In the design realm of fusion power supplies,structural components play a pivotal role in ensuring the safety of fusion devices.To verify the reliability of the converter structure design at the Comprehensive Research...In the design realm of fusion power supplies,structural components play a pivotal role in ensuring the safety of fusion devices.To verify the reliability of the converter structure design at the Comprehensive Research Facility for Fusion Technology(CRAFT),meticulous analysis of the converter's dynamic impact is carefully performed based on the worst fault current(400k A),firstly.Subsequently,the thermal stress analysis based on the maximum allowable steadystate temperature is finished,and the equivalent thermal stress,thermal deformation,maximum shear stress of a single bridge arm and the whole converter are studied.Furthermore,a simple research method involving the current-sharing characteristics of a bridge arm with multithyristor parallel connection is proposed using a combination of Simplorer with Q3D in ANSYS.The results show that the current-sharing characteristics are excellent.Finally,the structural design has been meticulously tailored to meet the established requirements.展开更多
In this paper, we demonstrate that thermal stress is the main mechanism in the process of paint removal by Q-switched Nd：YAG laser （λ = 1064 nm, τ = 10 ns）. A theoretical model ofpaint removal by short-pulse lase...In this paper, we demonstrate that thermal stress is the main mechanism in the process of paint removal by Q-switched Nd：YAG laser （λ = 1064 nm, τ = 10 ns）. A theoretical model ofpaint removal by short-pulse laser is established from the perspective of thermal stress. Thermal stress is generated by thermal expansion, and the temperatures of different samples are calculated according to the one-dimensional （1D） heat conduction equation. The theoretical cleaning threshold can be obtained by comparing thermal stress with the adhesion of paint, and the theoretical damage threshold is obtained by calculating the temperature. Moreover, the theoretical calculations are verified by experimental results. It is shown that the thermal stress model of the laser cleaning is very useful to choose the appropriate laser fluence in the practical applications of paint removal by Q-switched Nd： YAG laser because our model can validly balance the efficiency of laser cleaning and the safety of the substrate.展开更多
Dry storage containers must be secured and reliable during long-term storage,and the effect of decay heat released from the internal spent fuel on the cask has become an important research topic.In this paper,a 3D com...Dry storage containers must be secured and reliable during long-term storage,and the effect of decay heat released from the internal spent fuel on the cask has become an important research topic.In this paper,a 3D computational fluid dynamics model is presented,and the accuracy of the calculation is verified,with computational errors of less than 6.2%.The thermal stress of the dry storage cask was estimated by coupling it with a transient temperature field.The total power remained constant and adjusting the power ratio of the inner and outer zones had a small effect on the stress results,with a maximum equivalent stress of approximately 5.2 kPa,which occurred at the lower edge of the shell.In the case of tilt,the temperature gradient varied in a wavy distribution,and the wave crest moved from right to left.Altering the tilt angle affects the air distribution in the annular gap,leading to the shell temperature being transformed,with a maximum equivalent stress of 202 MPa at the bottom of the shell.However,the equivalent stress in both cases was less than the yield stress(205 MPa).展开更多
Chemical vapor deposition-tungsten （CVD-W） coating covering the surface of the plasma facing component （PFC） is an effective method to implement the tungsten material as plasma facing material （PFM） in fusion de...Chemical vapor deposition-tungsten （CVD-W） coating covering the surface of the plasma facing component （PFC） is an effective method to implement the tungsten material as plasma facing material （PFM） in fusion devices. Residual thermal stress in CVD-W coating due to thermal mismatch between coating and substrate was successfully simulated by using a finite element method （ANSYS 10.0 code）. The deposition parametric effects, i.e., coating thickness and deposition temperature, and interlayer were investigated to get a description of the residual thermal stress in the CVD-W coating-substrate system. And the influence of the substrate materials on the generation of residual thermal stress in the CVD-W coating was analyzed with respect to the CVD-W coating application as PFM. This analysis is beneficial for the preparation and application of CVD-W coating.展开更多
