Multipaction,caused by the secondary electron emission phenomenon,has been a challenge in space applications due to the resulting degradation of system performance as well as the reduction in the service life of high ...Multipaction,caused by the secondary electron emission phenomenon,has been a challenge in space applications due to the resulting degradation of system performance as well as the reduction in the service life of high power components.In this paper we report a novel approach to realize an effective increase in the multipaction threshold by employing micro-porous surfaces.Two micro-porous structures,i.e.,a regular micro-porous array fabricated by photolithography pattern processing and an irregular micro-porous array fabricated by a direct chemical etching technique,are proposed for suppressing the secondary electron yield（SEY） and multipaction in components,and the benefits are validated both theoretically and experimentally.These surface processing technologies are compatible with the metal plating process,and offer substantial flexibility and accuracy in topology design.The suppression effect is quantified for the first time through the proper fitting of the surface morphology and the corresponding secondary emission properties.Insertion losses when using these structures decrease dramatically compared with regular millimeter-scale structures on high power dielectric windows.SEY tests on samples show that the maximum yield of Ag-plated samples is reduced from 2.17 to 1.58 for directly chemical etched samples.Multipaction testing of actual C-band impedance transformers shows that the discharge thresholds of the processed components increase from 2100 W to 5500 W for photolithography pattern processing and 7200 W for direct chemical etching,respectively.Insertion losses increase from 0.13 d B to only 0.15 d B for both surface treatments in the transmission band.The experimental results agree well with the simulation results,which offers great potential in the quantitative anti-multipaction design of high power microwave components for space applications.展开更多
Secondary electron emission(SEE)of metal and dielectric materials plays a key role in multipactor discharge,which is a bottle neck problem for high-power satelliate components.Measurements of both the secondary electr...Secondary electron emission(SEE)of metal and dielectric materials plays a key role in multipactor discharge,which is a bottle neck problem for high-power satelliate components.Measurements of both the secondary electron yield(SEY)and the secondary electron energy spectrum(SES)are performed on metal samples for an accurate description of the real SEE phenomenon.In order to simplify the fitting process and improve the simulation efficiency,an improved model is proposed for the description of secondary electrons(SE)emitted from the material surface,including true,elastic,and inelastic SE.Embedding the novel SES model into the electromagnetic particle-in-cell method,the electronic resonant multipactor in microwave components is simulated successfully and hence the discharge threshold is predicted.Simulation results of the SES variation in the improved model demonstrate that the multipactor threshold is strongly dependent on SES.In addition,the mutipactor simulation results agree quite well with the experiment for the practical microwave component,while the numerical model of SEY and SES fits well with the sample data taken from the microwave component.展开更多
基金Project supported by the National Natural Science Foundation of China(Grant No.U1537211)the National Key Laboratory Key Foundation,China(Grant No.9140C530101150C53011)China Postdoctoral Science Foundation(Grant No.2015M572661XB)
文摘Multipaction,caused by the secondary electron emission phenomenon,has been a challenge in space applications due to the resulting degradation of system performance as well as the reduction in the service life of high power components.In this paper we report a novel approach to realize an effective increase in the multipaction threshold by employing micro-porous surfaces.Two micro-porous structures,i.e.,a regular micro-porous array fabricated by photolithography pattern processing and an irregular micro-porous array fabricated by a direct chemical etching technique,are proposed for suppressing the secondary electron yield（SEY） and multipaction in components,and the benefits are validated both theoretically and experimentally.These surface processing technologies are compatible with the metal plating process,and offer substantial flexibility and accuracy in topology design.The suppression effect is quantified for the first time through the proper fitting of the surface morphology and the corresponding secondary emission properties.Insertion losses when using these structures decrease dramatically compared with regular millimeter-scale structures on high power dielectric windows.SEY tests on samples show that the maximum yield of Ag-plated samples is reduced from 2.17 to 1.58 for directly chemical etched samples.Multipaction testing of actual C-band impedance transformers shows that the discharge thresholds of the processed components increase from 2100 W to 5500 W for photolithography pattern processing and 7200 W for direct chemical etching,respectively.Insertion losses increase from 0.13 d B to only 0.15 d B for both surface treatments in the transmission band.The experimental results agree well with the simulation results,which offers great potential in the quantitative anti-multipaction design of high power microwave components for space applications.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.U1537211,11705142,and 11675278)the National Key Laboratory Foundation,China(Grant No.9140C530101150C53011)
文摘Secondary electron emission(SEE)of metal and dielectric materials plays a key role in multipactor discharge,which is a bottle neck problem for high-power satelliate components.Measurements of both the secondary electron yield(SEY)and the secondary electron energy spectrum(SES)are performed on metal samples for an accurate description of the real SEE phenomenon.In order to simplify the fitting process and improve the simulation efficiency,an improved model is proposed for the description of secondary electrons(SE)emitted from the material surface,including true,elastic,and inelastic SE.Embedding the novel SES model into the electromagnetic particle-in-cell method,the electronic resonant multipactor in microwave components is simulated successfully and hence the discharge threshold is predicted.Simulation results of the SES variation in the improved model demonstrate that the multipactor threshold is strongly dependent on SES.In addition,the mutipactor simulation results agree quite well with the experiment for the practical microwave component,while the numerical model of SEY and SES fits well with the sample data taken from the microwave component.
