% with an ultra-scaled channel length. Different from the previous simulation results, it is found that the source-to-drain tunneling could be effectively suppressed in the ultra-thin body thickness (2.0 nm and below) by the quantum confinement and the tunneling could be suppressed down to below 5% when the channel length approaches 16 nm regardless of the body thickness. 展开更多
关键词 quantum confinement TUNNELING metal-oxide-semiconductor field-effect transistors linear combination of bulk band
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1700V碳化硅MOSFET设计 被引量:4
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作者 黄润华 陶永洪 +6 位作者 柏松 陈刚 汪玲 刘奥 卫能 李赟 赵志飞 《固体电子学研究与进展》 CAS CSCD 北大核心 2014年第6期510-513,共4页
设计了一种击穿电压大于1 700V的SiC MOSFET器件。采用有限元仿真的方法对器件的外延掺杂浓度及厚度、有源区结构以及终端保护效率进行了优化。器件采用14μm厚、掺杂浓度为5×1015cm-3的N型低掺杂区。终端保护结构采用保护环结构... 设计了一种击穿电压大于1 700V的SiC MOSFET器件。采用有限元仿真的方法对器件的外延掺杂浓度及厚度、有源区结构以及终端保护效率进行了优化。器件采用14μm厚、掺杂浓度为5×1015cm-3的N型低掺杂区。终端保护结构采用保护环结构。栅压20V、漏压2V时,导通电流大于1A,击穿电压高于1 800V。 展开更多
关键词 4H型碳化硅 金属氧化物半导体场效应晶体管 终端保护 界面态
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亚阈值下MOSFET氧化层和空间电荷区的二维电势解析模型 被引量:1
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作者 韩名君 柯导明 +2 位作者 王保童 王敏 徐春夏 《电子学报》 EI CAS CSCD 北大核心 2013年第11期2237-2241,共5页
本文用特征函数将因氧化层和空间电荷区衔接条件得到的恒等式作正交展开,把未知量求解转化成一组线性代数方程,得到了二维电势解析表达式,并给出了电势能极值点的计算方法.模型的优点是精度与数值解的精度相同,不含适配参数、运算量小... 本文用特征函数将因氧化层和空间电荷区衔接条件得到的恒等式作正交展开,把未知量求解转化成一组线性代数方程,得到了二维电势解析表达式,并给出了电势能极值点的计算方法.模型的优点是精度与数值解的精度相同,不含适配参数、运算量小、避免了数值分析时的方程离散化,可直接用于电路模拟程序.文中讨论了亚阈值下NMOSFET的电势分布、阈值电压和界面态电荷的影响.结果表明,该模型与MEDICI结果极其吻合. 展开更多
关键词 金属氧化物半导体场效应管 电势解析模型 栅氧化层 空间电荷区
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国产中高压抗辐照功率MOSFET单粒子效应 被引量:2
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作者 高博 王立新 +4 位作者 刘刚 罗家俊 韩郑生 王路璐 邓海涛 《太赫兹科学与电子信息学报》 2016年第1期143-147,共5页
功率金属-氧化物半导体场效应晶体管(MOSFET)空间使用时易遭受重离子轰击产生单粒子效应(单粒子烧毁和单粒子栅穿)。本文对国产新型中、高压(额定电压250 V,500 V)抗辐照功率MOSFET的单粒子辐射效应进行了研究,并采取了有针对性的加固措... 功率金属-氧化物半导体场效应晶体管(MOSFET)空间使用时易遭受重离子轰击产生单粒子效应(单粒子烧毁和单粒子栅穿)。本文对国产新型中、高压(额定电压250 V,500 V)抗辐照功率MOSFET的单粒子辐射效应进行了研究,并采取了有针对性的加固措施,使器件的抗单粒子能力显著提升。结果表明:对250 V KW2型功率MOSFET器件进行Bi粒子辐照,在栅压等于0 V时,安全工作的漏极电压达到250 V;对500 V KW5型功率MOSFET器件进行Xe粒子辐照,在栅压等于0 V时,安全工作的漏极电压达到400 V,并且当栅压为-15 V时,安全工作的漏极电压也达到400 V,说明国产中、高压功率MOSFET器件有较好的抗单粒子能力。 展开更多
关键词 功率金属-氧化物半导体场效应晶体管 单粒子效应 抗辐射加固
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功率VDMOSFET单粒子效应研究 被引量:4
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作者 段雪 郎秀兰 +6 位作者 刘英坤 董四华 崔占东 刘忠山 孙艳玲 胡顺欣 冯彬 《微纳电子技术》 CAS 2008年第10期573-576,共4页
阐述了空间辐射环境下n沟功率VDMOSFET发生单粒子栅穿(SEGR)和单粒子烧毁(SEB)的物理机理。研究了多层缓冲局部屏蔽抗单粒子辐射的功率VDMOSFET新结构及相应硅栅制作新工艺。通过对所研制的漏源击穿电压分别为65V和112V两种n沟功率VDMOS... 阐述了空间辐射环境下n沟功率VDMOSFET发生单粒子栅穿(SEGR)和单粒子烧毁(SEB)的物理机理。研究了多层缓冲局部屏蔽抗单粒子辐射的功率VDMOSFET新结构及相应硅栅制作新工艺。通过对所研制的漏源击穿电压分别为65V和112V两种n沟功率VDMOS-FET器件样品进行锎源252Cf单粒子模拟辐射实验,研究了新技术VDMOSFET的单粒子辐射敏感性。实验结果表明,两种器件样品在锎源单粒子模拟辐射实验中的漏源安全电压分别达到61V和110V,验证了新结构和新工艺在提高功率VDMOSFET抗单粒子效应方面的有效性。 展开更多
关键词 功率纵向双扩散金属氧化物半导体场效应晶体管 单粒子栅穿 单粒子烧毁 缓冲屏蔽 锎源
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应变硅PMOSFET中应变的LACBED研究 被引量:1
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作者 段晓峰 刘海华 +1 位作者 徐秋霞 刘邦贵 《电子显微学报》 CAS CSCD 2007年第4期312-321,共10页
本文报道了应变硅p型金属氧化物半导体场效应晶体管(PMOSFET)沟道中的局部应变的大角度会聚束电子衍射表征。由于源和漏极区预非晶化锗离子注入工艺在源漏区引入了大量的缺陷,导致在截面电镜样品中存在切应变。利用大角度会聚束电子衍射... 本文报道了应变硅p型金属氧化物半导体场效应晶体管(PMOSFET)沟道中的局部应变的大角度会聚束电子衍射表征。由于源和漏极区预非晶化锗离子注入工艺在源漏区引入了大量的缺陷,导致在截面电镜样品中存在切应变。利用大角度会聚束电子衍射(LACBED)测量了沟道区的压应变和切应变,并讨论了沟道区产生巨大压应变(2%以上)的原因。 展开更多
关键词 应变硅 金属氧化物半导体场效应晶体管 大角度会聚束电子衍射
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