The major reason of Al anode activation is that Ga can plate out on the aluminum surface and form activated points. The Al-Sn, Al - Ga binary alloys can’t be activat6d in alkaline medium. During the dissolution of th...The major reason of Al anode activation is that Ga can plate out on the aluminum surface and form activated points. The Al-Sn, Al - Ga binary alloys can’t be activat6d in alkaline medium. During the dissolution of the Al - Sn - Ga ternary anode, Sn and Ga dissolove solution aions as ions. After Sn ions deposit on the surface of Al anode, Ga ions will underpotentially deposit on Sn. The higher activation of the polycomponent alloy anode is caused by much more new activated points being continually formed. The activation mechanism for the polycomponent Al-alloy anode in alkaline medium is abided by the" di ssolution-deposition".展开更多
SIP(System in Package),指系统级封装。特点是将不同功能的有源电子元器件加上无源或类似MEMS的光学器件集中于一个单一封装体内,构成一个类似系统的器件为系统或子系统提供多种功能。它与系统级芯片(SOC)互补,实现混合集成,具有设计...SIP(System in Package),指系统级封装。特点是将不同功能的有源电子元器件加上无源或类似MEMS的光学器件集中于一个单一封装体内,构成一个类似系统的器件为系统或子系统提供多种功能。它与系统级芯片(SOC)互补,实现混合集成,具有设计灵活、周期短、成本低的特点。文章通过系统封装技术的研发历程,评价了封装的优越性、探讨了此种封装技术的产品架构和相关技术及其发展前景。展开更多
为了改善波导缝隙天线的散射性能，设计了一种电磁带隙（electromagnetic band gap，EBG）结构的吸波材料，从导纳圆图、表面电流和电场分布等方面分析了其吸波机理。其厚度为0．3mm，吸波率达到99．9％，将其加载于波导缝隙辐射金属基...为了改善波导缝隙天线的散射性能，设计了一种电磁带隙（electromagnetic band gap，EBG）结构的吸波材料，从导纳圆图、表面电流和电场分布等方面分析了其吸波机理。其厚度为0．3mm，吸波率达到99．9％，将其加载于波导缝隙辐射金属基板上，得到了低雷达散射截面的波导缝隙天线。仿真结果表明：加载后的天线回波损耗和增益基本不变，在5．48～5．75GHz工作频带内，法向RCS减缩都在3dB以上，最大减缩达到15．8dB，单站RCS在-18°～18°角域减缩超过3dB。证实了该吸波结构有良好的吸波效果，可以用于波导缝隙天线带内隐身。展开更多
文摘The major reason of Al anode activation is that Ga can plate out on the aluminum surface and form activated points. The Al-Sn, Al - Ga binary alloys can’t be activat6d in alkaline medium. During the dissolution of the Al - Sn - Ga ternary anode, Sn and Ga dissolove solution aions as ions. After Sn ions deposit on the surface of Al anode, Ga ions will underpotentially deposit on Sn. The higher activation of the polycomponent alloy anode is caused by much more new activated points being continually formed. The activation mechanism for the polycomponent Al-alloy anode in alkaline medium is abided by the" di ssolution-deposition".
文摘SIP(System in Package),指系统级封装。特点是将不同功能的有源电子元器件加上无源或类似MEMS的光学器件集中于一个单一封装体内,构成一个类似系统的器件为系统或子系统提供多种功能。它与系统级芯片(SOC)互补,实现混合集成,具有设计灵活、周期短、成本低的特点。文章通过系统封装技术的研发历程,评价了封装的优越性、探讨了此种封装技术的产品架构和相关技术及其发展前景。
文摘为了改善波导缝隙天线的散射性能，设计了一种电磁带隙（electromagnetic band gap，EBG）结构的吸波材料，从导纳圆图、表面电流和电场分布等方面分析了其吸波机理。其厚度为0．3mm，吸波率达到99．9％，将其加载于波导缝隙辐射金属基板上，得到了低雷达散射截面的波导缝隙天线。仿真结果表明：加载后的天线回波损耗和增益基本不变，在5．48～5．75GHz工作频带内，法向RCS减缩都在3dB以上，最大减缩达到15．8dB，单站RCS在-18°～18°角域减缩超过3dB。证实了该吸波结构有良好的吸波效果，可以用于波导缝隙天线带内隐身。