The thermal expansion strain is considered as a special case of eigenstrain.The authors proved the theorem on decomposition of eigenstrain existing in a body into two constituents:Impotent eigenstrain(not causing stre...The thermal expansion strain is considered as a special case of eigenstrain.The authors proved the theorem on decomposition of eigenstrain existing in a body into two constituents:Impotent eigenstrain(not causing stress in any point of a body)and nilpotent eigenstrain(not causing strain in any point of a body).According to this theorem,the thermal stress can be easily found through the nilpotent eigenstrain.If the eigenstrain is an impotent one,the thermal stress vanishes.In this case,the eigenstrain must be compatible.The authors suggest a new approach to measure of eigenstrain incompatibility and hence to estimate of thermal stresses.展开更多
Heat-ray absorbing film is used to be bonded on the existing sheet glasses of the windows.It is effective for air-conditioning energy saving against the global warming,because it absorbs heat-ray in the thin film and ...Heat-ray absorbing film is used to be bonded on the existing sheet glasses of the windows.It is effective for air-conditioning energy saving against the global warming,because it absorbs heat-ray in the thin film and decreases the incoming heat-ray into the room.On the other hand,the sheet glasses increase the temperature at the surface which the sheet is bonded and sometimes yield heat cracks by thermal stresses.It is important to know the state of thermal stresses accurately in order to develop the heat-ray absorbing film with higher performance and without heat cracks.In this paper,the analysis model is treated as the two-layer plate of the conventional soda sheet glass and the heat-ray absorbing film with different absorptivities.The unsteady temperature and thermal stresses are analyzed and calculated numerically.The influence of the patch side,which the heat-ray absorbing film is bonded at the exterior side or the interior side,on the heat-ray absorbing performance and the thermal stresses is discussed.It is found that the alternative patch side has no effect on the heat-ray absorbing performance and that the patch side is recommended to be interior side from a view point of decreasing thermal stresses against the heat crack of glasses.展开更多
The thermal boundary condition has very important effects on the accuracy of thermal stress calculation of a water-cooled W/Cu divertor. In this paper, phase-change heat transfer was simulated based on the Euler homog...The thermal boundary condition has very important effects on the accuracy of thermal stress calculation of a water-cooled W/Cu divertor. In this paper, phase-change heat transfer was simulated based on the Euler homogeneous phase model, and local differences of liquid physical properties were considered under one-sided high heating conditions. The steady-state temperature field and thermal stress field under nonuniform thermal boundary conditions were obtained through numerical calculation. By comparison with the case of traditional uniform thermal boundary conditions, the results show that the distribution of thermal stress under nonuniform thermal boundary conditions exhibits tbe same trend as that under uniform thermal boundary conditions, but is larger in value. The maximum difference of maximum von Mises stress is up to 42% under the highest heating conditions. These results provide a valuable reference for the thermal stress caleulat.ion of water-cooled W/Cu divertors.展开更多
Ni Schottky contacts on A1GaN/GaN heterostructures have been fabricated. The samples are then thermally treated in a furnace with N2 ambient at 600℃ for different times （0.5, 4.5, 10.5, 18, 33, 48 and 72 h）. Curren...Ni Schottky contacts on A1GaN/GaN heterostructures have been fabricated. The samples are then thermally treated in a furnace with N2 ambient at 600℃ for different times （0.5, 4.5, 10.5, 18, 33, 48 and 72 h）. Current-voltage （I-V） and capacitance-voltage （C-V） relationships are measured, and SchrSdinger＇s and Poisson＇s equations are self- consistently solved to obtain the characteristic parameters related to A1GaN/GaN heterostructure $chottky contacts： the two-dimensional electron gas （2DEG） sheet density, the polarization sheet charge density, the 2DEG distribution in the triangle quantum well and the Schottky barrier height for each thermal stressing time. Most of the above parameters reduce with the increase of stressing time, only the parameter of the average distance of the 2DEG from the A1CaN/GaN interface increases with the increase of thermal stressing time. The changes of the characteristic parameters can be divided into two stages. In the first stage the strain in the A1GaN barrier layer is present. In this stage the characteristic parameters change rapidly compared with those in the second stage in which the AlGaN barrier layer is relaxed and no strain is present.展开更多
