摘要
【目的】光纤传感器有着尺寸小、重量轻和抗电磁干扰等优点,在电力系统中应用广泛。文章针对电流互感器检定装置可动触头的温度检测需求,提出了一种光纤引线封装设计及其理论模型和光纤布拉格光栅(FBG)温度传感器。【方法】文章通过毛细铜管封装光纤串上的一对FBG,实现单传感器对两个触头的温度测量。设计了螺旋线-直线-螺旋线的结构封装光纤引线,在满足检定装置触头在工作时的位移的同时减小了光纤的弯曲损耗。利用ANSYS有限元分析软件对封装后的光纤引线变形进行了仿真分析,并建立了螺旋线光纤弯曲损耗数学模型,利用模型计算对不同高度下的螺旋线结构进行了设计优化。同时搭建了弯曲损耗实验平台对折射率突变型单模光纤在不同弯曲半径下的强度损耗进行了标定;搭建了温度实验平台对传感器的温度特性进行了测试验证。【结果】实验结果表明,当触头工作位移10 mm时,理论计算得到该光纤封装结构的弯曲损耗为0.066 dB,与实验测量值误差为3.1%,该封装结构的弯曲损耗小。使用毛细铜管封装后,两FBG在0~100℃的温度灵敏度分别为12.50和12.26 pm/℃;曲率半径的平方R^(2)分别为99.97%和99.96%,线性度良好;两FBG的温度响应速度分别为0.84和0.82 s,响应速度快。【结论】文章提出了一种用于可动触点的光纤封装结构及其数学模型,该结构为光纤传感器在复杂电磁环境中的温度测量提供了新的布设方案。
【Objective】Optical fiber sensors,featuring compact size,lightweight design,and electromagnetic interference immunity,show significant potential in power system applications.To meet the temperature-monitoring requirement for the movable contacts of a current-transformer calibration device,the paper proposes a fiber-lead encapsulation design,its theoretical model,and a Fiber Bragg Grating(FBG)temperature sensor.【Methods】A paired FBG configuration is implemented using capillary copper tube encapsulation,enabling single-sensor dual-contact temperature measurement.A helix-straight-helix structural encapsulation is designed for fiber leads to accommodate contact displacement(up to 10 mm)while minimizing the bending losses.ANSYS finite-element software is employed to simulate the deformation of the encapsulated fiber,and a mathematical model of bending loss in the spiral section is established to optimize the spiral geometry at different heights.A bending-loss testbed is built to calibrate the intensity loss of step-index single-mode fiber under various bend radii,and a temperature testbed is constructed to characterize the sensor’s thermal response.【Results】At 10 mm contact displacement,the theoretical bending loss of 0.066 dB show a 3.1%deviation from experimental measurements,confirming the low-loss performance.The capillary-encapsulated FBGs demonstrate temperature sensitivities of 12.50 and 12.26 pm/℃within 0~100℃,with R^(2)values of 99.97%and 99.96%,respectively,indicating excellent linearity.Rapid response times of 0.84 and 0.82 s are achieved.【Conclusion】A novel fiber encapsulation structure and its mathematical model are developed,providing an innovative deployment solution for temperature sensing in complex electromagnetic environments.This design enhances the practicality of FBG sensors in high-voltage electrical equipment monitoring.
作者
万家乐
杨艳
刘胜男
潘玖庆
史会轩
WAN Jiale;YANG Yan;LIU Shengnan;PAN Jiuqing;SHI Huixuan(Wuhan Nari Limited Liability Company of State Grid Electric Power Research Institute,Wuhan 430206,China;State Grid Electric Power Research Institute,Nanjing 211100,China;State Grid Qinghai Electric Power Company,Xining 810000,China)
出处
《光通信研究》
2025年第5期68-74,共7页
Study on Optical Communications
基金
国家电网有限公司总部科技资助项目(5700-202334283A-1-1-ZN)。
关键词
光纤封装
弯曲损耗
温度传感器
仿真
fiber encapsulation
bending loss
temperature sensor
simulation
作者简介
万家乐(1991-),男,湖北武汉人。高级工程师,硕士,主要研究方向为计量自动化和光纤传感技术;通信作者:万家乐,高级工程师。E-mail:3560171840@qq.com。
