采用归一化能量1 Me V的中子脉冲反应堆对Al Ga N/Ga N异质结材料进行了辐照研究。实验发现,经1015cm-2注量的中子辐照后,异质结材料的二维电子气(2DEG)载流子浓度(ns)下降,而2DEG迁移率由于受到ns的调制作用略有增加,同时辐照导致的载...采用归一化能量1 Me V的中子脉冲反应堆对Al Ga N/Ga N异质结材料进行了辐照研究。实验发现,经1015cm-2注量的中子辐照后,异质结材料的二维电子气(2DEG)载流子浓度(ns)下降,而2DEG迁移率由于受到ns的调制作用略有增加,同时辐照导致的载流子浓度ns下降造成了沟道串联电阻的增加和异质结构阈值电压(VTH)的正向漂移。分析认为,辐照感生类受主缺陷是造成ns下降和阈值电压漂移的原因。原子力显微镜(AFM)和X射线衍射仪(XRD)的测试结果表明,辐照后材料的表面形貌有所恶化,材料应变基本不变,而材料的螺位错和刃位错密度辐照后都略有增加。此外,实验结果还表明初始材料质量越好,辐照退化越小。展开更多
采用能量为1 Me V的电子对几种不同结构的Al Ga N/Ga N HEMT器件进行了最高注量为8.575×1014cm-2的辐照。实验发现:电子辐照后,最高注量下器件欧姆接触性能也几乎没有退化。辐照后未钝化器件的正反向栅电流有所增加,而且肖特基势...采用能量为1 Me V的电子对几种不同结构的Al Ga N/Ga N HEMT器件进行了最高注量为8.575×1014cm-2的辐照。实验发现:电子辐照后,最高注量下器件欧姆接触性能也几乎没有退化。辐照后未钝化器件的正反向栅电流有所增加,而且肖特基势垒高度随着辐照注量的增加而降低。几种结构HEMT器件的辐照结果表明,电子辐照后只有未钝化器件的特性有所退化,随着辐照注量增加,器件漏电流和跨导下降越明显,而且线性区退化大于饱和区,而阈值电压变化很小。分析表明,HEMT器件参数性能退化的主要原因是栅源和栅漏间隔区辐照感生表面态负电荷的产生。此外实验结果也说明Si N钝化、MOS结构和场板结构都是很好的抗辐照加固的手段。展开更多
A1GaN/GaN depletion-mode high-electron-mobility transistor （D-HEMT） and fluorine （F） plasma treated enhancement-mode high-electron-mobility transistor （E-HEMT） are exposed to 60Co gamma radiation with a dose of ...A1GaN/GaN depletion-mode high-electron-mobility transistor （D-HEMT） and fluorine （F） plasma treated enhancement-mode high-electron-mobility transistor （E-HEMT） are exposed to 60Co gamma radiation with a dose of 1.6 Mrad （Si）. No degradation is observed in the performance of D-HEMT. However, the maximum transeonductance of E-HEMT is increased after radiation. The 2DEG density and the mobility are calculated from the results of capacitance-voltage measurement. The electron mobility decreases after fluorine plasma treatment and recovers after radiation. Conductance measurements in a frequency range from 10 kHz to 1 MHz are used to characterize the trapping effects in the devices. A new type of trap is observed in the F plasma treated E-HEMT compared with the D-HEMT, but the density of the trap decreases by radiation. Fitting of Gp/w data yields the trap densities DT = （1-3）Х1012 cm^-2.eV^-1 and DT = （0,2-0.8）Х10^12 cm^2-eV^-1 before and after radiation, respectively. The time constant is 0.5 ms-6 ms. With F plasma treatment, the trap is introduced by etch damage and degrades the electronic mobility. After 60Co gamma radiation, the etch damage decreases and the electron mobility is improved. The gamma radiation can recover the etch damage caused by F plasma treatment.展开更多
This paper reports fluorine plasma treatment enhancement-mode HEMTs （high electronic mobility transistors） EHEMTs and conventional depletion-mode HEMTs DHEMTs fabricated on one wafer using separate litho-photography...This paper reports fluorine plasma treatment enhancement-mode HEMTs （high electronic mobility transistors） EHEMTs and conventional depletion-mode HEMTs DHEMTs fabricated on one wafer using separate litho-photography technology. It finds that fluorine plasma etches the AlGaN at a slow rate by capacitance-voltage measurement. Using capacitance-frequency measurement, it finds one type of trap in conventional DHEMTs with TT = （0.5 - 6） ms and DT ： （1 - 5）×10^13 cm^-2. eV^-1. Two types of trap are found in fluorine plasma treatment EHEMTs, fast with TW（f）= （0.2 - 2） μs and slow with TT（s） = （0.5 - 6） ms. The density of trap states evaluated on the EHEMTs is Dw（f） ： （1 - 3） × 10^12 cm^-2. eV^-1 and DT（s） =（2 - 6） × 10^12 cm-2. eV-1 for the fast and slow traps, respectively. The result shows that the fluorine plasma treatment reduces the slow trap density by about one order, but introduces a new type of fast trap. The slow trap is suggested to be a surface trap, related to the gate leakage current.展开更多