Catastrophic degradation of high power laser diodes is due to the generation of extended defects inside the active parts of the laser structure during the laser operation.The mechanism driving the degradation is stron...Catastrophic degradation of high power laser diodes is due to the generation of extended defects inside the active parts of the laser structure during the laser operation.The mechanism driving the degradation is strongly related to the existence of localized thermal stresses generated during the laser operation.These thermal stresses can overcome the yield strength of the materials forming the active part of the laser diode.Different factors contribute to reduce the laser power threshold for degradation.Among them the thermal transport across the laser structure constitutes a critical issue for the reliability of the device.展开更多
The process of thermal stress damage during 1080 nm laser ablation of single-crystal germanium was recorded in real time using a high-speed charge-coupled device.A three-dimensional finite element numerical model base...The process of thermal stress damage during 1080 nm laser ablation of single-crystal germanium was recorded in real time using a high-speed charge-coupled device.A three-dimensional finite element numerical model based on Fourier's heat conduction equation,Hooke's law and the Alexander–Hasson equation was developed to analyze the thermal stress damage mechanism involved.The damage morphology of the ablated samples was observed using an optical microscope.The results show that the cooling process has an important influence on fracture in the laser-irradiated region of single-crystal germanium.Fracture is the result of a combination of thermal stress and reduction in local yield strength.展开更多
We investigate the thermal stresses for GaAs layers grown on V-groove patterned Si substrates by the finite-element method. The results show that the thermal stress distribution near the interface in a patterned subst...We investigate the thermal stresses for GaAs layers grown on V-groove patterned Si substrates by the finite-element method. The results show that the thermal stress distribution near the interface in a patterned substrate is nonuniform,which is far different from that in a planar substrate. Comparing with the planar substrate, the thermal stress is significantly reduced for the Ga As layer on the patterned substrate. The effects of the width of the V-groove, the thickness, and the width of the SiO_(2) mask on the thermal stress are studied. It is found that the SiO_(2) mask and V-groove play a crucial role in the stress of the Ga As layer on Si substrate. The results indicate that when the width of V-groove is 50 nm, the width and the thickness of the SiO_(2) mask are both 100 nm, the Ga As layer is subjected to the minimum stress. Furthermore,Comparing with the planar substrate, the average stress of the Ga As epitaxial layer in the growth window region of the patterned substrate is reduced by 90%. These findings are useful in the optimal designing of growing high-quality Ga As films on patterned Si substrates.展开更多
Heat-ray absorbing sheet glass can decrease electric energy used for air-conditioning by controling the incoming heat-ray through windows into the rooms.On the other hand,the glasses increase the temperature and somet...Heat-ray absorbing sheet glass can decrease electric energy used for air-conditioning by controling the incoming heat-ray through windows into the rooms.On the other hand,the glasses increase the temperature and sometimes yield heat cracks by thermal stresses.It is important to know the state of thermal stress accurately in order to develop heat-ray absorbing sheet glasses with higher performance and without heat cracks.A conventional design manual at field site treats the steady state and the thermal boundary condition that all heat-rays are absorbed at glass surface.In this paper,it is assumed that the heat-ray is absorbed over all the plate thickness.The idea of the local absorptibity per unit length is introduced.The modeling of internal heat absorbing process is proposed.It can explain well that the total absorptivity depends on the plate thickness.The temperature and the thermal stresses are calculated and discussed.Sudden weather changes such as rain and/or wind after the glass is heated to be steady state are also discussed.Those weather changes are treated with the change of amount of absorbed heat-ray and/or the change of heat transfer coefficient between the glass surface and the outside atmosphere.展开更多
