期刊文献+
共找到9篇文章
< 1 >
每页显示 20 50 100
印制电路中电镀铜技术研究及应用 被引量:8
1
作者 王翀 彭川 +4 位作者 向静 陈苑明 何为 苏新虹 罗毓瑶 《电化学》 CAS CSCD 北大核心 2021年第3期257-268,共12页
电镀铜技术是制造印制电路板、封装载板等电子互连器件的核心技术。本文介绍了印制电路中电镀铜技术及其发展概况,主要总结了电子科技大学印制电路与印制电子团队在印制电路电镀铜技术基础研究和产业化应用等方面的工作。首先,以三次电... 电镀铜技术是制造印制电路板、封装载板等电子互连器件的核心技术。本文介绍了印制电路中电镀铜技术及其发展概况,主要总结了电子科技大学印制电路与印制电子团队在印制电路电镀铜技术基础研究和产业化应用等方面的工作。首先,以三次电流分布理论为基础,采用多物理场耦合方法构建阴极表面轮廓线随时间变化的镀层生长过程模型。该模型描述了铜沉积与微纳孔结构、添加剂特性、输入电流、对流强度等相关影响因素的函数关系。通过引入添加剂相关函数,该模型能够较好应用到整平剂筛选和性能评价、电镀铜需求和镀液配方匹配、电镀参数优化等技术开发和应用领域。然后,介绍了添加剂竞争吸附过程的电化学研究以及利用传质调控添加剂局域浓度实现快速微盲孔、微沟槽填充的工业技术。之后,介绍了氮杂环低聚物系列整平剂结构-电化学构效关系研究和应用。最后展示了氧化还原型添加剂的开发情况,并对印制电路中电镀铜技术的研究和应用发展进行了预测。 展开更多
关键词 电镀铜 印制电路板 超级填孔 多物理场耦合 有机添加剂 竞争吸附
在线阅读 下载PDF
A prediction method for the performance of a low-recoil gun with front nozzle 被引量:9
2
作者 Cheng Cheng chong wang Xiaobing Zhang 《Defence Technology(防务技术)》 SCIE EI CAS CSCD 2019年第5期703-712,共10页
One of the greatest challenges in the design of a gun is to balance muzzle velocity and recoil,especially for guns on aircrafts and deployable vehicles.To resolve the conflict between gun power and recoil force,a conc... One of the greatest challenges in the design of a gun is to balance muzzle velocity and recoil,especially for guns on aircrafts and deployable vehicles.To resolve the conflict between gun power and recoil force,a concept of rarefaction wave gun(RAVEN)was proposed to significantly reduce the weapon recoil and the heat in barrel,while minimally reducing the muzzle velocity.The main principle of RAVEN is that the rarefaction wave will not reach the projectile base until the muzzle by delaying the venting time of an expansion nozzle at the breech.Developed on the RAVEN principle,the purpose of this paper is to provide an engineering method for predicting the performance of a low-recoil gun with front nozzle.First,a two-dimensional two-phase flow model of interior ballistic during the RAVEN firing cycle was established.Numerical simulation results were compared with the published data to validate the reliability and accuracy.Next,the effects of the vent opening times and locations were investigated to determine the influence rules on the performance of the RAVEN with front nozzle.Then according to the results above,simple nonlinear fitting formulas were provided to explain how the muzzle velocity and the recoil force change with the vent opening time and location.Finally,a better vent venting opening time corresponding to the vent location was proposed.The findings should make an important contribution to the field of engineering applications of the RAVEN. 展开更多
关键词 INTERIOR BALLISTIC LOW RECOIL RAREFACTION wave Prediction method Two-dimensional
在线阅读 下载PDF
PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响(英文) 被引量:4
3
作者 王小丽 何为 +8 位作者 陈先明 曾红 苏元章 王翀 李高升 黄本霞 冯磊 黄高 陈苑明 《电化学》 CAS CSCD 北大核心 2022年第7期57-66,共10页
以2-巯基苯并噻唑(2-MBT)、苯并三氮唑(BTA)和苯氧基乙醇(MSDS)作为缓蚀剂,研究了其加入在酸性蚀刻液后对PCB厚铜线路的缓蚀效果。通过接触角测试、电化学测试和蚀刻因子得出缓蚀状态,并结合扫描电子显微镜观察铜表面形貌。通过分子动... 以2-巯基苯并噻唑(2-MBT)、苯并三氮唑(BTA)和苯氧基乙醇(MSDS)作为缓蚀剂,研究了其加入在酸性蚀刻液后对PCB厚铜线路的缓蚀效果。通过接触角测试、电化学测试和蚀刻因子得出缓蚀状态,并结合扫描电子显微镜观察铜表面形貌。通过分子动力学计算和量子化学模拟分析缓蚀剂在铜表面的吸附机理。结果表明,2-MBT+MSDS与BTA+MSDS的分子结构可有效地平行吸附在铜表面,且吸附能高于单一缓蚀剂。加入了2-MBT+MSDS的蚀刻液,对厚度约为33μm铜线路进行刻蚀,铜线路的蚀刻因子提高到6.59,可有效应用于PCB厚铜线路制作。 展开更多
关键词 缓蚀剂 协同作用 厚铜线路 酸性蚀刻液
在线阅读 下载PDF
恩沙替尼治疗EML4-ALK/TP53共突变肺鳞癌1例并文献复习 被引量:2
4
作者 吕东来 许春伟 +1 位作者 王崇 桑秋菊 《中国肺癌杂志》 CAS CSCD 北大核心 2023年第1期78-82,共5页
