Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, ther...Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.展开更多
基金Project(50675234)supported by the National Natural Science Foundation of China
文摘Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.