The thermal stress in a magnetic core–shell nanoparticle during a thermal process is an important parameter to be known and controlled in the magnetization process of the core–shell system. In this paper we analyze ...The thermal stress in a magnetic core–shell nanoparticle during a thermal process is an important parameter to be known and controlled in the magnetization process of the core–shell system. In this paper we analyze the stress that appears in a core–shell nanoparticle subjected to a cooling process. The external surface temperature of the system, considered in equilibrium at room temperature, is instantly reduced to a target temperature. The thermal evolution of the system in time and the induced stress are studied using an analytical model based on a time-dependent heat conduction equation and a differential displacement equation in the formalism of elastic displacements. The source of internal stress is the difference in contraction between core and shell materials due to the temperature change. The thermal stress decreases in time and is minimized when the system reaches the thermal equilibrium. The radial and azimuthal stress components depend on system geometry, material properties, and initial and final temperatures. The magnitude of the stress changes the magnetic state of the core–shell system. For some materials, the values of the thermal stresses are larger than their specific elastic limits and the materials begin to deform plastically in the cooling process. The presence of the induced anisotropy due to the plastic deformation modifies the magnetic domain structure and the magnetic behavior of the system.展开更多
Using molecular dynamics （MD） simulation, we study the thermal shock behavior of tungsten （W）, which has been used for the plasma facing material （PFM） of tokamaks. The thermo-elastic stress wave, corresponding ...Using molecular dynamics （MD） simulation, we study the thermal shock behavior of tungsten （W）, which has been used for the plasma facing material （PFM） of tokamaks. The thermo-elastic stress wave, corresponding to the collective displacement of atoms, is analyzed with the Lagrangian atomic stress method, of which the reliability is also analyzed. The stress wave velocity corresponds to the speed of sound in the material, which is not dependent on the thermal shock energy. The peak pressure of a normal stress wave increases with the increase of thermal shock energy. We analyze the temperature evolution of the thermal shock region according to the Fourier transformation. It can be seen that the “obvious” velocity of heat propagation is less than the velocity of the stress wave; further, that the thermo-elastic stress wave may contribute little to the transport of kinetic energy. The heat propagation can be described properly by the heat conduction equation. These results may be useful for understanding the process of the thermal shock of tungsten.展开更多
Running composite insulators are prone to failure due to their harsh surrounding work environment, which directly affects the safe operation of transmission lines. This paper puts forward the method of using fiber Bra...Running composite insulators are prone to failure due to their harsh surrounding work environment, which directly affects the safe operation of transmission lines. This paper puts forward the method of using fiber Bragg grating(FBG) as the monitors to parameters correlated with thermal and stress of the composite insulators in transmission lines at working status. Firstly, monitoring points are found out by the mechanical test on composite insulator samples. Secondly, based on the monitoring theory, this paper introduces the feasibility design frame of the composite insulator with FBG implanted in the rod and the online monitor system. At last, it describes applications of this monitor system in the field of transmission lines.展开更多