In this paper, in order to solve the interface-trap issue and enhance the transconductance induced by high-k dielectric in metal-insulator-semiconductor （MIS） high electron mobility transistors （HEMTs）, we demonst...In this paper, in order to solve the interface-trap issue and enhance the transconductance induced by high-k dielectric in metal-insulator-semiconductor （MIS） high electron mobility transistors （HEMTs）, we demonstrate better performances of recessed-gate A1203 MIS-HEMTs which are fabricated by Fluorine-based Si3N4 etching and chlorine- based A1CaN etching with three etching times （15 s, 17 s and 19 s）. The gate leakage current of MIS-HEMT is about three orders of magnitude lower than that of A1GaN/CaN HEMT. Through the recessed-gate etching, the transconductanee increases effectively. When the recessed-gate depth is 1.02 nm, the best interface performance with Tit----（0.20--1.59） p^s and Dit ：（0.55-1.08）x 1012 cm-2.eV- 1 can be obtained. After chlorine-based etching, the interface trap density reduces considerably without generating any new type of trap. The accumulated chlorine ions and the N vacancies in the AIGaN surface caused by the plasma etching can degrade the breakdown and the high frequency performances of devices. By comparing the characteristics of recessed-gate MIS-HEMTs with different etching times, it is found that a low power chlorine-based plasma etching for a short time （15 s in this paper） can enhance the performances of MIS-HEMTs effectively.展开更多
An enhancement-mode （E-mode） A1GaN/GaN high electron mobility transistor （HEMTs） was fabricated with 15-nm A1GaN barrier layer. E-mode operation was achieved by using fluorine plasma treatment and post-gate rapid ...An enhancement-mode （E-mode） A1GaN/GaN high electron mobility transistor （HEMTs） was fabricated with 15-nm A1GaN barrier layer. E-mode operation was achieved by using fluorine plasma treatment and post-gate rapid thermal annealing. The thin barrier depletion-HEMTs with a threshold voltage typically around -1.7 V, which is higher than that of the 22-nm barrier depletion-mode HEMTs （-3.5 V）. Therefore, the thin barrier is emerging as an excellent candidate to realize the enhancement-mode operation. With 0.6-tim gate length, the devices treated by fluorine plasma for 150-W RF power at 150 s exhibited a threshold voltage of 1.3 V. The maximum drain current and maximum transconductance are 300 mA/mm, and 177 mS/ram, respectively. Compared with the 22-nm barrier E-mode devices, VT of the thin barrier HEMTs is much more stable under the gate step-stress,展开更多
This paper investigates the impact of electrical degradation and current collapse on different thickness SiNx passivated AlGaN/GaN high electron mobility transistors. It finds that higher thickness SiNx passivation ca...This paper investigates the impact of electrical degradation and current collapse on different thickness SiNx passivated AlGaN/GaN high electron mobility transistors. It finds that higher thickness SiNx passivation can significantly improve the high-electric-field reliability of a device. The degradation mechanism of the SiNx passivation layer under ON-state stress has also been discussed in detail. Under the ON-state stress, the strong electric-field led to degradation of SiNx passivation located in the gate-drain region. As the thickness of SiNx passivation increases, the density of the surface state will be increased to some extent. Meanwhile, it is found that the high NH3 flow in the plasma enhanced chemical vapour deposition process could reduce the surface state and suppress the current collapse.展开更多