肺鳞癌约占非小细胞肺癌(non-small cell lung cancer,NSCLC)的30%,是第二常见的肺癌组织学类型。具有间变性淋巴瘤激酶(anaplastic lymphoma kinase,ALK)融合突变的NSCLC仅占所有NSCLC病例的2%-5%,且几乎只存在于肺腺癌患者中。因此AL... 肺鳞癌约占非小细胞肺癌(non-small cell lung cancer,NSCLC)的30%,是第二常见的肺癌组织学类型。具有间变性淋巴瘤激酶(anaplastic lymphoma kinase,ALK)融合突变的NSCLC仅占所有NSCLC病例的2%-5%,且几乎只存在于肺腺癌患者中。因此ALK检测在肺鳞癌患者中不常规进行,个别见于报道的ALK融合突变肺鳞癌患者的靶向治疗效果也不清楚。本例晚期肺鳞癌患者通过二代测序发现存在棘皮动物微管相关蛋白样4(echinoderm microtubule associated protein like 4,EML4)-ALK(V1)和TP53共突变,2020年12月3日开始口服恩沙替尼,疗效评价为部分缓解(partial response,PR),无进展生存期(progression-free survival,PFS)达19个月,疾病进展后改为洛拉替尼。其中一线恩沙替尼治疗创造了有文献报道以来ALK突变肺鳞癌患者靶向治疗最长的PFS。本文报道了1例接受恩沙替尼治疗的EML4-ALK和TP53共突变肺鳞癌患者,并回顾相关文献,对此类罕见患者的治疗进行了讨论。 展开更多
关键词 ALK融合基因 肺肿瘤 TP53 恩沙替尼 洛拉替尼
在线阅读 下载PDF
Numerical investigation on cooling performance of filter in a pyrotechnic gas generator 被引量:2
5
作者 Cheng Cheng Xiaobing Zhang +1 位作者 chong wang Lu wang 《Defence Technology(防务技术)》 SCIE EI CAS CSCD 2021年第2期343-351,共9页
As a key part of the pyrotechnic gas generator,the filter not only removes the particulate matter but also cools the hot gas to a safe level.This paper aims to improve the understanding of the basic heat and flow phen... As a key part of the pyrotechnic gas generator,the filter not only removes the particulate matter but also cools the hot gas to a safe level.This paper aims to improve the understanding of the basic heat and flow phenomenon in the gas generator.The pyrotechnic gas generator is modelling by a simplified filter structure with fiber arrays.A finite-volume model of the heat and fluid flow is proposed to simulate the detailed multi-dimensional flow and energy conversion behaviors.Several verification results are in good agreement with data in different references.Simulation results demonstrate that the filter can not only absorb heat from the gas but also cause the high intensity enhancement of the heat transfer.The performance difference between inline and staggered arrays is also discussed.The findings of the study put a further prediction tool for the understanding and design of the filter system with fibers. 展开更多
关键词 Pyrotechnic gas generator Cooling performance FILTER Metal fiber
在线阅读 下载PDF
电沉积纳米锥镍的生长机理及其性能的研究(英文) 被引量:1
6
作者 倪修任 张雅婷 +10 位作者 王翀 洪延 陈苑明 苏元章 何为 陈先明 黄本霞 续振林 李毅峰 李能彬 杜永杰 《电化学》 CAS CSCD 北大核心 2022年第7期67-77,共11页
本文通过恒电流沉积法在柔性覆铜基板上制备了具有纳米锥阵列结构的黑色镍层,制备的纳米锥镍的底部约为200 nm,高度约为1μm,且大小均一,分布致密。本文探讨了镍电沉积中电流密度和主盐浓度对纳米锥镍结构形貌的影响,结果表明低电流密... 本文通过恒电流沉积法在柔性覆铜基板上制备了具有纳米锥阵列结构的黑色镍层,制备的纳米锥镍的底部约为200 nm,高度约为1μm,且大小均一,分布致密。本文探讨了镍电沉积中电流密度和主盐浓度对纳米锥镍结构形貌的影响,结果表明低电流密度和高主盐浓度有利于纳米锥镍的形成。电沉积过程中保持镍离子的供应充足是锥镍结构产生的关键因素之一,而高电流密度会影响镍离子浓度的浓差极化,从而影响锥镍的成核过程。温度、主盐浓度以及结晶调整剂的变化会导致镍颗粒的形貌发生圆包状和针锥状结构的相互转化。温度升高具有一定的细化晶粒作用,锥镍结构需要在大于50oC的条件下生成。结晶调整剂能够改变沉积过程中的晶面择优生长,且可以调控镍晶粒的形貌,使得生成的锥结构分布均匀,颗粒细致。结果表明,在4.0 mol·L-1NH4Cl和1.68mol·L-1Ni Cl2·6H2O体系中沉积出分布均匀的纳米锥镍阵列结构。本文利用氯化铵作为纳米锥镍的晶体改性剂,通过分子动力学模拟理论上分析了NH4+在镍表面的吸附过程。计算结果表明镍不同晶面上NH4+吸附能的差异引起各晶面镍沉积速率的差异,从而导致纳米锥镍阵列的形成。本文呢进一步结合形貌表征,提出了纳米锥镍阵列的电沉积生长的两步生长机理,包括前期的成核生长和后期的核生长过程,前期成核过程为优势生长,生成大量的晶核,为锥镍的生长提供了生长位点,而后期的核生长过程表现为锥状镍核的择优生长,最终形成完整均匀的锥镍阵列结构。本文制备的纳米锥镍结构还具有优异的亲水性和良好的吸光效果,对于近紫外和可见光的吸收率大于95%,具有较好的应用前景。 展开更多
关键词 纳米锥镍阵列 电沉积 分子动力学模拟 柔性
在线阅读 下载PDF
Distributed cooperative task planning algorithm for multiple satellites in delayed communication environment 被引量:2
7
作者 chong wang Jinhui Tang +2 位作者 Xiaohang Cheng Yingchen Liu Changchun wang 《Journal of Systems Engineering and Electronics》 SCIE EI CSCD 2016年第3期619-633,共15页