We present an accurate through silicon via （TSV） thermal mechanical stress analytical model which is verified by using finite element method （FEM）. The results show only a very small error. By using the proposed a...We present an accurate through silicon via （TSV） thermal mechanical stress analytical model which is verified by using finite element method （FEM）. The results show only a very small error. By using the proposed analytical model, we also study the impacts of the TSV radius size, the thickness, the material of Cu diffusion barrier, and liner on the stress. It is found that the liner can absorb the stress effectively induced by coefficient of thermal expansion mismatch. The stress decreases with the increase of liner thickness. Benzocyclobutene （BCB） as a liner material is better than SiO2. However, the Cu diffusion barrier has little effect on the stress. The stress with a smaller TSV has a smaller value. Based on the analytical model, we explore and validate the linear superposition principle of stress tensors and demonstrate the accuracy of this method against detailed FEM simulations. The analytic solutions of stress of two TSVs and three TSVs have high precision against the finite element result.展开更多
This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μm×100μm, is deposited on the top of a ...This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μm×100μm, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200μm×200μm×400μm, is placed between the silicon nitride diaphragm and glass （Corning 7740）. This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.展开更多
基金supported by the Talent Research Fund of Hefei University(No.21-22RC09)National Natural Science Foundation of China(No.U22A20225)。
文摘In the design realm of fusion power supplies,structural components play a pivotal role in ensuring the safety of fusion devices.To verify the reliability of the converter structure design at the Comprehensive Research Facility for Fusion Technology(CRAFT),meticulous analysis of the converter's dynamic impact is carefully performed based on the worst fault current(400k A),firstly.Subsequently,the thermal stress analysis based on the maximum allowable steadystate temperature is finished,and the equivalent thermal stress,thermal deformation,maximum shear stress of a single bridge arm and the whole converter are studied.Furthermore,a simple research method involving the current-sharing characteristics of a bridge arm with multithyristor parallel connection is proposed using a combination of Simplorer with Q3D in ANSYS.The results show that the current-sharing characteristics are excellent.Finally,the structural design has been meticulously tailored to meet the established requirements.
基金supported by the National Natural Science Foundation of China(Grant No.61067002)the Foundation for Department of Education of Jiangxi Province,China(Grant No.GJJ12581)+1 种基金the Natural Science Foundation of Jiangxi Province,China(Grant No.20132BAB212008)the Foundation for GannanNormal University,China(Grant No.11kyz12)
文摘In this paper, we demonstrate that thermal stress is the main mechanism in the process of paint removal by Q-switched Nd：YAG laser （λ = 1064 nm, τ = 10 ns）. A theoretical model ofpaint removal by short-pulse laser is established from the perspective of thermal stress. Thermal stress is generated by thermal expansion, and the temperatures of different samples are calculated according to the one-dimensional （1D） heat conduction equation. The theoretical cleaning threshold can be obtained by comparing thermal stress with the adhesion of paint, and the theoretical damage threshold is obtained by calculating the temperature. Moreover, the theoretical calculations are verified by experimental results. It is shown that the thermal stress model of the laser cleaning is very useful to choose the appropriate laser fluence in the practical applications of paint removal by Q-switched Nd： YAG laser because our model can validly balance the efficiency of laser cleaning and the safety of the substrate.
基金the High-Performance Computing Center of Nanjing Tech University for supporting the computational resources
文摘Dry storage containers must be secured and reliable during long-term storage,and the effect of decay heat released from the internal spent fuel on the cask has become an important research topic.In this paper,a 3D computational fluid dynamics model is presented,and the accuracy of the calculation is verified,with computational errors of less than 6.2%.The thermal stress of the dry storage cask was estimated by coupling it with a transient temperature field.The total power remained constant and adjusting the power ratio of the inner and outer zones had a small effect on the stress results,with a maximum equivalent stress of approximately 5.2 kPa,which occurred at the lower edge of the shell.In the case of tilt,the temperature gradient varied in a wavy distribution,and the wave crest moved from right to left.Altering the tilt angle affects the air distribution in the annular gap,leading to the shell temperature being transformed,with a maximum equivalent stress of 202 MPa at the bottom of the shell.However,the equivalent stress in both cases was less than the yield stress(205 MPa).
