摘要
为了提高复合材料的层间结合性能,满足其三维力学性能可设计性的要求,提出了嵌入式共固化缝合阻尼复合材料结构,开发了嵌入式共固化缝合阻尼复合材料的制作工艺,其中阻尼材料的硫化温度和时间与预浸料内树脂的固化温度和时间相同。采用改进的锁式缝合方法缝合铺层后的预成型体,使用热压罐制备出嵌入式共固化缝合阻尼复合材料试件。对试件进行了层间剪切试验、自由衰减试验、拉伸破坏试验,结果表明:阻尼性能与最大拉伸力随着针距的增大而增大,层间结合性能随针距的增大而变差。其中,在阻尼层厚度为0.1 mm的情况下,改变针距,缝合后材料的相对阻尼比为2.16%~2.92%,拉伸强度为412.9~427.4 MPa,层间结合强度为6.12~7.91 MPa。该研究可为对三向力学性能有要求的复杂受载大阻尼复合材料构件的广泛应用提供参考。
To improve the interlayer bonding performance and meet the design requirements of 3D mechanical properties of composite materials,an embedded co-cured stitched damping structure was presented.The fabrication process of the embedded co-cured stitched damping composites was developed.The vulcanization temperature and time of the damping material were the same as the curing temperature and time of the resin in the prepreg.The preformed structure was stitched by using an improved lock stitching method,and then the embedded co-cured stitched damping composite specimens were finally prepared in autoclave.Free decay test,interlaminar shear test and tensile test were conducted on the specimens.The results showed that the damping performance and maximum tensile stress were increased but the interlayer bonding performance was decreased with the increase of the stitch length.When the damping layer thickness was 0.1 mm and stitch length was changed,the damping ratio,tensile strength and interlayer bonding stress of the stitched structure were in the ranges from 2.16%to 2.92%,from 412.9 to 427.4 MPa,and from 6.12 to 7.91 MPa,respectively.This study may provide a basis for wide application of complexly stressed large damping composite component with three-dimensional mechanical property requirement.
作者
闫盛宇
梁森
郑长升
陈新乐
王玲
YAN Shengyu;LIANG Sen;ZHENG Changsheng;CHEN Xinle;WANG Ling(School of Mechanical Engineering,Qingdao University of Technology,Qingdao,Shandong 266520,China)
出处
《西安交通大学学报》
EI
CAS
CSCD
北大核心
2019年第11期96-100,共5页
Journal of Xi'an Jiaotong University
基金
国家自然科学基金资助项目(51375248)
山东省自然科学基金资助项目(ZR2019MEE088)
关键词
缝合阻尼复合材料
层间结合性能
阻尼性能
stitched damping composite
interlaminar bonding performance
damping performance
作者简介
闫盛宇(1994—),男,硕士生;通信作者:梁森,男,教授,博士生导师。