Multiple earth observing satellites need to communicate with each other to observe plenty of targets on the Earth together. The factors, such as external interference, result in satellite information interaction delay... Multiple earth observing satellites need to communicate with each other to observe plenty of targets on the Earth together. The factors, such as external interference, result in satellite information interaction delays, which is unable to ensure the integrity and timeliness of the information on decision making for satellites. And the optimization of the planning result is affected. Therefore, the effect of communication delay is considered during the multi-satel ite coordinating process. For this problem, firstly, a distributed cooperative optimization problem for multiple satellites in the delayed communication environment is formulized. Secondly, based on both the analysis of the temporal sequence of tasks in a single satellite and the dynamically decoupled characteristics of the multi-satellite system, the environment information of multi-satellite distributed cooperative optimization is constructed on the basis of the directed acyclic graph(DAG). Then, both a cooperative optimization decision making framework and a model are built according to the decentralized partial observable Markov decision process(DEC-POMDP). After that, a satellite coordinating strategy aimed at different conditions of communication delay is mainly analyzed, and a unified processing strategy on communication delay is designed. An approximate cooperative optimization algorithm based on simulated annealing is proposed. Finally, the effectiveness and robustness of the method presented in this paper are verified via the simulation. 展开更多
关键词 Earth observing satellite(EOS) distributed coo-perative task planning delayed communication decentralized partial observable Markov decision process(DEC-POMDP) simulated annealing
在线阅读 下载PDF
Preface to Special Issue on Electronic Electroplating
8
作者 Zhi-Dong Chen chong wang +1 位作者 Wei He Ming Li 《电化学》 CAS CSCD 北大核心 2022年第7期1-3,共3页
Electroplating is a process using electric current to deposit a layer of metal(s),which is an indispensable technique in the manufacture of integrated circuits and micro-nano electronic devices.Electroplating for mode... Electroplating is a process using electric current to deposit a layer of metal(s),which is an indispensable technique in the manufacture of integrated circuits and micro-nano electronic devices.Electroplating for modern electronics is much smaller in scale than the ordinary electroplating processes and relies heavily on foreign technique,such as proprietary materials and equipment.As the competition in the field of chip manufacture intensifies,we realize that there is no choice but to become self-sufficient in such technology,including,but not limited to electroplating technology. 展开更多
关键词 technology. ELECTROPLATING ordinary
在线阅读 下载PDF
Preface to Special Issue on Electronic Electroplating
9
作者 Zhi-Dong Chen chong wang +1 位作者 Wei He Ming Li 《电化学》 CAS CSCD 北大核心 2022年第6期1-3,共3页
Electroplating is a process using electric current to deposit a layer of metal(s),which is an indispensable technique in the manufacture of integrated circuits and micro-nano electronic devices.Electroplating for mode... Electroplating is a process using electric current to deposit a layer of metal(s),which is an indispensable technique in the manufacture of integrated circuits and micro-nano electronic devices.Electroplating for modern electronics is much smaller in scale than the ordinary electroplating processes and relies heavily on foreign technique,such as proprietary materials and equipment.As the competition in the field of chip manufacture intensifies,we realize that there is no choice but to become self-sufficient in such technology,including,but not limited to electroplating technology. 展开更多
关键词 technology. ELECTROPLATING ordinary
在线阅读 下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部