基金supported by the Key Project of Chinese Academy of Sciences(No.KJCX2-YW-N35)National Natural Science Foundation of China(No.11175205)
文摘Chemical vapor deposition-tungsten （CVD-W） coating covering the surface of the plasma facing component （PFC） is an effective method to implement the tungsten material as plasma facing material （PFM） in fusion devices. Residual thermal stress in CVD-W coating due to thermal mismatch between coating and substrate was successfully simulated by using a finite element method （ANSYS 10.0 code）. The deposition parametric effects, i.e., coating thickness and deposition temperature, and interlayer were investigated to get a description of the residual thermal stress in the CVD-W coating-substrate system. And the influence of the substrate materials on the generation of residual thermal stress in the CVD-W coating was analyzed with respect to the CVD-W coating application as PFM. This analysis is beneficial for the preparation and application of CVD-W coating.
文摘The thermal expansion strain is considered as a special case of eigenstrain.The authors proved the theorem on decomposition of eigenstrain existing in a body into two constituents:Impotent eigenstrain(not causing stress in any point of a body)and nilpotent eigenstrain(not causing strain in any point of a body).According to this theorem,the thermal stress can be easily found through the nilpotent eigenstrain.If the eigenstrain is an impotent one,the thermal stress vanishes.In this case,the eigenstrain must be compatible.The authors suggest a new approach to measure of eigenstrain incompatibility and hence to estimate of thermal stresses.
文摘Heat-ray absorbing film is used to be bonded on the existing sheet glasses of the windows.It is effective for air-conditioning energy saving against the global warming,because it absorbs heat-ray in the thin film and decreases the incoming heat-ray into the room.On the other hand,the sheet glasses increase the temperature at the surface which the sheet is bonded and sometimes yield heat cracks by thermal stresses.It is important to know the state of thermal stresses accurately in order to develop the heat-ray absorbing film with higher performance and without heat cracks.In this paper,the analysis model is treated as the two-layer plate of the conventional soda sheet glass and the heat-ray absorbing film with different absorptivities.The unsteady temperature and thermal stresses are analyzed and calculated numerically.The influence of the patch side,which the heat-ray absorbing film is bonded at the exterior side or the interior side,on the heat-ray absorbing performance and the thermal stresses is discussed.It is found that the alternative patch side has no effect on the heat-ray absorbing performance and that the patch side is recommended to be interior side from a view point of decreasing thermal stresses against the heat crack of glasses.
基金supported by National Magnetic Confinement Fusion Science Program of China(No.2010GB104005)
文摘The thermal boundary condition has very important effects on the accuracy of thermal stress calculation of a water-cooled W/Cu divertor. In this paper, phase-change heat transfer was simulated based on the Euler homogeneous phase model, and local differences of liquid physical properties were considered under one-sided high heating conditions. The steady-state temperature field and thermal stress field under nonuniform thermal boundary conditions were obtained through numerical calculation. By comparison with the case of traditional uniform thermal boundary conditions, the results show that the distribution of thermal stress under nonuniform thermal boundary conditions exhibits tbe same trend as that under uniform thermal boundary conditions, but is larger in value. The maximum difference of maximum von Mises stress is up to 42% under the highest heating conditions. These results provide a valuable reference for the thermal stress caleulat.ion of water-cooled W/Cu divertors.
基金supported by the National Natural Science Foundation of China (Grant No.10774090)the National Basic Research Program of China (Grant No.2007CB936602)
文摘Ni Schottky contacts on A1GaN/GaN heterostructures have been fabricated. The samples are then thermally treated in a furnace with N2 ambient at 600℃ for different times （0.5, 4.5, 10.5, 18, 33, 48 and 72 h）. Current-voltage （I-V） and capacitance-voltage （C-V） relationships are measured, and SchrSdinger＇s and Poisson＇s equations are self- consistently solved to obtain the characteristic parameters related to A1GaN/GaN heterostructure $chottky contacts： the two-dimensional electron gas （2DEG） sheet density, the polarization sheet charge density, the 2DEG distribution in the triangle quantum well and the Schottky barrier height for each thermal stressing time. Most of the above parameters reduce with the increase of stressing time, only the parameter of the average distance of the 2DEG from the A1CaN/GaN interface increases with the increase of thermal stressing time. The changes of the characteristic parameters can be divided into two stages. In the first stage the strain in the A1GaN barrier layer is present. In this stage the characteristic parameters change rapidly compared with those in the second stage in which the AlGaN barrier layer is relaxed and no strain is present.