We present an AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MIS-HEMT） with an NbAIO high-k dielectric deposited by atomic layer deposition （ALD）. Surface morphology of samples are obse...We present an AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MIS-HEMT） with an NbAIO high-k dielectric deposited by atomic layer deposition （ALD）. Surface morphology of samples are observed by atomic force microscopy （AFM）, indicating that the ALD NbA10 has an excellent-property surface. Moreover, the sharp transition from depletion to accumulation in capacitance voltage （C-V）curse of MIS-HEMT demonstrates the high quality bulk and interface properties of NbA10 on A1GaN. The fabricated MIS-HEMT with a gate length of 0.5 μm exhibits a maximum drain current of 960 mA/mm, and the reverse gate leakage current is almost 3 orders of magnitude lower than that of reference HEMT. Based on the improved direct-current operation, the NbA10 can be considered to be a potential gate oxide comparable to other dielectric insulators.展开更多
The current slump of different recipes of SiN~ passivated AIGaN/GaN high electron mobility transistors （HEMTs） is investigated. The dc and pulsed current-voltage curves of AIGaN/GaN HEMTs using different recipes are...The current slump of different recipes of SiN~ passivated AIGaN/GaN high electron mobility transistors （HEMTs） is investigated. The dc and pulsed current-voltage curves of AIGaN/GaN HEMTs using different recipes are analyzed. It is found that passivation leakage has a strong relationship with NH3 flow in the plasma-enhanced chemical vapor phase deposition process, which has impacted on the current collapse of SiNs passivated devices. We analyze the pulsed IDS -- VDS characteristics of different recipes of SiNx passivation devices for different combinations of gate and drain quiescent biases （VGso, VDSO） of （0, 0）, （-6, 0）, （-6, 15） and （0, 15）V. The possible mechanisms are the traps in SiNxpassivation capturing the electrons and the surface states at the SiNx/AIGaN interface, which can affect the channel of two-dimensional electron gas and cause the current collapse.展开更多
A GaN-based enhancement-mode(E-Mode)metal-insulator-semiconductor(MIS)high electron mobility transistor(HEMT)with a 2 nm/5 nm/1.5nm-thin GaN/AlGaN/AlN barrier is presented.We find that the formation of a two-dimension...A GaN-based enhancement-mode(E-Mode)metal-insulator-semiconductor(MIS)high electron mobility transistor(HEMT)with a 2 nm/5 nm/1.5nm-thin GaN/AlGaN/AlN barrier is presented.We find that the formation of a two-dimensional electron gas(2DES)in the GaN/AlGaN/AlN/GaN heterostructure can be controlled by the presence of the plasma-enhanced chemical-vapor deposition(PECVD)Si_(3)N_(4) on the barrier layer,and the degree of decrease in sheet resistance R_(sh) is dependent on the Si_(3)N_(4) thickness.We choose 13 nm Si_(3)N_(4) as the gate insulator to decrease gate current and to improve the threshold voltage of devices.With selective etching of the passivation Si_(3)N_(4) under gate and over fluorine plasma treatment,the MIS-HEMT exhibits a high threshold voltage of 1.8 V.The maximum drain current Id,max and the maximum transconductance are 810 mA/mm and 190 mS/mm,respectively.The devices show a wide operation range of 4.5 V.展开更多
