With the rapid increase in power density of electronic devices,thermal management has become urgent for the electronics industry.Controlling temperature in the back-end-of-line is crucial for maintaining the reliabili...With the rapid increase in power density of electronic devices,thermal management has become urgent for the electronics industry.Controlling temperature in the back-end-of-line is crucial for maintaining the reliability of integrated circuits,where many atomic-scale interfaces exist.The theoretical models of interface thermal conductance not only accurately predict the values but also help to analyze the underlying mechanism.This review picks up and introduces some representative theoretical models considering interfacial roughness,elastic and inelastic processes,and electron–phonon couplings,etc.Moreover,the limitations and problems of these models are also discussed.展开更多
基金supported by the Department of Packaging and Testing Institution of Sanechips。
文摘With the rapid increase in power density of electronic devices,thermal management has become urgent for the electronics industry.Controlling temperature in the back-end-of-line is crucial for maintaining the reliability of integrated circuits,where many atomic-scale interfaces exist.The theoretical models of interface thermal conductance not only accurately predict the values but also help to analyze the underlying mechanism.This review picks up and introduces some representative theoretical models considering interfacial roughness,elastic and inelastic processes,and electron–phonon couplings,etc.Moreover,the limitations and problems of these models are also discussed.