基金funded by the Spanish Government(MAT-2010-20441-C02)
文摘Catastrophic degradation of high power laser diodes is due to the generation of extended defects inside the active parts of the laser structure during the laser operation.The mechanism driving the degradation is strongly related to the existence of localized thermal stresses generated during the laser operation.These thermal stresses can overcome the yield strength of the materials forming the active part of the laser diode.Different factors contribute to reduce the laser power threshold for degradation.Among them the thermal transport across the laser structure constitutes a critical issue for the reliability of the device.
文摘The process of thermal stress damage during 1080 nm laser ablation of single-crystal germanium was recorded in real time using a high-speed charge-coupled device.A three-dimensional finite element numerical model based on Fourier's heat conduction equation,Hooke's law and the Alexander–Hasson equation was developed to analyze the thermal stress damage mechanism involved.The damage morphology of the ablated samples was observed using an optical microscope.The results show that the cooling process has an important influence on fracture in the laser-irradiated region of single-crystal germanium.Fracture is the result of a combination of thermal stress and reduction in local yield strength.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61874148,61974141,and 61674020)the Beijing Natural Science Foundation,China(Grant No.4192043)+1 种基金the State Key Laboratory of Information Photonics and Optical Communications(Beijing University of Posts and Telecommunications),China(Grant No.IPOC2018ZT01)the 111 Project of China(Grant No.B07005)。
文摘We investigate the thermal stresses for GaAs layers grown on V-groove patterned Si substrates by the finite-element method. The results show that the thermal stress distribution near the interface in a patterned substrate is nonuniform,which is far different from that in a planar substrate. Comparing with the planar substrate, the thermal stress is significantly reduced for the Ga As layer on the patterned substrate. The effects of the width of the V-groove, the thickness, and the width of the SiO_(2) mask on the thermal stress are studied. It is found that the SiO_(2) mask and V-groove play a crucial role in the stress of the Ga As layer on Si substrate. The results indicate that when the width of V-groove is 50 nm, the width and the thickness of the SiO_(2) mask are both 100 nm, the Ga As layer is subjected to the minimum stress. Furthermore,Comparing with the planar substrate, the average stress of the Ga As epitaxial layer in the growth window region of the patterned substrate is reduced by 90%. These findings are useful in the optimal designing of growing high-quality Ga As films on patterned Si substrates.
文摘Heat-ray absorbing sheet glass can decrease electric energy used for air-conditioning by controling the incoming heat-ray through windows into the rooms.On the other hand,the glasses increase the temperature and sometimes yield heat cracks by thermal stresses.It is important to know the state of thermal stress accurately in order to develop heat-ray absorbing sheet glasses with higher performance and without heat cracks.A conventional design manual at field site treats the steady state and the thermal boundary condition that all heat-rays are absorbed at glass surface.In this paper,it is assumed that the heat-ray is absorbed over all the plate thickness.The idea of the local absorptibity per unit length is introduced.The modeling of internal heat absorbing process is proposed.It can explain well that the total absorptivity depends on the plate thickness.The temperature and the thermal stresses are calculated and discussed.Sudden weather changes such as rain and/or wind after the glass is heated to be steady state are also discussed.Those weather changes are treated with the change of amount of absorbed heat-ray and/or the change of heat transfer coefficient between the glass surface and the outside atmosphere.
