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分子动力学法研究铜-SAM-环氧树脂界面的粘结性能 被引量:1

Molecular Dynamics Simulation of Adhesion Properties of Cu-SAM-epoxy Interface
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摘要 采用分子动力学法研究了自组装单分子膜粘结剂(SAMY和SAMN)对铜/环氧树脂界面相互作用能的改造,并考虑环氧树脂交联程度、环境温度和吸湿量的影响。结果表明,与环氧树脂形成化学键的自组装单分子膜SAMY能够加强铜与环氧树脂间的粘结作用,而不与环氧树脂形成化学键的SAMN则减弱了铜与环氧树脂间的粘结作用;同时,温度升高、含湿量增加均会导致界面粘结强度降低;交联度增大,使含SAMY的界面相互作用能降低,而含SAMN的界面相互作用能几乎不受影响。 Two kinds of self-assembly monolayers(SAMs),SAMY and SAMN,were added to Cu-epoxy interface and the effects of temperature,moisture and crosslink conversion on the modified interfaces were investigated with molecular dynamics(MD)simulation.Covalent bonds between SAMY and epoxy enhance the interfacial adhesion of Cu-epoxy.However,the non-bond interactions of SAMN and epoxy resin weaken the interfacial adhesion.In addition,the results show that high temperature and high moisture content will weaken the interfacial adhesion.And the interfacial interaction energy of the systems with SAMY increases with the decreasing crosslink conversion,while that of the systems containing SAMN is reluctant to the crosslink conversion.
作者 辛东嵘 张阳 XIN Dongrong;ZHANG Yang(Fujian Provincial Key Laboratory of Advanced Technology and Informatization in Civil Engineering,Fujian university of technology,Fuzhou 350118,China;School of Civil Engineering and Transportation,Fujian university of technology,Fuzhou 350118,China)
出处 《材料科学与工程学报》 CAS CSCD 北大核心 2019年第2期215-218,共4页 Journal of Materials Science and Engineering
基金 国家自然科学基金资助项目(11402164) 福建省自然科学基金资助项目(2015J05001 2019J01781) 福建工程学院科研启动基金资助项目(GY-Z14070)
关键词 材料界面 相互作用能 分子动力学 高温高湿 interface interaction energy molecular dynamics hot and humid environment
作者简介 辛东嵘(1986-),博士,副教授,主要从事微纳米力学的研究。E-mail:drxin@fjut.edu.cn。
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