A new multilayer-structured AlN/AlCaN/CaN heterostructure high-electron-mobility transistor （HEMT） is demonstrated. The AIN/AlCaN/CaN HEMT exhibits the maximum drain current density of 800mA/mm and the maximum extri...A new multilayer-structured AlN/AlCaN/CaN heterostructure high-electron-mobility transistor （HEMT） is demonstrated. The AIN/AlCaN/CaN HEMT exhibits the maximum drain current density of 800mA/mm and the maximum extrinsic transconductance of 170 mS/mm. Due to the increase of the distance between the gate and the two-dimensional electron-gas channel, the threshold voltage shifts slightly to the negative. The reduced drain current collapse and higher breakdown voltage are observed on this AIN/AlGaN/CaN HEMT. The current gain cut-off frequency and the maximum frequency of oscillation are 18.5 CHz and 29.0 GHz, respectively.展开更多
文摘采用归一化能量1 Me V的中子脉冲反应堆对Al Ga N/Ga N异质结材料进行了辐照研究。实验发现,经1015cm-2注量的中子辐照后,异质结材料的二维电子气(2DEG)载流子浓度(ns)下降,而2DEG迁移率由于受到ns的调制作用略有增加,同时辐照导致的载流子浓度ns下降造成了沟道串联电阻的增加和异质结构阈值电压(VTH)的正向漂移。分析认为,辐照感生类受主缺陷是造成ns下降和阈值电压漂移的原因。原子力显微镜(AFM)和X射线衍射仪(XRD)的测试结果表明,辐照后材料的表面形貌有所恶化,材料应变基本不变,而材料的螺位错和刃位错密度辐照后都略有增加。此外,实验结果还表明初始材料质量越好,辐照退化越小。
文摘采用能量为1 Me V的电子对几种不同结构的Al Ga N/Ga N HEMT器件进行了最高注量为8.575×1014cm-2的辐照。实验发现:电子辐照后,最高注量下器件欧姆接触性能也几乎没有退化。辐照后未钝化器件的正反向栅电流有所增加,而且肖特基势垒高度随着辐照注量的增加而降低。几种结构HEMT器件的辐照结果表明,电子辐照后只有未钝化器件的特性有所退化,随着辐照注量增加,器件漏电流和跨导下降越明显,而且线性区退化大于饱和区,而阈值电压变化很小。分析表明,HEMT器件参数性能退化的主要原因是栅源和栅漏间隔区辐照感生表面态负电荷的产生。此外实验结果也说明Si N钝化、MOS结构和场板结构都是很好的抗辐照加固的手段。
基金Project supported by the National Natural Science Foundation of China (Grant No. 60736033)the Fundamental Research Funds for the Central Universities,China (Grant No. JY10000904009)
文摘A1GaN/GaN depletion-mode high-electron-mobility transistor （D-HEMT） and fluorine （F） plasma treated enhancement-mode high-electron-mobility transistor （E-HEMT） are exposed to 60Co gamma radiation with a dose of 1.6 Mrad （Si）. No degradation is observed in the performance of D-HEMT. However, the maximum transeonductance of E-HEMT is increased after radiation. The 2DEG density and the mobility are calculated from the results of capacitance-voltage measurement. The electron mobility decreases after fluorine plasma treatment and recovers after radiation. Conductance measurements in a frequency range from 10 kHz to 1 MHz are used to characterize the trapping effects in the devices. A new type of trap is observed in the F plasma treated E-HEMT compared with the D-HEMT, but the density of the trap decreases by radiation. Fitting of Gp/w data yields the trap densities DT = （1-3）Х1012 cm^-2.eV^-1 and DT = （0,2-0.8）Х10^12 cm^2-eV^-1 before and after radiation, respectively. The time constant is 0.5 ms-6 ms. With F plasma treatment, the trap is introduced by etch damage and degrades the electronic mobility. After 60Co gamma radiation, the etch damage decreases and the electron mobility is improved. The gamma radiation can recover the etch damage caused by F plasma treatment.