基金Project supported by Romanian CNCS–UEFISCDI project IDEI-EXOTIC(Grant No.185/25.10.2011)
文摘The thermal stress in a magnetic core–shell nanoparticle during a thermal process is an important parameter to be known and controlled in the magnetization process of the core–shell system. In this paper we analyze the stress that appears in a core–shell nanoparticle subjected to a cooling process. The external surface temperature of the system, considered in equilibrium at room temperature, is instantly reduced to a target temperature. The thermal evolution of the system in time and the induced stress are studied using an analytical model based on a time-dependent heat conduction equation and a differential displacement equation in the formalism of elastic displacements. The source of internal stress is the difference in contraction between core and shell materials due to the temperature change. The thermal stress decreases in time and is minimized when the system reaches the thermal equilibrium. The radial and azimuthal stress components depend on system geometry, material properties, and initial and final temperatures. The magnitude of the stress changes the magnetic state of the core–shell system. For some materials, the values of the thermal stresses are larger than their specific elastic limits and the materials begin to deform plastically in the cooling process. The presence of the induced anisotropy due to the plastic deformation modifies the magnetic domain structure and the magnetic behavior of the system.
基金Project supported by the National Magnetic Confinement Fusion Science Program of China(Grant No.2013GB109004)the National Natural Science Foundation of China(Grant Nos.51071095 and 50971077)
文摘Using molecular dynamics （MD） simulation, we study the thermal shock behavior of tungsten （W）, which has been used for the plasma facing material （PFM） of tokamaks. The thermo-elastic stress wave, corresponding to the collective displacement of atoms, is analyzed with the Lagrangian atomic stress method, of which the reliability is also analyzed. The stress wave velocity corresponds to the speed of sound in the material, which is not dependent on the thermal shock energy. The peak pressure of a normal stress wave increases with the increase of thermal shock energy. We analyze the temperature evolution of the thermal shock region according to the Fourier transformation. It can be seen that the “obvious” velocity of heat propagation is less than the velocity of the stress wave; further, that the thermo-elastic stress wave may contribute little to the transport of kinetic energy. The heat propagation can be described properly by the heat conduction equation. These results may be useful for understanding the process of the thermal shock of tungsten.
基金supported by National High-tech Research and Development Program of China (863 Program) (2013AA030701)Science and Technology Project of the State Grid Xinjiang Electric Power Corporation (5230DK15009L)
文摘Running composite insulators are prone to failure due to their harsh surrounding work environment, which directly affects the safe operation of transmission lines. This paper puts forward the method of using fiber Bragg grating(FBG) as the monitors to parameters correlated with thermal and stress of the composite insulators in transmission lines at working status. Firstly, monitoring points are found out by the mechanical test on composite insulator samples. Secondly, based on the monitoring theory, this paper introduces the feasibility design frame of the composite insulator with FBG implanted in the rod and the online monitor system. At last, it describes applications of this monitor system in the field of transmission lines.
基金supported by the National Natural Science Foundation of China(Grant No.61334003)the Kunshan Innovation Institute of Xidian University
文摘We present an accurate through silicon via （TSV） thermal mechanical stress analytical model which is verified by using finite element method （FEM）. The results show only a very small error. By using the proposed analytical model, we also study the impacts of the TSV radius size, the thickness, the material of Cu diffusion barrier, and liner on the stress. It is found that the liner can absorb the stress effectively induced by coefficient of thermal expansion mismatch. The stress decreases with the increase of liner thickness. Benzocyclobutene （BCB） as a liner material is better than SiO2. However, the Cu diffusion barrier has little effect on the stress. The stress with a smaller TSV has a smaller value. Based on the analytical model, we explore and validate the linear superposition principle of stress tensors and demonstrate the accuracy of this method against detailed FEM simulations. The analytic solutions of stress of two TSVs and three TSVs have high precision against the finite element result.
基金Project supported by the National Natural Science Foundation of China (Grant No 60576053)Technology Innovation of Chinese Academy of Sciences (Grant No CXJJ-176)
文摘This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μm×100μm, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200μm×200μm×400μm, is placed between the silicon nitride diaphragm and glass （Corning 7740）. This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.
