Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been c...Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been completely evaluated.Therefore,fundamental research is still needed.In this study,the mechanism of microweld formation and breakage during Cu-Cu wire bonding was investigated by using molecular dynamics simulation.The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate.Elastic contact and plastic instability were investigated through the loading and unloading processes.Moreover,the evolution of the indentation morphology and distributions of the atomic stress were also investigated.It was shown that the loading and unloading curves do not coincide,and the unloading curve exhibited hysteresis.For the substrate,in the loading process,the main force changed from attractive to repulsive.The maximum von Mises stress increased and shifted from the center toward the edge of the contact area.During the unloading process,the main force changed from repulsive to attractive.The Mises stress reduced first and then increased.Stress concentration occurs around dislocations in the middle area of the Cu wire.展开更多
Two-dimensional multiferroics,which simultaneously possess ferroelectricity and magnetism in a single phase,are well-known to possess great potential applications in nanoscale memories and spintronics.On the basis of ...Two-dimensional multiferroics,which simultaneously possess ferroelectricity and magnetism in a single phase,are well-known to possess great potential applications in nanoscale memories and spintronics.On the basis of first-principles calculations,a CrNCl_(2) monolayer is reported as an intrinsic multiferroic.The CrNCl_(2) has an antiferromagnetic ground state,with a N´eel temperature of about 88 K,and it exhibits an in-plane spontaneous polarization of 200 pC/m.The magnetic moments of CrNCl_(2) mainly come from the dxy orbital of the Cr cation,but the plane of the dxy orbital is perpendicular to the direction of the ferroelectric polarization,which hardly suppresses the occurrence of ferroelectricity.Therefore,the multiferroic exits in the CrNCl_(2).In addition,like CrNCl_(2),the CrNBr_(2) is an intrinsic multiferroic with antiferromagneticferroelectric ground state while CrNI_(2) is an intrinsic multiferroic with ferromagnetic-ferroelectric ground state.These findings enrich the multiferroics in the two-dimensional system and enable a wide range of applications in nanoscale devices.展开更多
基金the National Key R&D Program of China(Grant No.2019YFB1704600)the Hubei Provincial Natural Science Foundation of China(Grant No.2020CFA032).
文摘Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been completely evaluated.Therefore,fundamental research is still needed.In this study,the mechanism of microweld formation and breakage during Cu-Cu wire bonding was investigated by using molecular dynamics simulation.The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate.Elastic contact and plastic instability were investigated through the loading and unloading processes.Moreover,the evolution of the indentation morphology and distributions of the atomic stress were also investigated.It was shown that the loading and unloading curves do not coincide,and the unloading curve exhibited hysteresis.For the substrate,in the loading process,the main force changed from attractive to repulsive.The maximum von Mises stress increased and shifted from the center toward the edge of the contact area.During the unloading process,the main force changed from repulsive to attractive.The Mises stress reduced first and then increased.Stress concentration occurs around dislocations in the middle area of the Cu wire.
基金Project supported by the National Key R&D Program of China(Grant No.2019YFB1704600)the International Cooperation Research Project of Shenzhen(Grant No.GJHZ20180413182004161)+2 种基金the Hubei Provincial Natural Science Foundation of China(Grant No.2020CFA032)the National Natural Science Foundation of China(Grant No.51805395)the China Scholarship Council(Grant No.201906270142).
文摘Two-dimensional multiferroics,which simultaneously possess ferroelectricity and magnetism in a single phase,are well-known to possess great potential applications in nanoscale memories and spintronics.On the basis of first-principles calculations,a CrNCl_(2) monolayer is reported as an intrinsic multiferroic.The CrNCl_(2) has an antiferromagnetic ground state,with a N´eel temperature of about 88 K,and it exhibits an in-plane spontaneous polarization of 200 pC/m.The magnetic moments of CrNCl_(2) mainly come from the dxy orbital of the Cr cation,but the plane of the dxy orbital is perpendicular to the direction of the ferroelectric polarization,which hardly suppresses the occurrence of ferroelectricity.Therefore,the multiferroic exits in the CrNCl_(2).In addition,like CrNCl_(2),the CrNBr_(2) is an intrinsic multiferroic with antiferromagneticferroelectric ground state while CrNI_(2) is an intrinsic multiferroic with ferromagnetic-ferroelectric ground state.These findings enrich the multiferroics in the two-dimensional system and enable a wide range of applications in nanoscale devices.