基金Project supported by the National Natural Science Foundation of China(Grant No.60736033)the Fundamental Research Funds for the Central Universities(Grant No.JY10000904009)
文摘This paper reports fluorine plasma treatment enhancement-mode HEMTs （high electronic mobility transistors） EHEMTs and conventional depletion-mode HEMTs DHEMTs fabricated on one wafer using separate litho-photography technology. It finds that fluorine plasma etches the AlGaN at a slow rate by capacitance-voltage measurement. Using capacitance-frequency measurement, it finds one type of trap in conventional DHEMTs with TT = （0.5 - 6） ms and DT ： （1 - 5）×10^13 cm^-2. eV^-1. Two types of trap are found in fluorine plasma treatment EHEMTs, fast with TW（f）= （0.2 - 2） μs and slow with TT（s） = （0.5 - 6） ms. The density of trap states evaluated on the EHEMTs is Dw（f） ： （1 - 3） × 10^12 cm^-2. eV^-1 and DT（s） =（2 - 6） × 10^12 cm-2. eV-1 for the fast and slow traps, respectively. The result shows that the fluorine plasma treatment reduces the slow trap density by about one order, but introduces a new type of fast trap. The slow trap is suggested to be a surface trap, related to the gate leakage current.
基金supported by the National Key Science and Technology Special Project,China (Grant No. 2008ZX01002-002)the National Natural Science Foundation of China (Grant No. 60736033)
文摘In this paper, in order to solve the interface-trap issue and enhance the transconductance induced by high-k dielectric in metal-insulator-semiconductor （MIS） high electron mobility transistors （HEMTs）, we demonstrate better performances of recessed-gate A1203 MIS-HEMTs which are fabricated by Fluorine-based Si3N4 etching and chlorine- based A1CaN etching with three etching times （15 s, 17 s and 19 s）. The gate leakage current of MIS-HEMT is about three orders of magnitude lower than that of A1GaN/CaN HEMT. Through the recessed-gate etching, the transconductanee increases effectively. When the recessed-gate depth is 1.02 nm, the best interface performance with Tit----（0.20--1.59） p^s and Dit ：（0.55-1.08）x 1012 cm-2.eV- 1 can be obtained. After chlorine-based etching, the interface trap density reduces considerably without generating any new type of trap. The accumulated chlorine ions and the N vacancies in the AIGaN surface caused by the plasma etching can degrade the breakdown and the high frequency performances of devices. By comparing the characteristics of recessed-gate MIS-HEMTs with different etching times, it is found that a low power chlorine-based plasma etching for a short time （15 s in this paper） can enhance the performances of MIS-HEMTs effectively.
基金supported by the Major Program and State Key Program of National Natural Science Foundation of China (GrantNos. 60890191 and 60736033)the National Key Science & Technology Special Project (Grant No. 2008ZX01002-002)
文摘An enhancement-mode （E-mode） A1GaN/GaN high electron mobility transistor （HEMTs） was fabricated with 15-nm A1GaN barrier layer. E-mode operation was achieved by using fluorine plasma treatment and post-gate rapid thermal annealing. The thin barrier depletion-HEMTs with a threshold voltage typically around -1.7 V, which is higher than that of the 22-nm barrier depletion-mode HEMTs （-3.5 V）. Therefore, the thin barrier is emerging as an excellent candidate to realize the enhancement-mode operation. With 0.6-tim gate length, the devices treated by fluorine plasma for 150-W RF power at 150 s exhibited a threshold voltage of 1.3 V. The maximum drain current and maximum transconductance are 300 mA/mm, and 177 mS/ram, respectively. Compared with the 22-nm barrier E-mode devices, VT of the thin barrier HEMTs is much more stable under the gate step-stress,
基金Project supported by the State Key Program of National Natural Science Foundation of China (Grant No. 60736033)
文摘This paper investigates the impact of electrical degradation and current collapse on different thickness SiNx passivated AlGaN/GaN high electron mobility transistors. It finds that higher thickness SiNx passivation can significantly improve the high-electric-field reliability of a device. The degradation mechanism of the SiNx passivation layer under ON-state stress has also been discussed in detail. Under the ON-state stress, the strong electric-field led to degradation of SiNx passivation located in the gate-drain region. As the thickness of SiNx passivation increases, the density of the surface state will be increased to some extent. Meanwhile, it is found that the high NH3 flow in the plasma enhanced chemical vapour deposition process could reduce the surface state and suppress the current collapse.
基金supported by the State Key Program and Major Program of National Natural Science Foundation of China (Grant Nos. 60736033 and 60890191)
文摘We present an AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MIS-HEMT） with an NbAIO high-k dielectric deposited by atomic layer deposition （ALD）. Surface morphology of samples are observed by atomic force microscopy （AFM）, indicating that the ALD NbA10 has an excellent-property surface. Moreover, the sharp transition from depletion to accumulation in capacitance voltage （C-V）curse of MIS-HEMT demonstrates the high quality bulk and interface properties of NbA10 on A1GaN. The fabricated MIS-HEMT with a gate length of 0.5 μm exhibits a maximum drain current of 960 mA/mm, and the reverse gate leakage current is almost 3 orders of magnitude lower than that of reference HEMT. Based on the improved direct-current operation, the NbA10 can be considered to be a potential gate oxide comparable to other dielectric insulators.
基金Supported by the National Natural Science Foundation of China under Grant No 60736033.
文摘The current slump of different recipes of SiN~ passivated AIGaN/GaN high electron mobility transistors （HEMTs） is investigated. The dc and pulsed current-voltage curves of AIGaN/GaN HEMTs using different recipes are analyzed. It is found that passivation leakage has a strong relationship with NH3 flow in the plasma-enhanced chemical vapor phase deposition process, which has impacted on the current collapse of SiNs passivated devices. We analyze the pulsed IDS -- VDS characteristics of different recipes of SiNx passivation devices for different combinations of gate and drain quiescent biases （VGso, VDSO） of （0, 0）, （-6, 0）, （-6, 15） and （0, 15）V. The possible mechanisms are the traps in SiNxpassivation capturing the electrons and the surface states at the SiNx/AIGaN interface, which can affect the channel of two-dimensional electron gas and cause the current collapse.
基金Supported by the Fundamental Research Funds for the Central Universities under Grant Nos JY10000904009 and K50510250006and the National Natural Science Foundation of China under Grant Nos 60736033 and 61106106.
文摘A GaN-based enhancement-mode(E-Mode)metal-insulator-semiconductor(MIS)high electron mobility transistor(HEMT)with a 2 nm/5 nm/1.5nm-thin GaN/AlGaN/AlN barrier is presented.We find that the formation of a two-dimensional electron gas(2DES)in the GaN/AlGaN/AlN/GaN heterostructure can be controlled by the presence of the plasma-enhanced chemical-vapor deposition(PECVD)Si_(3)N_(4) on the barrier layer,and the degree of decrease in sheet resistance R_(sh) is dependent on the Si_(3)N_(4) thickness.We choose 13 nm Si_(3)N_(4) as the gate insulator to decrease gate current and to improve the threshold voltage of devices.With selective etching of the passivation Si_(3)N_(4) under gate and over fluorine plasma treatment,the MIS-HEMT exhibits a high threshold voltage of 1.8 V.The maximum drain current Id,max and the maximum transconductance are 810 mA/mm and 190 mS/mm,respectively.The devices show a wide operation range of 4.5 V.
基金Supported by the National Natural Science Foundation of China under Grant No 60736033.
文摘A new multilayer-structured AlN/AlCaN/CaN heterostructure high-electron-mobility transistor （HEMT） is demonstrated. The AIN/AlCaN/CaN HEMT exhibits the maximum drain current density of 800mA/mm and the maximum extrinsic transconductance of 170 mS/mm. Due to the increase of the distance between the gate and the two-dimensional electron-gas channel, the threshold voltage shifts slightly to the negative. The reduced drain current collapse and higher breakdown voltage are observed on this AIN/AlGaN/CaN HEMT. The current gain cut-off frequency and the maximum frequency of oscillation are 18.5 CHz and 29.0 GHz, respectively.
